NL8800902A - Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager. - Google Patents

Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager. Download PDF

Info

Publication number
NL8800902A
NL8800902A NL8800902A NL8800902A NL8800902A NL 8800902 A NL8800902 A NL 8800902A NL 8800902 A NL8800902 A NL 8800902A NL 8800902 A NL8800902 A NL 8800902A NL 8800902 A NL8800902 A NL 8800902A
Authority
NL
Netherlands
Prior art keywords
semiconductor body
support
applying
carrier
aluminum layer
Prior art date
Application number
NL8800902A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8800902A priority Critical patent/NL8800902A/nl
Priority to US07/326,583 priority patent/US4961528A/en
Priority to DE68926754T priority patent/DE68926754T2/de
Priority to EP89200843A priority patent/EP0336514B1/de
Priority to JP1084912A priority patent/JP2697890B2/ja
Publication of NL8800902A publication Critical patent/NL8800902A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Coating By Spraying Or Casting (AREA)
NL8800902A 1988-04-08 1988-04-08 Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager. NL8800902A (nl)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL8800902A NL8800902A (nl) 1988-04-08 1988-04-08 Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.
US07/326,583 US4961528A (en) 1988-04-08 1989-03-21 Method of providing a semiconductor body on a support
DE68926754T DE68926754T2 (de) 1988-04-08 1989-04-03 Verfahren zum Anordnen eines Halbleiterkörpers auf einem Träger
EP89200843A EP0336514B1 (de) 1988-04-08 1989-04-03 Verfahren zum Anordnen eines Halbleiterkörpers auf einem Träger
JP1084912A JP2697890B2 (ja) 1988-04-08 1989-04-05 半導体を支持体に設ける方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8800902 1988-04-08
NL8800902A NL8800902A (nl) 1988-04-08 1988-04-08 Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.

Publications (1)

Publication Number Publication Date
NL8800902A true NL8800902A (nl) 1989-11-01

Family

ID=19852090

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8800902A NL8800902A (nl) 1988-04-08 1988-04-08 Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.

Country Status (5)

Country Link
US (1) US4961528A (de)
EP (1) EP0336514B1 (de)
JP (1) JP2697890B2 (de)
DE (1) DE68926754T2 (de)
NL (1) NL8800902A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5526977A (en) * 1994-12-15 1996-06-18 Hayes Wheels International, Inc. Method for fabricating a bimetal vehicle wheel
US5816478A (en) * 1995-06-05 1998-10-06 Motorola, Inc. Fluxless flip-chip bond and a method for making
US6090643A (en) 1998-08-17 2000-07-18 Teccor Electronics, L.P. Semiconductor chip-substrate attachment structure
US6279811B1 (en) * 2000-05-12 2001-08-28 Mcgraw-Edison Company Solder application technique

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH527487A (de) * 1971-07-29 1972-08-31 Alusuisse Verfahren zur Herstellung einer Stromschiene
GB1426874A (en) * 1972-05-03 1976-03-03 Mullard Ltd Method of sealing electrical component envelopes
IT1111635B (it) * 1977-10-25 1986-01-13 Bfg Glassgroup Unita contenenti elementi vetrosi
SU703871A2 (ru) * 1977-10-28 1979-12-17 Предприятие П/Я Х-5737 Способ соединени разнородных материалов
JPS55132048A (en) * 1979-04-03 1980-10-14 Toshiba Corp Semiconductor device
SU854627A1 (ru) * 1979-09-11 1981-08-15 Предприятие П/Я М-5409 Способ пайки графита с алюминием
GB2067117B (en) * 1980-01-02 1983-07-06 Secr Defence Bonding semi-conductor bodies to aluminium thick-film circuits
DE3071367D1 (en) * 1980-09-29 1986-03-06 Toshiba Kk A semiconductor device with a semiconductor element soldered on a metal substrate
US4448853A (en) * 1981-04-15 1984-05-15 Bbc Brown, Boveri & Company, Limited Layered active brazing material and method for producing it
JPS5994569A (ja) * 1982-11-24 1984-05-31 Toshiba Corp 拡散接合方法
US4729504A (en) * 1985-06-01 1988-03-08 Mizuo Edamura Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics
US4817853A (en) * 1986-11-26 1989-04-04 Sundstrand Corporation Composite, method of forming a composite, and article of manufacture
US4757934A (en) * 1987-02-06 1988-07-19 Motorola, Inc. Low stress heat sinking for semiconductors
US4905886A (en) * 1988-07-20 1990-03-06 Grumman Aerospace Corporation Method for diffusion bonding of metals and alloys using thermal spray deposition

Also Published As

Publication number Publication date
JP2697890B2 (ja) 1998-01-14
EP0336514B1 (de) 1996-07-03
DE68926754T2 (de) 1997-01-23
JPH0212805A (ja) 1990-01-17
US4961528A (en) 1990-10-09
EP0336514A1 (de) 1989-10-11
DE68926754D1 (de) 1996-08-08

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Legal Events

Date Code Title Description
A1B A search report has been drawn up
BV The patent application has lapsed