Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW085115853ApriorityCriticalpatent/TW344864B/en
Application grantedgrantedCritical
Publication of TW344864BpublicationCriticalpatent/TW344864B/en
A process for producing an aluminum layer for connecting a silicon-containing conductive layer having an exposed surface, the process comprising: forming a barrier metal layer on the silicon-containing conductive layer, contacting the exposed surface of the silicon-containing conductive layer; forming a titanium layer on the barrier metal layer; forming a silicon-containing aluminum alloy layer on the titanium layer; and forming an anti-reflection layer on the silicon-containing aluminum alloy layer.
TW085115853A1996-12-211996-12-21Process for producing aluminum metal layer
TW344864B
(en)