NL8303797A - Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen. - Google Patents

Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen. Download PDF

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Publication number
NL8303797A
NL8303797A NL8303797A NL8303797A NL8303797A NL 8303797 A NL8303797 A NL 8303797A NL 8303797 A NL8303797 A NL 8303797A NL 8303797 A NL8303797 A NL 8303797A NL 8303797 A NL8303797 A NL 8303797A
Authority
NL
Netherlands
Prior art keywords
cover plate
reservoir
parts
fastener
stamps
Prior art date
Application number
NL8303797A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8303797A priority Critical patent/NL8303797A/nl
Priority to US06/598,634 priority patent/US4532884A/en
Priority to AT84201566T priority patent/ATE32292T1/de
Priority to EP84201566A priority patent/EP0141467B1/de
Priority to DE8484201566T priority patent/DE3469123D1/de
Priority to ES1984291666U priority patent/ES291666Y/es
Priority to JP59229038A priority patent/JPH0680957B2/ja
Priority to CA000466809A priority patent/CA1221472A/en
Publication of NL8303797A publication Critical patent/NL8303797A/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Packages (AREA)
NL8303797A 1983-11-04 1983-11-04 Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen. NL8303797A (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL8303797A NL8303797A (nl) 1983-11-04 1983-11-04 Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen.
US06/598,634 US4532884A (en) 1983-11-04 1984-04-10 Device for applying a fixing medium to components such as chip-type components
AT84201566T ATE32292T1 (de) 1983-11-04 1984-10-31 Vorrichtung zum auftragen eines befestigungsmediums auf elektronische bauteile, insbesondere auf bauteile des plaettchentyps.
EP84201566A EP0141467B1 (de) 1983-11-04 1984-10-31 Vorrichtung zum Auftragen eines Befestigungsmediums auf elektronische Bauteile, insbesondere auf Bauteile des Plättchentyps
DE8484201566T DE3469123D1 (en) 1983-11-04 1984-10-31 Device for applying a fixing medium to electronic components, more particularly to chip-type components
ES1984291666U ES291666Y (es) 1983-11-04 1984-10-31 Un dispositivo para aplicar un medio de fijacion a componentes electronicos mas particularmente a componentes del tipo de pastilla
JP59229038A JPH0680957B2 (ja) 1983-11-04 1984-11-01 電子部品に固着媒体を付ける装置
CA000466809A CA1221472A (en) 1983-11-04 1984-11-01 Device for applying a fixing medium to electronic components, more particularly to chip-type components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8303797 1983-11-04
NL8303797A NL8303797A (nl) 1983-11-04 1983-11-04 Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen.

Publications (1)

Publication Number Publication Date
NL8303797A true NL8303797A (nl) 1985-06-03

Family

ID=19842659

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8303797A NL8303797A (nl) 1983-11-04 1983-11-04 Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen.

Country Status (8)

Country Link
US (1) US4532884A (de)
EP (1) EP0141467B1 (de)
JP (1) JPH0680957B2 (de)
AT (1) ATE32292T1 (de)
CA (1) CA1221472A (de)
DE (1) DE3469123D1 (de)
ES (1) ES291666Y (de)
NL (1) NL8303797A (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3172781A (en) * 1965-03-09 Ernest w. swider edward j. brenner
DE2935082A1 (de) * 1979-08-30 1981-03-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum auftrag viskoser fluessigkeit auf einem flaechigen traegerkoerper
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
NL8103574A (nl) * 1981-07-29 1983-02-16 Philips Nv Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.

Also Published As

Publication number Publication date
DE3469123D1 (en) 1988-03-03
JPS60113500A (ja) 1985-06-19
ES291666U (es) 1986-05-01
EP0141467A3 (en) 1985-06-12
JPH0680957B2 (ja) 1994-10-12
ATE32292T1 (de) 1988-02-15
EP0141467B1 (de) 1988-01-27
US4532884A (en) 1985-08-06
ES291666Y (es) 1987-01-16
CA1221472A (en) 1987-05-05
EP0141467A2 (de) 1985-05-15

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A1B A search report has been drawn up
BV The patent application has lapsed