NL7114934A - - Google Patents
Info
- Publication number
- NL7114934A NL7114934A NL7114934A NL7114934A NL7114934A NL 7114934 A NL7114934 A NL 7114934A NL 7114934 A NL7114934 A NL 7114934A NL 7114934 A NL7114934 A NL 7114934A NL 7114934 A NL7114934 A NL 7114934A
- Authority
- NL
- Netherlands
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Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10271—Silicon-germanium [SiGe]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9612870A JPS4939223B1 (fr) | 1970-10-30 | 1970-10-30 | |
JP9767370A JPS4948264B1 (fr) | 1970-11-05 | 1970-11-05 | |
JP9767270A JPS4939224B1 (fr) | 1970-11-05 | 1970-11-05 | |
JP9860570A JPS4948265B1 (fr) | 1970-11-07 | 1970-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7114934A true NL7114934A (fr) | 1972-05-03 |
Family
ID=27468399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7114934A NL7114934A (fr) | 1970-10-30 | 1971-10-29 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3729807A (fr) |
CA (1) | CA920721A (fr) |
DE (1) | DE2154026A1 (fr) |
FR (1) | FR2111969B1 (fr) |
GB (1) | GB1374626A (fr) |
NL (1) | NL7114934A (fr) |
Families Citing this family (45)
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GB1389542A (en) * | 1971-06-17 | 1975-04-03 | Mullard Ltd | Methods of securing a semiconductor body to a support |
US3890455A (en) * | 1972-06-23 | 1975-06-17 | Ibm | Method of electrolessly plating alloys |
US3986251A (en) * | 1974-10-03 | 1976-10-19 | Motorola, Inc. | Germanium doped light emitting diode bonding process |
US4065588A (en) * | 1975-11-20 | 1977-12-27 | Rca Corporation | Method of making gold-cobalt contact for silicon devices |
JPS5439573A (en) * | 1977-09-05 | 1979-03-27 | Toshiba Corp | Compound semiconductor device |
US4293587A (en) * | 1978-11-09 | 1981-10-06 | Zilog, Inc. | Low resistance backside preparation for semiconductor integrated circuit chips |
WO1982002457A1 (fr) * | 1980-12-30 | 1982-07-22 | Finn John B | Fixation d'un de de qualite et fiabilite ameliorees |
US4702941A (en) * | 1984-03-27 | 1987-10-27 | Motorola Inc. | Gold metallization process |
US5037778A (en) * | 1989-05-12 | 1991-08-06 | Intel Corporation | Die attach using gold ribbon with gold/silicon eutectic alloy cladding |
US5028454A (en) * | 1989-10-16 | 1991-07-02 | Motorola Inc. | Electroless plating of portions of semiconductor devices and the like |
DE4107660C2 (de) * | 1991-03-09 | 1995-05-04 | Bosch Gmbh Robert | Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen |
JPH05200539A (ja) * | 1992-01-24 | 1993-08-10 | Honda Motor Co Ltd | 半導体基板接合方法 |
US6225218B1 (en) * | 1995-12-20 | 2001-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
DE19639438A1 (de) * | 1996-09-25 | 1998-04-02 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht |
US6440750B1 (en) | 1997-06-10 | 2002-08-27 | Agere Systems Guardian Corporation | Method of making integrated circuit having a micromagnetic device |
US6118351A (en) * | 1997-06-10 | 2000-09-12 | Lucent Technologies Inc. | Micromagnetic device for power processing applications and method of manufacture therefor |
US6523560B1 (en) | 1998-09-03 | 2003-02-25 | General Electric Corporation | Microvalve with pressure equalization |
US7011378B2 (en) | 1998-09-03 | 2006-03-14 | Ge Novasensor, Inc. | Proportional micromechanical valve |
WO2000014415A2 (fr) | 1998-09-03 | 2000-03-16 | Lucas Novasensor | Dispositif micromecanique proportionnel |
US6255714B1 (en) | 1999-06-22 | 2001-07-03 | Agere Systems Guardian Corporation | Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor |
US6845962B1 (en) * | 2000-03-22 | 2005-01-25 | Kelsey-Hayes Company | Thermally actuated microvalve device |
US6505811B1 (en) | 2000-06-27 | 2003-01-14 | Kelsey-Hayes Company | High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate |
JP2007512489A (ja) * | 2003-11-24 | 2007-05-17 | アルーマナ、マイクロウ、エルエルシー | 可変容量形コンプレッサの制御に適したマイクロバルブ・デバイス |
US20070251586A1 (en) * | 2003-11-24 | 2007-11-01 | Fuller Edward N | Electro-pneumatic control valve with microvalve pilot |
US8011388B2 (en) * | 2003-11-24 | 2011-09-06 | Microstaq, INC | Thermally actuated microvalve with multiple fluid ports |
JP2007525630A (ja) * | 2004-02-27 | 2007-09-06 | アルーマナ、マイクロウ、エルエルシー | ハイブリッド・マイクロ/マクロ・プレート弁 |
JP5196422B2 (ja) * | 2004-03-05 | 2013-05-15 | ドゥンアン、マイクロスタック、インク | マイクロバルブ形成のための選択的ボンディング |
US7156365B2 (en) * | 2004-07-27 | 2007-01-02 | Kelsey-Hayes Company | Method of controlling microvalve actuator |
EP1836399A1 (fr) * | 2005-01-14 | 2007-09-26 | Alumina Micro LLC | Systeme et procede de commande d'un compresseur a debit variable |
DE112007003035T5 (de) | 2006-12-15 | 2009-11-05 | Microstaq, Inc., Austin | Mikroventilvorrichtung |
CN101675280B (zh) | 2007-03-30 | 2013-05-15 | 盾安美斯泰克公司(美国) | 先导式微型滑阀 |
CN101668973B (zh) | 2007-03-31 | 2013-03-13 | 盾安美斯泰克公司(美国) | 先导式滑阀 |
CN102164846B (zh) * | 2008-08-09 | 2016-03-30 | 盾安美斯泰克公司(美国) | 改进的微型阀装置 |
US8113482B2 (en) * | 2008-08-12 | 2012-02-14 | DunAn Microstaq | Microvalve device with improved fluid routing |
CN102308131B (zh) | 2008-12-06 | 2014-01-08 | 盾安美斯泰克有限公司 | 流体流动控制组件 |
WO2010117874A2 (fr) | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Procédé et structure pour optimiser la performance d'un échangeur de chaleur |
US20120145252A1 (en) | 2009-08-17 | 2012-06-14 | Dunan Microstaq, Inc. | Micromachined Device and Control Method |
US9006844B2 (en) | 2010-01-28 | 2015-04-14 | Dunan Microstaq, Inc. | Process and structure for high temperature selective fusion bonding |
WO2011094302A2 (fr) | 2010-01-28 | 2011-08-04 | Microstaq, Inc. | Procédé de reconditionnement de surface de semiconducteur pour faciliter la liaison |
US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller |
US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor |
EP2693465A1 (fr) * | 2012-07-31 | 2014-02-05 | Nxp B.V. | Dispositif électronique et son procédé de fabrication |
US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly |
US9823358B2 (en) * | 2014-10-17 | 2017-11-21 | Purdue Research Foundation | Low-noise surface level MOS capacitor for improved sensor quality factor |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3078559A (en) * | 1959-04-13 | 1963-02-26 | Sylvania Electric Prod | Method for preparing semiconductor elements |
US3207838A (en) * | 1961-06-30 | 1965-09-21 | Western Electric Co | Substrates having solderable gold films formed thereon, and methods of making the same |
US3273979A (en) * | 1964-07-06 | 1966-09-20 | Rca Corp | Semiconductive devices |
US3585711A (en) * | 1968-09-06 | 1971-06-22 | Us Navy | Gold-silicon bonding process |
GB1256518A (fr) * | 1968-11-30 | 1971-12-08 | ||
US3618202A (en) * | 1969-05-12 | 1971-11-09 | Mallory & Co Inc P R | Ceramic chip electrical components |
US3673478A (en) * | 1969-10-31 | 1972-06-27 | Hitachi Ltd | A semiconductor pellet fitted on a metal body |
US3680199A (en) * | 1970-07-06 | 1972-08-01 | Texas Instruments Inc | Alloying method |
-
1971
- 1971-10-25 GB GB4950271A patent/GB1374626A/en not_active Expired
- 1971-10-28 CA CA126342A patent/CA920721A/en not_active Expired
- 1971-10-29 US US00193956A patent/US3729807A/en not_active Expired - Lifetime
- 1971-10-29 NL NL7114934A patent/NL7114934A/xx unknown
- 1971-10-29 DE DE19712154026 patent/DE2154026A1/de active Pending
- 1971-10-29 FR FR717139077A patent/FR2111969B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CA920721A (en) | 1973-02-06 |
US3729807A (en) | 1973-05-01 |
DE2154026A1 (de) | 1972-05-18 |
FR2111969B1 (fr) | 1974-06-21 |
FR2111969A1 (fr) | 1972-06-09 |
GB1374626A (en) | 1974-11-20 |