NL7114934A - - Google Patents

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Publication number
NL7114934A
NL7114934A NL7114934A NL7114934A NL7114934A NL 7114934 A NL7114934 A NL 7114934A NL 7114934 A NL7114934 A NL 7114934A NL 7114934 A NL7114934 A NL 7114934A NL 7114934 A NL7114934 A NL 7114934A
Authority
NL
Netherlands
Application number
NL7114934A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9612870A external-priority patent/JPS4939223B1/ja
Priority claimed from JP9767370A external-priority patent/JPS4948264B1/ja
Priority claimed from JP9767270A external-priority patent/JPS4939224B1/ja
Priority claimed from JP9860570A external-priority patent/JPS4948265B1/ja
Application filed filed Critical
Publication of NL7114934A publication Critical patent/NL7114934A/xx

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Classifications

    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10252—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1027—IV
    • H01L2924/10271—Silicon-germanium [SiGe]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
NL7114934A 1970-10-30 1971-10-29 NL7114934A (xx)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9612870A JPS4939223B1 (xx) 1970-10-30 1970-10-30
JP9767370A JPS4948264B1 (xx) 1970-11-05 1970-11-05
JP9767270A JPS4939224B1 (xx) 1970-11-05 1970-11-05
JP9860570A JPS4948265B1 (xx) 1970-11-07 1970-11-07

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NL7114934A true NL7114934A (xx) 1972-05-03

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US (1) US3729807A (xx)
CA (1) CA920721A (xx)
DE (1) DE2154026A1 (xx)
FR (1) FR2111969B1 (xx)
GB (1) GB1374626A (xx)
NL (1) NL7114934A (xx)

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CA920721A (en) 1973-02-06
US3729807A (en) 1973-05-01
DE2154026A1 (de) 1972-05-18
FR2111969B1 (xx) 1974-06-21
FR2111969A1 (xx) 1972-06-09
GB1374626A (en) 1974-11-20

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