NL7101134A - - Google Patents

Info

Publication number
NL7101134A
NL7101134A NL7101134A NL7101134A NL7101134A NL 7101134 A NL7101134 A NL 7101134A NL 7101134 A NL7101134 A NL 7101134A NL 7101134 A NL7101134 A NL 7101134A NL 7101134 A NL7101134 A NL 7101134A
Authority
NL
Netherlands
Prior art keywords
explosive
lead
undulating
adhesion
article
Prior art date
Application number
NL7101134A
Other languages
English (en)
Other versions
NL152781B (nl
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL7101134A publication Critical patent/NL7101134A/xx
Publication of NL152781B publication Critical patent/NL152781B/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
    • B23K20/08—Explosive welding
    • B23K20/085—Explosive welding for tubes, e.g. plugging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H10W99/00—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
NL717101134A 1970-01-29 1971-01-28 Werkwijze om ten minste twee werkstukken met elkaar te verbinden, alsmede microcircuit, vervaardigd door toepassing van deze werkwijze. NL152781B (nl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US682970A 1970-01-29 1970-01-29
US6843170A 1970-08-31 1970-08-31
US00202567A US3805120A (en) 1970-01-29 1971-11-26 Explosive bonding of workpieces

Publications (2)

Publication Number Publication Date
NL7101134A true NL7101134A (enExample) 1971-08-02
NL152781B NL152781B (nl) 1977-04-15

Family

ID=27358199

Family Applications (1)

Application Number Title Priority Date Filing Date
NL717101134A NL152781B (nl) 1970-01-29 1971-01-28 Werkwijze om ten minste twee werkstukken met elkaar te verbinden, alsmede microcircuit, vervaardigd door toepassing van deze werkwijze.

Country Status (7)

Country Link
US (2) US3727296A (enExample)
BE (1) BE762165A (enExample)
CH (1) CH534024A (enExample)
DE (1) DE2104273C3 (enExample)
FR (1) FR2109543A5 (enExample)
GB (1) GB1353242A (enExample)
NL (1) NL152781B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens AG, 1000 Berlin und 8000 München Leiterplatte für die Elektronik
US5897794A (en) * 1997-01-30 1999-04-27 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for ablative bonding using a pulsed electron
US6303875B1 (en) * 1998-01-23 2001-10-16 Kabushiki Kaisha Toshiba IC packages replaceable by IC packages having a smaller pin count and circuit device using the same
US6730370B1 (en) 2000-09-26 2004-05-04 Sveinn Olafsson Method and apparatus for processing materials by applying a controlled succession of thermal spikes or shockwaves through a growth medium
US6554927B1 (en) * 2000-11-24 2003-04-29 Sigmabond Technologies Corporation Method of explosive bonding, composition therefor and product thereof
DE10334391B4 (de) * 2003-07-28 2005-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik
DE102006019856A1 (de) * 2006-04-28 2007-11-08 Admedes Schuessler Gmbh Verfahren zum Bearbeiten von Werkstoffen unter Verwendung von porösem Silizium als Sprengstoff
US8084710B2 (en) * 2008-03-07 2011-12-27 The Ohio State University Low-temperature laser spot impact welding driven without contact
DE102008020327A1 (de) * 2008-04-23 2009-07-30 Continental Automotive Gmbh Verfahren zur Fixierung, Bauelement, Substrat und Schaltungsanordnungen
US8203123B2 (en) 2009-03-10 2012-06-19 Alliant Techsystems Inc. Neutron detection by neutron capture-initiated relaxation of a ferroelectrically, ferromagnetically, and/or chemically metastable material
US8309045B2 (en) 2011-02-11 2012-11-13 General Electric Company System and method for controlling emissions in a combustion system
CN102489868B (zh) * 2011-12-21 2013-08-14 湖南湘投金天钛金属有限公司 一种圆形钛钢复合板的制备方法
US11084122B2 (en) 2017-07-13 2021-08-10 Ohio State Innovation Foundation Joining of dissimilar materials using impact welding
US11873122B2 (en) * 2021-03-02 2024-01-16 Blue Origin, Llc Systems and methods for bonding objects using energetic welding

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US26858A (en) * 1860-01-17 Improvement in sap-conductors
US2067213A (en) * 1935-06-17 1937-01-12 Trojan Powder Co Explosive
US2909758A (en) * 1953-09-24 1959-10-20 Henry J Modrey Explosive terminal and method of firing
US3132044A (en) * 1957-11-19 1964-05-05 Varian Associates Metalized ceramic for bonding to metals
US3233312A (en) * 1962-08-03 1966-02-08 Du Pont Explosively bonded product
US3323204A (en) * 1963-10-11 1967-06-06 Libbey Owens Ford Glass Co Method of sealing metal to glass
DE1302467B (de) * 1964-01-17 1971-12-23 Dynamit Nobel Ag Anordnung zum Explosionsplattieren von Metallplatten
SE315469B (enExample) * 1964-03-09 1969-09-29 Asahi Chemical Ind
US3380908A (en) * 1964-03-23 1968-04-30 Asahi Chemical Ind Explosion bonded electrode for electrolysis
US3434197A (en) * 1964-08-03 1969-03-25 Singer General Precision Explosive welding
US3316458A (en) * 1965-01-29 1967-04-25 Hughes Aircraft Co Electronic circuit assembly with recessed substrate mounting means
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3439408A (en) * 1967-06-29 1969-04-22 Du Pont Process for initiating explosive and charge therefor
US3543388A (en) * 1967-12-29 1970-12-01 Hexcel Corp Controlled area explosive bonding

Also Published As

Publication number Publication date
BE762165A (fr) 1971-07-01
DE2104273B2 (de) 1973-04-05
FR2109543A5 (enExample) 1972-05-26
GB1353242A (en) 1974-05-15
US3805120A (en) 1974-04-16
DE2104273A1 (de) 1971-09-16
CH534024A (de) 1973-02-28
NL152781B (nl) 1977-04-15
US3727296A (en) 1973-04-17
DE2104273C3 (de) 1973-10-25

Similar Documents

Publication Publication Date Title
FR2109543A5 (enExample)
CA1007760A (en) Solder bond between the semiconductor chip and substrate
CA920284A (en) Method of manufacturing a semiconductor device and semiconductor device manufactured according to the method
ES385715A1 (es) Un metodo de aislar un articulo transparente electricamenteconductor.
AU3106971A (en) Minimal surface chip
CA984060A (en) Semiconductor contact pad structure with bumps
CA962493A (en) Silicon coated substrates and objects fabricated therefrom
ES381370A1 (es) Un metodo de fabricar un dispositivo semiconductor.
CA934482A (en) Method of making a semiconductor article and the article produced thereby
CA944869A (en) Diffusion of doping materials into wafers of semi-conductor material
CA991332A (en) Process for applying and bonding conductor material to substrate
IT955495B (it) Metodo per la formazione di un dispositivo semiconduttore con una superficie piatta e liscia
IT939033B (it) Procedimento e dispositivo per la fabbricazione di tamponi rivestiti di materia plastica
NL147884B (nl) Werkwijze voor de vervaardiging van halfgeleiderinrichtingen met een vlak systeem van een of meer geleidende en isolerende lagen.
ZA727392B (en) Thin layer semiconductor device
IT956704B (it) Metodo per la preparazione di con fezioni multiple per pastiglie e oggetti simili e confezione cosi attuata
CA948075A (en) Method of depositing a layer of semiconductor material
CA1000528A (en) Bonded gold article, composition and method of bonding gold to a ceramic substrate
IT994171B (it) Procedimento per la diffusione di impurita di materiali semicondut tori per la produzione di disposi tivi elettronici
AU3588571A (en) A method of electrically connecting a semiconductor chip toa substrate
AU466371B2 (en) Device for mechanically and/or electrically connecting a semiconductor device toa substrate
JPS5318960A (en) Bonding method
NL155567B (nl) Bereiding van een hardbaar materiaal op basis van epoxyhars en toepassing daarvan in een oppervlaktelaag voor een buigzaam plaveisel.
KR100266348B1 (en) Semiconductor device and method for manufacturing the same
JPS5311816B2 (enExample)

Legal Events

Date Code Title Description
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: WESTERN ELECTRI

V4 Discontinued because of reaching the maximum lifetime of a patent