NL6715013A - - Google Patents

Info

Publication number
NL6715013A
NL6715013A NL6715013A NL6715013A NL6715013A NL 6715013 A NL6715013 A NL 6715013A NL 6715013 A NL6715013 A NL 6715013A NL 6715013 A NL6715013 A NL 6715013A NL 6715013 A NL6715013 A NL 6715013A
Authority
NL
Netherlands
Application number
NL6715013A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6715013A priority Critical patent/NL6715013A/xx
Priority to NL676715014A priority patent/NL154061B/xx
Priority to DE1805826A priority patent/DE1805826C3/de
Priority to AT1061968A priority patent/AT281122B/de
Priority to CH1631768A priority patent/CH483725A/de
Priority to GB51836/68A priority patent/GB1243355A/en
Priority to SE14874/68A priority patent/SE354380B/xx
Priority to ES359847A priority patent/ES359847A1/es
Priority to BE723340D priority patent/BE723340A/xx
Priority to FR1592176D priority patent/FR1592176A/fr
Publication of NL6715013A publication Critical patent/NL6715013A/xx
Priority to US00131252A priority patent/US3839103A/en
Priority to US00213947A priority patent/US3772576A/en
Priority to JP48067663A priority patent/JPS5013633B1/ja

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/112Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/028Dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Weting (AREA)
  • Bipolar Transistors (AREA)
  • Dicing (AREA)
  • Electrodes Of Semiconductors (AREA)
NL6715013A 1967-11-04 1967-11-04 NL6715013A (en:Method)

Priority Applications (13)

Application Number Priority Date Filing Date Title
NL6715013A NL6715013A (en:Method) 1967-11-04 1967-11-04
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.
DE1805826A DE1805826C3 (de) 1967-11-04 1968-10-29 Verfahren zum Hersteilen von planaren Halbleiterbauelementen
AT1061968A AT281122B (de) 1967-11-04 1968-10-31 Halbleitervorrichtung und Verfahren zur Herstellung derselben
GB51836/68A GB1243355A (en) 1967-11-04 1968-11-01 Improvements in and relating to semiconductor devices
CH1631768A CH483725A (de) 1967-11-04 1968-11-01 Planare Halbleitervorrichtung und Verfahren zur Herstellung derselben
SE14874/68A SE354380B (en:Method) 1967-11-04 1968-11-01
ES359847A ES359847A1 (es) 1967-11-04 1968-11-02 Un dispositivo semiconductor planar.
BE723340D BE723340A (en:Method) 1967-11-04 1968-11-04
FR1592176D FR1592176A (en:Method) 1967-11-04 1968-11-04
US00131252A US3839103A (en) 1967-11-04 1971-04-05 Semiconductor device and method of manufacturing same
US00213947A US3772576A (en) 1967-11-04 1971-12-30 Planar semiconductor device with scribe lines and channel stopper
JP48067663A JPS5013633B1 (en:Method) 1967-11-04 1973-06-15

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL6715013A NL6715013A (en:Method) 1967-11-04 1967-11-04
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.

Publications (1)

Publication Number Publication Date
NL6715013A true NL6715013A (en:Method) 1969-05-06

Family

ID=26644261

Family Applications (2)

Application Number Title Priority Date Filing Date
NL6715013A NL6715013A (en:Method) 1967-11-04 1967-11-04
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.

Country Status (11)

Country Link
US (2) US3839103A (en:Method)
JP (1) JPS5013633B1 (en:Method)
AT (1) AT281122B (en:Method)
BE (1) BE723340A (en:Method)
CH (1) CH483725A (en:Method)
DE (1) DE1805826C3 (en:Method)
ES (1) ES359847A1 (en:Method)
FR (1) FR1592176A (en:Method)
GB (1) GB1243355A (en:Method)
NL (2) NL6715013A (en:Method)
SE (1) SE354380B (en:Method)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4819113B1 (en:Method) * 1969-08-27 1973-06-11
JPS573225B2 (en:Method) * 1974-08-19 1982-01-20
JPS5261333U (en:Method) * 1975-10-31 1977-05-06
CH594989A5 (en:Method) * 1976-09-03 1978-01-31 Bbc Brown Boveri & Cie
US4076558A (en) * 1977-01-31 1978-02-28 International Business Machines Corporation Method of high current ion implantation and charge reduction by simultaneous kerf implant
US4665420A (en) * 1984-11-08 1987-05-12 Rca Corporation Edge passivated charge-coupled device image sensor
US4835592A (en) * 1986-03-05 1989-05-30 Ixys Corporation Semiconductor wafer with dice having briding metal structure and method of manufacturing same
JP2578600B2 (ja) * 1987-04-28 1997-02-05 オリンパス光学工業株式会社 半導体装置
US5237197A (en) * 1989-06-26 1993-08-17 University Of Hawaii Integrated VLSI radiation/particle detector with biased pin diodes
DE58909785D1 (de) * 1989-11-28 1997-04-10 Siemens Ag Halbleiterscheibe mit dotiertem Ritzrahmen
ATE106489T1 (de) * 1990-06-21 1994-06-15 Chiang Mu Long Eckenschutz für wände, träger, stützen etc.
FR2694410B1 (fr) * 1992-07-30 1994-10-28 Sgs Thomson Microelectronics Procédé de test de la résistance par carré de couches diffusées.
DE19539527C2 (de) * 1995-10-24 2001-02-22 August Braun Winkelleiste mit Armierungsmaterial für den Putz auf einer Wärmedämmung
KR102759850B1 (ko) 2017-06-27 2025-01-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 반도체 웨이퍼, 기억 장치, 및 전자 기기

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282779A (en:Method) * 1961-09-08
US3197681A (en) * 1961-09-29 1965-07-27 Texas Instruments Inc Semiconductor devices with heavily doped region to prevent surface inversion
NL294370A (en:Method) * 1963-06-20
GB993388A (en) * 1964-02-05 1965-05-26 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3395320A (en) * 1965-08-25 1968-07-30 Bell Telephone Labor Inc Isolation technique for integrated circuit structure

Also Published As

Publication number Publication date
US3839103A (en) 1974-10-01
AT281122B (de) 1970-05-11
DE1805826C3 (de) 1978-06-01
CH483725A (de) 1969-12-31
NL6715014A (en:Method) 1969-05-06
BE723340A (en:Method) 1969-05-05
GB1243355A (en) 1971-08-18
US3772576A (en) 1973-11-13
DE1805826B2 (de) 1976-04-22
NL154061B (nl) 1977-07-15
DE1805826A1 (de) 1969-06-26
FR1592176A (en:Method) 1970-05-11
JPS5013633B1 (en:Method) 1975-05-21
SE354380B (en:Method) 1973-03-05
ES359847A1 (es) 1970-10-01

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