NL6617291A - - Google Patents

Info

Publication number
NL6617291A
NL6617291A NL6617291A NL6617291A NL6617291A NL 6617291 A NL6617291 A NL 6617291A NL 6617291 A NL6617291 A NL 6617291A NL 6617291 A NL6617291 A NL 6617291A NL 6617291 A NL6617291 A NL 6617291A
Authority
NL
Netherlands
Prior art keywords
wires
semi
conductor
recesses
rod
Prior art date
Application number
NL6617291A
Other languages
English (en)
Inventor
Hermann Forster
Horst Irmler
Samuel Pfandler
Winfried Schierz
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of NL6617291A publication Critical patent/NL6617291A/xx

Links

Classifications

    • H10W72/20—
    • H10P95/00—
    • H10W70/481—
    • H10W72/00—
    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45639—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H10W72/536—
    • H10W72/552—
    • H10W72/5525—
    • H10W72/555—

Landscapes

  • Thermistors And Varistors (AREA)
  • Molten Solder (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Rectifiers (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
NL6617291A 1963-08-05 1966-12-09 NL6617291A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1963S0086552 DE1439272B2 (de) 1963-08-05 1963-08-05 Verfahren zum gleichzeitigen herstellen einer groesseren anzahl von halbleitergleichrichteranordnungen mit einem oder mehreren halbleiterkoerpern
GB5247165A GB1057965A (en) 1963-08-05 1965-12-10 A method of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
NL6617291A true NL6617291A (enExample) 1967-06-12

Family

ID=25997336

Family Applications (3)

Application Number Title Priority Date Filing Date
NL302444D NL302444A (enExample) 1963-08-05
NL302444A NL142279B (nl) 1963-08-05 1963-12-23 Werkwijze voor het vervaardigen van halfgeleiderinrichtingen en halfgeleiderinrichting vervaardigd onder toepassing van de werkwijze.
NL6617291A NL6617291A (enExample) 1963-08-05 1966-12-09

Family Applications Before (2)

Application Number Title Priority Date Filing Date
NL302444D NL302444A (enExample) 1963-08-05
NL302444A NL142279B (nl) 1963-08-05 1963-12-23 Werkwijze voor het vervaardigen van halfgeleiderinrichtingen en halfgeleiderinrichting vervaardigd onder toepassing van de werkwijze.

Country Status (4)

Country Link
US (1) US3371836A (enExample)
DE (2) DE1439272B2 (enExample)
GB (2) GB1020466A (enExample)
NL (3) NL142279B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2434355A (en) * 1945-09-24 1948-01-13 Mitchell Camera Corp Automatic loop replenisher
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
DE1564867C3 (de) * 1966-06-30 1975-04-10 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen
US3791640A (en) * 1972-07-21 1974-02-12 R Clugage Compression hold-down elements
DE3446780A1 (de) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen
CN105197432B (zh) * 2015-09-30 2017-09-12 苏州市灵通玻璃制品有限公司 一种冰箱面板玻璃周转装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2058128A (en) * 1934-10-08 1936-10-20 Howard F Brubach Slide holder
US2321071A (en) * 1941-06-18 1943-06-08 Bell Telephone Labor Inc Method of assembling dry rectifiers and the like with solder
US2693634A (en) * 1951-12-05 1954-11-09 Atlas Powder Co Igniter jig for electric blasting initiators
US2766510A (en) * 1953-11-04 1956-10-16 Erie Resistor Corp Method and apparatus for making condensers
US3168885A (en) * 1959-03-13 1965-02-09 Cornell Dubilier Electric Method and apparatus for the manufacture of capacitors
BE630750A (enExample) * 1962-04-09 1963-04-08

Also Published As

Publication number Publication date
DE1439272B2 (de) 1977-05-26
NL302444A (enExample) 1900-01-01
NL142279B (nl) 1974-05-15
GB1020466A (en) 1966-02-16
DE1539881A1 (de) 1970-01-08
GB1057965A (en) 1967-02-08
DE1439272A1 (de) 1969-12-18
US3371836A (en) 1968-03-05

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