NL6413572A - - Google Patents

Info

Publication number
NL6413572A
NL6413572A NL6413572A NL6413572A NL6413572A NL 6413572 A NL6413572 A NL 6413572A NL 6413572 A NL6413572 A NL 6413572A NL 6413572 A NL6413572 A NL 6413572A NL 6413572 A NL6413572 A NL 6413572A
Authority
NL
Netherlands
Prior art keywords
wire
bead
semi
flying lead
elongated members
Prior art date
Application number
NL6413572A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6413572A publication Critical patent/NL6413572A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Insulated Conductors (AREA)
  • Die Bonding (AREA)
NL6413572A 1962-07-27 1964-11-20 NL6413572A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB28975/62A GB1026164A (en) 1962-07-27 1962-07-27 Improvements in or relating to mountings for semi-conductor devices
GB46211/63A GB1027608A (en) 1962-07-27 1963-11-22 Crystal rectifiers and mountings therefor

Publications (1)

Publication Number Publication Date
NL6413572A true NL6413572A (enExample) 1965-05-24

Family

ID=26259671

Family Applications (2)

Application Number Title Priority Date Filing Date
NL295904D NL295904A (enExample) 1962-07-27
NL6413572A NL6413572A (enExample) 1962-07-27 1964-11-20

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL295904D NL295904A (enExample) 1962-07-27

Country Status (5)

Country Link
BE (2) BE656095A (enExample)
CH (1) CH418465A (enExample)
DE (1) DE1274737B (enExample)
GB (2) GB1026164A (enExample)
NL (2) NL6413572A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855606A (en) * 1971-12-23 1974-12-17 Licentia Gmbh Semiconductor arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE896392C (de) * 1951-11-13 1953-11-12 Licentia Gmbh Gehaeuse fuer ein elektrisch unsymmetrisch leitendes System vom Kristalltyp
US2799814A (en) * 1953-09-01 1957-07-16 Sylvania Electric Prod Germanium photodiode
NL87748C (enExample) * 1953-12-12
BE589773A (enExample) * 1959-04-15 1900-01-01

Also Published As

Publication number Publication date
DE1274737B (de) 1968-08-08
GB1026164A (en) 1966-04-14
NL295904A (enExample) 1900-01-01
CH418465A (de) 1966-08-15
BE656095A (enExample) 1965-05-20
GB1027608A (en) 1966-04-27
BE635453A (enExample) 1900-01-01

Similar Documents

Publication Publication Date Title
GB1068208A (en) Semiconductor device
GB1376086A (en) Electroluminescent semiconductor devices
GB1440274A (en) Display device using light-emitting semiconductor elements
IE37284B1 (en) Semiconductor device
GB1279699A (en) Improvements relating to semiconductor devices
GB1252055A (enExample)
GB1030540A (en) Improvements in and relating to semi-conductor diodes
GB1071130A (en) Improvements in or relating to the mounting of semi-conductor components
GB991940A (en) Manufacture of semiconductor devices
GB1214200A (en) Improvements in or relating to semiconductor devices
NL6405157A (enExample)
GB1002725A (en) Semiconductor device
GB1264055A (en) Semiconductor device
GB1300248A (en) Light activated semiconductor device
NL6413572A (enExample)
GB1020151A (en) Electrical semiconductor device
US3243670A (en) Mountings for semiconductor devices
NL6413575A (enExample)
GB1193519A (en) Semiconductor Devices
JPS5629352A (en) Resin-sealed semiconductor device
JPS6455291A (en) Integrated circuit device
GB997228A (en) Semiconductor device and method of producing it
GB1139543A (en) Construction of semiconductor junction diodes
GB1210584A (en) Semiconductor device and method of manufacturing the same
GB1160911A (en) Semiconductor Devices