GB1026164A - Improvements in or relating to mountings for semi-conductor devices - Google Patents

Improvements in or relating to mountings for semi-conductor devices

Info

Publication number
GB1026164A
GB1026164A GB28975/62A GB2897562A GB1026164A GB 1026164 A GB1026164 A GB 1026164A GB 28975/62 A GB28975/62 A GB 28975/62A GB 2897562 A GB2897562 A GB 2897562A GB 1026164 A GB1026164 A GB 1026164A
Authority
GB
United Kingdom
Prior art keywords
wire
semi
bead
flying lead
elongated members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB28975/62A
Other languages
English (en)
Inventor
Dave Francis Thomas Dunster
Ian Hambry Morgan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE635453D priority Critical patent/BE635453A/xx
Priority to NL295904D priority patent/NL295904A/xx
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB28975/62A priority patent/GB1026164A/en
Priority to DEJ24094A priority patent/DE1274737B/de
Priority to FR942831A priority patent/FR1364524A/fr
Priority to CH936963A priority patent/CH418465A/de
Priority to GB46211/63A priority patent/GB1027608A/en
Priority to FR995783A priority patent/FR86838E/fr
Priority to NL6413572A priority patent/NL6413572A/xx
Priority to DEST22971A priority patent/DE1298635B/de
Priority to BE656095D priority patent/BE656095A/xx
Publication of GB1026164A publication Critical patent/GB1026164A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Insulated Conductors (AREA)
  • Die Bonding (AREA)
GB28975/62A 1962-07-27 1962-07-27 Improvements in or relating to mountings for semi-conductor devices Expired GB1026164A (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
BE635453D BE635453A (enExample) 1962-07-27
NL295904D NL295904A (enExample) 1962-07-27
GB28975/62A GB1026164A (en) 1962-07-27 1962-07-27 Improvements in or relating to mountings for semi-conductor devices
DEJ24094A DE1274737B (de) 1962-07-27 1963-07-18 Elektrische Halbleiteranordnung
CH936963A CH418465A (de) 1962-07-27 1963-07-26 Verfahren zum Kontaktieren einer Halbleiteranordnung
FR942831A FR1364524A (fr) 1962-07-27 1963-07-26 Perfectionnements aux arrangements de montage pour dispositifs semi-conducteurs
GB46211/63A GB1027608A (en) 1962-07-27 1963-11-22 Crystal rectifiers and mountings therefor
FR995783A FR86838E (fr) 1962-07-27 1964-11-20 Perfectionnements aux arrangements de montage pour dispositifs semi-conducteurs
NL6413572A NL6413572A (enExample) 1962-07-27 1964-11-20
DEST22971A DE1298635B (de) 1962-07-27 1964-11-20 Elektrische Halbleiteranordnung
BE656095D BE656095A (enExample) 1962-07-27 1964-11-23

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB28975/62A GB1026164A (en) 1962-07-27 1962-07-27 Improvements in or relating to mountings for semi-conductor devices
GB46211/63A GB1027608A (en) 1962-07-27 1963-11-22 Crystal rectifiers and mountings therefor

Publications (1)

Publication Number Publication Date
GB1026164A true GB1026164A (en) 1966-04-14

Family

ID=26259671

Family Applications (2)

Application Number Title Priority Date Filing Date
GB28975/62A Expired GB1026164A (en) 1962-07-27 1962-07-27 Improvements in or relating to mountings for semi-conductor devices
GB46211/63A Expired GB1027608A (en) 1962-07-27 1963-11-22 Crystal rectifiers and mountings therefor

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB46211/63A Expired GB1027608A (en) 1962-07-27 1963-11-22 Crystal rectifiers and mountings therefor

Country Status (5)

Country Link
BE (2) BE656095A (enExample)
CH (1) CH418465A (enExample)
DE (1) DE1274737B (enExample)
GB (2) GB1026164A (enExample)
NL (2) NL6413572A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855606A (en) * 1971-12-23 1974-12-17 Licentia Gmbh Semiconductor arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE896392C (de) * 1951-11-13 1953-11-12 Licentia Gmbh Gehaeuse fuer ein elektrisch unsymmetrisch leitendes System vom Kristalltyp
US2799814A (en) * 1953-09-01 1957-07-16 Sylvania Electric Prod Germanium photodiode
NL87748C (enExample) * 1953-12-12
BE589773A (enExample) * 1959-04-15 1900-01-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855606A (en) * 1971-12-23 1974-12-17 Licentia Gmbh Semiconductor arrangement

Also Published As

Publication number Publication date
DE1274737B (de) 1968-08-08
NL6413572A (enExample) 1965-05-24
NL295904A (enExample) 1900-01-01
CH418465A (de) 1966-08-15
BE656095A (enExample) 1965-05-20
GB1027608A (en) 1966-04-27
BE635453A (enExample) 1900-01-01

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