NL2009239A - Lithographic system, method of controlling a lithographic apparatus and device manufacturing method. - Google Patents

Lithographic system, method of controlling a lithographic apparatus and device manufacturing method. Download PDF

Info

Publication number
NL2009239A
NL2009239A NL2009239A NL2009239A NL2009239A NL 2009239 A NL2009239 A NL 2009239A NL 2009239 A NL2009239 A NL 2009239A NL 2009239 A NL2009239 A NL 2009239A NL 2009239 A NL2009239 A NL 2009239A
Authority
NL
Netherlands
Prior art keywords
substrate
pattern
lithographic apparatus
radiation beam
lithographic
Prior art date
Application number
NL2009239A
Other languages
English (en)
Dutch (nl)
Inventor
Pieter Jager
Arno Bleeker
Arie Boef
Erik Loopstra
Nitesh Pandey
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of NL2009239A publication Critical patent/NL2009239A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70675—Latent image, i.e. measuring the image of the exposed resist prior to development

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
NL2009239A 2011-08-30 2012-07-27 Lithographic system, method of controlling a lithographic apparatus and device manufacturing method. NL2009239A (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201161529064P 2011-08-30 2011-08-30
US201161529064 2011-08-30
US201161546801P 2011-10-13 2011-10-13
US201161546801 2011-10-13
US201261651449P 2012-05-24 2012-05-24
US201261651449 2012-05-24

Publications (1)

Publication Number Publication Date
NL2009239A true NL2009239A (en) 2013-03-04

Family

ID=46582705

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2009239A NL2009239A (en) 2011-08-30 2012-07-27 Lithographic system, method of controlling a lithographic apparatus and device manufacturing method.

Country Status (5)

Country Link
JP (1) JP5793248B2 (zh)
KR (1) KR101558445B1 (zh)
NL (1) NL2009239A (zh)
TW (1) TWI490665B (zh)
WO (1) WO2013029893A2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465565B2 (ja) 2014-05-19 2019-02-06 キヤノン株式会社 露光装置、位置合わせ方法およびデバイス製造方法
US9484188B2 (en) * 2015-03-11 2016-11-01 Mapper Lithography Ip B.V. Individual beam pattern placement verification in multiple beam lithography
WO2017102237A1 (en) 2015-12-15 2017-06-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
JP2000021741A (ja) * 1998-06-30 2000-01-21 Canon Inc 露光装置、デバイス製造方法、および異物検査装置
EP1482373A1 (en) 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4861893B2 (ja) * 2006-07-28 2012-01-25 東京エレクトロン株式会社 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板の処理システム
JP2008058797A (ja) * 2006-09-01 2008-03-13 Fujifilm Corp 描画装置及び描画方法
TWI531872B (zh) * 2008-09-22 2016-05-01 Ａｓｍｌ荷蘭公司 微影裝置、可程式化圖案化器件及微影方法
JP5534552B2 (ja) 2009-05-20 2014-07-02 株式会社ニコン パターン形成装置、パターン形成方法、デバイス製造装置、及びデバイス製造方法

Also Published As

Publication number Publication date
WO2013029893A3 (en) 2013-06-20
WO2013029893A2 (en) 2013-03-07
TWI490665B (zh) 2015-07-01
KR101558445B1 (ko) 2015-10-07
KR20140041847A (ko) 2014-04-04
TW201316131A (zh) 2013-04-16
JP5793248B2 (ja) 2015-10-14
JP2014527724A (ja) 2014-10-16

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Legal Events

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WDAP Patent application withdrawn

Effective date: 20130902