NL194654B - Compact geconstrueerd magneetveld ondersteund verstuivingssamenstel. - Google Patents

Compact geconstrueerd magneetveld ondersteund verstuivingssamenstel.

Info

Publication number
NL194654B
NL194654B NL9400734A NL9400734A NL194654B NL 194654 B NL194654 B NL 194654B NL 9400734 A NL9400734 A NL 9400734A NL 9400734 A NL9400734 A NL 9400734A NL 194654 B NL194654 B NL 194654B
Authority
NL
Netherlands
Prior art keywords
magnetic field
atomizing assembly
compactly constructed
field supported
constructed magnetic
Prior art date
Application number
NL9400734A
Other languages
English (en)
Other versions
NL9400734A (nl
NL194654C (nl
Inventor
Roman Schertler
Walter Haag
Peter Kohler
Original Assignee
Balzers Hochvakuum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers Hochvakuum filed Critical Balzers Hochvakuum
Publication of NL9400734A publication Critical patent/NL9400734A/nl
Publication of NL194654B publication Critical patent/NL194654B/nl
Application granted granted Critical
Publication of NL194654C publication Critical patent/NL194654C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
NL9400734A 1993-05-04 1994-05-04 Compact geconstrueerd magneetveld ondersteund verstuivingssamenstel. NL194654C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH136293 1993-05-04
CH01362/93A CH690805A5 (de) 1993-05-04 1993-05-04 Magnetfeldunterstützte Zerstäubungsanordnung und Vakuumbehandlungsanlage hiermit.

Publications (3)

Publication Number Publication Date
NL9400734A NL9400734A (nl) 1994-12-01
NL194654B true NL194654B (nl) 2002-06-03
NL194654C NL194654C (nl) 2002-10-04

Family

ID=4208668

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9400734A NL194654C (nl) 1993-05-04 1994-05-04 Compact geconstrueerd magneetveld ondersteund verstuivingssamenstel.

Country Status (9)

Country Link
US (1) US5490913A (nl)
JP (1) JP3727669B2 (nl)
KR (1) KR100349407B1 (nl)
AU (1) AU673727B2 (nl)
CH (1) CH690805A5 (nl)
DE (1) DE4405747B4 (nl)
FR (1) FR2704870B1 (nl)
GB (1) GB2278368B (nl)
NL (1) NL194654C (nl)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6689254B1 (en) 1990-10-31 2004-02-10 Tokyo Electron Limited Sputtering apparatus with isolated coolant and sputtering target therefor
US5433835B1 (en) * 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
EP0704878A1 (en) * 1994-09-27 1996-04-03 Applied Materials, Inc. Uniform film thickness deposition of sputtered materials
EP0824760A1 (en) * 1995-05-11 1998-02-25 Materials Research Corporation Sputtering apparatus with isolated coolant and sputtering target therefor
DE19546826C1 (de) * 1995-12-15 1997-04-03 Fraunhofer Ges Forschung Verfahren und Einrichtung zur Vorbehandlung von Substraten
JPH10195649A (ja) * 1996-12-27 1998-07-28 Sony Corp マグネトロンスパッタ装置および半導体装置の製造方法
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
JP4928692B2 (ja) * 2001-09-14 2012-05-09 アプライド マテリアルズ インコーポレイテッド スパッタリング装置のマグネトロンユニット及びスパッタリング装置
EP1336985A1 (de) * 2002-02-19 2003-08-20 Singulus Technologies AG Zerstäubungskathode und Vorrichtung und Verfahren zum Beschichten eines Substrates mit mehreren Schichten
US7297247B2 (en) * 2003-05-06 2007-11-20 Applied Materials, Inc. Electroformed sputtering target
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
DE102004027897A1 (de) * 2004-06-09 2006-01-05 Leybold Optics Gmbh Vorrichtung und Verfahren zur Zerstäubung mit einem bewegbaren planaren Target
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7762114B2 (en) * 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) * 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US20070283884A1 (en) * 2006-05-30 2007-12-13 Applied Materials, Inc. Ring assembly for substrate processing chamber
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US20090084317A1 (en) * 2007-09-28 2009-04-02 Applied Materials, Inc. Atomic layer deposition chamber and components
US7901552B2 (en) * 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
DE102008033904B4 (de) 2008-07-18 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target
DE102009056241B4 (de) 2009-12-01 2012-07-12 Von Ardenne Anlagentechnik Gmbh Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target
DE102010031259B4 (de) * 2010-07-12 2012-07-12 Von Ardenne Anlagentechnik Gmbh Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target
DE102011111779A1 (de) * 2011-09-01 2013-03-07 Von Ardenne Anlagentechnik Gmbh Medienanschlussstutzen, Sputterbeschichtungseinrichtung und Vakuumbeschichtungsanlage

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444643A (en) * 1982-09-03 1984-04-24 Gartek Systems, Inc. Planar magnetron sputtering device
CH659484A5 (de) * 1984-04-19 1987-01-30 Balzers Hochvakuum Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
JP2627651B2 (ja) * 1988-10-17 1997-07-09 アネルバ株式会社 マグネトロンスパッタリング装置
US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
GB8909747D0 (en) * 1989-04-27 1989-06-14 Ionic Coatings Limited Sputtering apparatus
US4995958A (en) * 1989-05-22 1991-02-26 Varian Associates, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
DE4022345A1 (de) * 1989-08-22 1991-02-28 Bosch Gmbh Robert Einrichtung zum uebertragen einer stellposition eines bedienelements
US5252194A (en) * 1990-01-26 1993-10-12 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
EP0439361B1 (en) * 1990-01-26 2003-06-11 Varian Semiconductor Equipment Associates Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
EP0439360A3 (en) * 1990-01-26 1992-01-15 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
DE59208623D1 (de) * 1991-05-08 1997-07-24 Balzers Hochvakuum Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer
US5194131A (en) * 1991-08-16 1993-03-16 Varian Associates, Inc. Apparatus and method for multiple ring sputtering from a single target

Also Published As

Publication number Publication date
KR100349407B1 (ko) 2002-12-11
FR2704870A1 (fr) 1994-11-10
JP3727669B2 (ja) 2005-12-14
NL9400734A (nl) 1994-12-01
GB2278368B (en) 1997-04-23
AU673727B2 (en) 1996-11-21
CH690805A5 (de) 2001-01-15
GB2278368A (en) 1994-11-30
DE4405747B4 (de) 2006-04-27
NL194654C (nl) 2002-10-04
GB9408346D0 (en) 1994-06-15
FR2704870B1 (fr) 1997-01-17
DE4405747A1 (de) 1994-11-10
AU6183194A (en) 1994-11-10
US5490913A (en) 1996-02-13
JPH06330312A (ja) 1994-11-29

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
SNR Assignments of patents or rights arising from examined patent applications

Owner name: OERLIKON TRADING AG, TRUEBBACH

Effective date: 20080618

TNT Modifications of names of proprietors of patents or applicants of examined patent applications

Owner name: OC OERLIKON BALZERS AG

Effective date: 20080618

Owner name: UNAXIS BALZERS AKTIENGESELLSCHAFT

Effective date: 20080618

V4 Discontinued because of reaching the maximum lifetime of a patent

Effective date: 20140504