NL193664C - Elektrodebootsamenstel. - Google Patents

Elektrodebootsamenstel. Download PDF

Info

Publication number
NL193664C
NL193664C NL8702240A NL8702240A NL193664C NL 193664 C NL193664 C NL 193664C NL 8702240 A NL8702240 A NL 8702240A NL 8702240 A NL8702240 A NL 8702240A NL 193664 C NL193664 C NL 193664C
Authority
NL
Netherlands
Prior art keywords
electrode
plate members
electrode plate
rod
conductive
Prior art date
Application number
NL8702240A
Other languages
English (en)
Dutch (nl)
Other versions
NL193664B (nl
NL8702240A (nl
Original Assignee
Asm America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm America filed Critical Asm America
Publication of NL8702240A publication Critical patent/NL8702240A/nl
Publication of NL193664B publication Critical patent/NL193664B/xx
Application granted granted Critical
Publication of NL193664C publication Critical patent/NL193664C/nl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H01L21/67316Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
NL8702240A 1987-02-20 1987-09-18 Elektrodebootsamenstel. NL193664C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/017,778 US4799451A (en) 1987-02-20 1987-02-20 Electrode boat apparatus for processing semiconductor wafers or the like
US1777887 1987-02-20

Publications (3)

Publication Number Publication Date
NL8702240A NL8702240A (nl) 1988-09-16
NL193664B NL193664B (nl) 2000-02-01
NL193664C true NL193664C (nl) 2000-06-06

Family

ID=21784497

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8702240A NL193664C (nl) 1987-02-20 1987-09-18 Elektrodebootsamenstel.

Country Status (5)

Country Link
US (1) US4799451A (de)
JP (1) JPH0834207B2 (de)
DE (1) DE3805293C2 (de)
GB (1) GB2201162B (de)
NL (1) NL193664C (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873942A (en) * 1988-06-08 1989-10-17 The Stackpole Corporation Plasma enhanced chemical vapor deposition wafer holding fixture
US5175021A (en) * 1990-02-01 1992-12-29 Advanced Semiconductor Materials America, Inc. Transmission line for providing power to an electrode boat in a plasma enhanced chemical vapor deposition system
GB9010000D0 (en) * 1990-05-03 1990-06-27 Stc Plc Phosphide films
DE102005031602A1 (de) * 2005-07-06 2007-01-11 Robert Bosch Gmbh Reaktor zur Durchführung eines Ätzverfahrens für einen Stapel von maskierten Wafern und Ätzverfahren
US20080016684A1 (en) * 2006-07-06 2008-01-24 General Electric Company Corrosion resistant wafer processing apparatus and method for making thereof
US20080006204A1 (en) * 2006-07-06 2008-01-10 General Electric Company Corrosion resistant wafer processing apparatus and method for making thereof
JP2011117046A (ja) * 2009-12-04 2011-06-16 Fuji Electric Co Ltd 真空処理装置
DE102015004419A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Plasma-Behandlungsvorrichtung für Wafer
DE102015004352A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Behandlungsvorrichtung für Wafer
KR20180133335A (ko) 2017-06-06 2018-12-14 템프레스 아이피 비.브이. 웨이퍼 파지기 조립체, 시스템, 및 그 사용
CN110872689B (zh) * 2018-08-30 2024-05-28 上海祖强能源有限公司 蒸发舟拆装工具及蒸镀设备
DE102019002647A1 (de) * 2019-04-10 2020-10-15 Plasmetrex Gmbh Waferboot und Behandlungsvorrichtung für Wafer
CN110565075B (zh) * 2019-09-20 2024-04-23 苏州拓升智能装备有限公司 一种用于管式pecvd设备的石墨舟电极对接装置
JP6937806B2 (ja) * 2019-09-25 2021-09-22 株式会社Kokusai Electric 基板処理装置、及び半導体の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112066A (en) * 1977-03-11 1978-09-30 Fujitsu Ltd Plasma treatment apparatus
US4223048A (en) * 1978-08-07 1980-09-16 Pacific Western Systems Plasma enhanced chemical vapor processing of semiconductive wafers
US4287851A (en) * 1980-01-16 1981-09-08 Dozier Alfred R Mounting and excitation system for reaction in the plasma state
US4401507A (en) * 1982-07-14 1983-08-30 Advanced Semiconductor Materials/Am. Method and apparatus for achieving spatially uniform externally excited non-thermal chemical reactions
NL8303602A (nl) * 1983-10-19 1985-05-17 Johannes Hendrikus Leonardus H Plasma-gestimuleerde chemische opdampinrichting en in het bijzonder een substratenondersteunings- en elektrodeopstelling daarvoor en de betreffende onderdelen.
US4610748A (en) * 1984-12-10 1986-09-09 Advanced Semiconductor Materials Of America, Inc. Apparatus for processing semiconductor wafers or the like

Also Published As

Publication number Publication date
JPS63224330A (ja) 1988-09-19
DE3805293A1 (de) 1988-09-01
GB8726205D0 (en) 1987-12-16
JPH0834207B2 (ja) 1996-03-29
DE3805293C2 (de) 1999-08-05
US4799451A (en) 1989-01-24
NL193664B (nl) 2000-02-01
NL8702240A (nl) 1988-09-16
GB2201162A (en) 1988-08-24
GB2201162B (en) 1991-01-30

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BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20010401