NL191545C - Werkwijze voor het vormen van een capacitieve druksensor. - Google Patents

Werkwijze voor het vormen van een capacitieve druksensor.

Info

Publication number
NL191545C
NL191545C NL8203936A NL8203936A NL191545C NL 191545 C NL191545 C NL 191545C NL 8203936 A NL8203936 A NL 8203936A NL 8203936 A NL8203936 A NL 8203936A NL 191545 C NL191545 C NL 191545C
Authority
NL
Netherlands
Prior art keywords
forming
pressure sensor
capacitive pressure
capacitive
sensor
Prior art date
Application number
NL8203936A
Other languages
English (en)
Dutch (nl)
Other versions
NL8203936A (nl
NL191545B (nl
Original Assignee
United Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Technologies Corp filed Critical United Technologies Corp
Publication of NL8203936A publication Critical patent/NL8203936A/nl
Publication of NL191545B publication Critical patent/NL191545B/xx
Application granted granted Critical
Publication of NL191545C publication Critical patent/NL191545C/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0082—Transmitting or indicating the displacement of capsules by electric, electromechanical, magnetic, or electromechanical means
    • G01L9/0086—Transmitting or indicating the displacement of capsules by electric, electromechanical, magnetic, or electromechanical means using variations in capacitance
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
NL8203936A 1981-10-13 1982-10-12 Werkwijze voor het vormen van een capacitieve druksensor. NL191545C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31059781 1981-10-13
US06/310,597 US4415948A (en) 1981-10-13 1981-10-13 Electrostatic bonded, silicon capacitive pressure transducer

Publications (3)

Publication Number Publication Date
NL8203936A NL8203936A (nl) 1983-05-02
NL191545B NL191545B (nl) 1995-05-01
NL191545C true NL191545C (nl) 1995-09-04

Family

ID=23203251

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8203936A NL191545C (nl) 1981-10-13 1982-10-12 Werkwijze voor het vormen van een capacitieve druksensor.

Country Status (15)

Country Link
US (1) US4415948A (fr)
JP (1) JPS5873166A (fr)
AU (1) AU560245B2 (fr)
BE (1) BE894631A (fr)
BR (1) BR8205851A (fr)
CA (1) CA1185453A (fr)
DE (1) DE3236848A1 (fr)
DK (1) DK441082A (fr)
FR (1) FR2514502A1 (fr)
GB (1) GB2107472B (fr)
GR (1) GR76997B (fr)
IE (1) IE53531B1 (fr)
IT (1) IT1153237B (fr)
LU (1) LU84413A1 (fr)
NL (1) NL191545C (fr)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558184A (en) * 1983-02-24 1985-12-10 At&T Bell Laboratories Integrated capacitive transducer
DE3310643C2 (de) * 1983-03-24 1986-04-10 Karlheinz Dr. 7801 Schallstadt Ziegler Drucksensor
US4467394A (en) * 1983-08-29 1984-08-21 United Technologies Corporation Three plate silicon-glass-silicon capacitive pressure transducer
CH662181A5 (de) * 1983-09-16 1987-09-15 Mettler Instrumente Ag Kraftmesser.
US4513348A (en) * 1984-01-13 1985-04-23 United Technologies Corporation Low parasitic capacitance pressure transducer and etch stop method
FI71015C (fi) * 1984-02-21 1986-10-27 Vaisala Oy Temperaturoberoende kapacitiv tryckgivare
FI74350C (fi) * 1984-02-21 1988-01-11 Vaisala Oy Kapacitiv absoluttryckgivare.
FI69211C (fi) * 1984-02-21 1985-12-10 Vaisala Oy Kapacitiv styckgivare
US4530029A (en) * 1984-03-12 1985-07-16 United Technologies Corporation Capacitive pressure sensor with low parasitic capacitance
US4536820A (en) * 1984-03-29 1985-08-20 General Signal Corporation Electrical feedthrough means for pressure transducer
FI842307A (fi) * 1984-06-07 1985-12-08 Vaisala Oy Foerfarande foer aostadkommande av genomfoering i en mikromekanisk konstruktion.
JPS6184537A (ja) * 1984-10-02 1986-04-30 Yokogawa Hokushin Electric Corp 容量式センサの製造方法
US4625561A (en) * 1984-12-06 1986-12-02 Ford Motor Company Silicon capacitive pressure sensor and method of making
US4586109A (en) * 1985-04-01 1986-04-29 Bourns Instruments, Inc. Batch-process silicon capacitive pressure sensor
US4744863A (en) * 1985-04-26 1988-05-17 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4853669A (en) * 1985-04-26 1989-08-01 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4625560A (en) * 1985-05-13 1986-12-02 The Scott & Fetzer Company Capacitive digital integrated circuit pressure transducer
US4743836A (en) * 1985-12-06 1988-05-10 United Technologies Corporation Capacitive circuit for measuring a parameter having a linear output voltage
JPS62265728A (ja) * 1986-05-14 1987-11-18 New Japan Radio Co Ltd アノ−デイツクボンデイング法
US4730496A (en) * 1986-06-23 1988-03-15 Rosemount Inc. Capacitance pressure sensor
JPS6367841U (fr) * 1986-10-20 1988-05-07
US4701826A (en) * 1986-10-30 1987-10-20 Ford Motor Company High temperature pressure sensor with low parasitic capacitance
US4701424A (en) * 1986-10-30 1987-10-20 Ford Motor Company Hermetic sealing of silicon
US4773972A (en) * 1986-10-30 1988-09-27 Ford Motor Company Method of making silicon capacitive pressure sensor with glass layer between silicon wafers
JPS63175482A (ja) * 1987-01-16 1988-07-19 Nissan Motor Co Ltd 圧力センサ
SE459887B (sv) * 1987-02-12 1989-08-14 Hydrolab Ab Tryckgivare
GB8718639D0 (en) * 1987-08-06 1987-09-09 Spectrol Reliance Ltd Capacitive pressure sensors
US4812199A (en) * 1987-12-21 1989-03-14 Ford Motor Company Rectilinearly deflectable element fabricated from a single wafer
SE461300B (sv) * 1988-05-17 1990-01-29 Hydrolab Ab Tryckmaetare
US5160560A (en) * 1988-06-02 1992-11-03 Hughes Aircraft Company Method of producing optically flat surfaces on processed silicon wafers
JPH0269630A (ja) * 1988-09-05 1990-03-08 Nippon Denso Co Ltd 半導体圧力センサ
US4951174A (en) * 1988-12-30 1990-08-21 United Technologies Corporation Capacitive pressure sensor with third encircling plate
US4954925A (en) * 1988-12-30 1990-09-04 United Technologies Corporation Capacitive sensor with minimized dielectric drift
US4879627A (en) * 1988-12-30 1989-11-07 United Technologies Corporation Differential capacitive pressure sensor with over-pressure protection
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
US5245504A (en) * 1989-02-28 1993-09-14 United Technologies Corporation Methodology for manufacturing hinged diaphragms for semiconductor sensors
US4998179A (en) * 1989-02-28 1991-03-05 United Technologies Corporation Capacitive semiconductive sensor with hinged diaphragm for planar movement
DE3937529A1 (de) * 1989-11-08 1991-05-16 Siemens Ag Verfahren zum verbinden eines siliziumteiles mit einem glasteil
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
US6314823B1 (en) 1991-09-20 2001-11-13 Kazuhiro Okada Force detector and acceleration detector and method of manufacturing the same
US5365790A (en) * 1992-04-02 1994-11-22 Motorola, Inc. Device with bonded conductive and insulating substrates and method therefore
FR2697675B1 (fr) * 1992-11-05 1995-01-06 Suisse Electronique Microtech Procédé de fabrication de transducteurs capacitifs intégrés.
US6282956B1 (en) 1994-12-29 2001-09-04 Kazuhiro Okada Multi-axial angular velocity sensor
US5440931A (en) * 1993-10-25 1995-08-15 United Technologies Corporation Reference element for high accuracy silicon capacitive pressure sensor
US5444901A (en) * 1993-10-25 1995-08-29 United Technologies Corporation Method of manufacturing silicon pressure sensor having dual elements simultaneously mounted
US5375034A (en) * 1993-12-02 1994-12-20 United Technologies Corporation Silicon capacitive pressure sensor having a glass dielectric deposited using ion milling
US5381299A (en) * 1994-01-28 1995-01-10 United Technologies Corporation Capacitive pressure sensor having a substrate with a curved mesa
US5448444A (en) * 1994-01-28 1995-09-05 United Technologies Corporation Capacitive pressure sensor having a reduced area dielectric spacer
US5744725A (en) * 1994-04-18 1998-04-28 Motorola Inc. Capacitive pressure sensor and method of fabricating same
US6211558B1 (en) * 1997-07-18 2001-04-03 Kavlico Corporation Surface micro-machined sensor with pedestal
JP3440037B2 (ja) * 1999-09-16 2003-08-25 三洋電機株式会社 半導体装置、半導体エレクトレットコンデンサマイクロホンおよび半導体エレクトレットコンデンサマイクロホンの製造方法。
JP4710147B2 (ja) * 2000-06-13 2011-06-29 株式会社デンソー 半導体圧力センサ
DE10036284A1 (de) * 2000-07-26 2002-02-07 Bosch Gmbh Robert Herstellungsverfahren für ein Sensorbauelement, insbesondere Dünnschicht-Hochdrucksensor und Sensorbauelement
JP4682415B2 (ja) * 2000-11-06 2011-05-11 富士電機システムズ株式会社 陽極接合方法
JP4671534B2 (ja) * 2001-05-14 2011-04-20 株式会社豊田中央研究所 ダイアフラム型半導体装置とその製造方法
US7028551B2 (en) * 2004-06-18 2006-04-18 Kavlico Corporation Linearity semi-conductive pressure sensor
FI119785B (fi) * 2004-09-23 2009-03-13 Vti Technologies Oy Kapasitiivinen anturi ja menetelmä kapasitiivisen anturin valmistamiseksi
US7345867B2 (en) * 2005-11-18 2008-03-18 Alps Electric Co., Ltd Capacitive pressure sensor and method of manufacturing the same
CN102183265A (zh) * 2011-02-10 2011-09-14 刘清惓 一种用于测量表面覆盖物的电容传感器及测量方法
JP5824385B2 (ja) * 2012-02-29 2015-11-25 アルプス電気株式会社 静電容量型物理量センサとその製造方法
JP5837846B2 (ja) * 2012-02-29 2015-12-24 アルプス電気株式会社 静電容量型物理量センサとその製造方法
CN103512698A (zh) * 2013-09-23 2014-01-15 沈阳仪表科学研究院有限公司 电容型绝压传感器及其制造方法
JP6300773B2 (ja) 2015-10-23 2018-03-28 三菱電機株式会社 半導体圧力センサ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634727A (en) * 1968-12-03 1972-01-11 Bendix Corp Capacitance-type pressure transducer
US3757414A (en) * 1971-03-26 1973-09-11 Honeywell Inc Method for batch fabricating semiconductor devices
US4016644A (en) * 1974-03-18 1977-04-12 Kulite Semiconductor Products, Inc. Methods of fabricating low pressure silicon transducers
US4121334A (en) * 1974-12-17 1978-10-24 P. R. Mallory & Co. Inc. Application of field-assisted bonding to the mass production of silicon type pressure transducers
US3993939A (en) * 1975-01-07 1976-11-23 The Bendix Corporation Pressure variable capacitor
US4092696A (en) * 1976-12-27 1978-05-30 Borg-Warner Corporation Variable area capacitive pressure transducer with temperature compensation
JPS5516228A (en) * 1978-07-21 1980-02-04 Hitachi Ltd Capacity type sensor

Also Published As

Publication number Publication date
BE894631A (fr) 1983-01-31
GB2107472A (en) 1983-04-27
IT1153237B (it) 1987-01-14
CA1185453A (fr) 1985-04-16
GB2107472B (en) 1985-08-21
AU1162983A (en) 1984-08-23
AU560245B2 (en) 1987-04-02
DE3236848A1 (de) 1983-04-21
IE53531B1 (en) 1988-12-07
LU84413A1 (fr) 1983-06-13
IE822452L (en) 1983-04-13
NL8203936A (nl) 1983-05-02
FR2514502A1 (fr) 1983-04-15
JPH0365486B2 (fr) 1991-10-14
NL191545B (nl) 1995-05-01
FR2514502B1 (fr) 1984-11-09
JPS5873166A (ja) 1983-05-02
US4415948A (en) 1983-11-15
IT8223727A0 (it) 1982-10-13
GR76997B (fr) 1984-09-04
DK441082A (da) 1983-04-14
BR8205851A (pt) 1983-09-06

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Legal Events

Date Code Title Description
A85 Still pending on 85-01-01
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 19960501