NL163899C - Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied. - Google Patents

Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied.

Info

Publication number
NL163899C
NL163899C NL6817050.A NL6817050A NL163899C NL 163899 C NL163899 C NL 163899C NL 6817050 A NL6817050 A NL 6817050A NL 163899 C NL163899 C NL 163899C
Authority
NL
Netherlands
Prior art keywords
fingers
frame member
semiconductor body
connection area
metal connection
Prior art date
Application number
NL6817050.A
Other languages
English (en)
Dutch (nl)
Other versions
NL6817050A (enExample
NL163899B (nl
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NL6817050A publication Critical patent/NL6817050A/xx
Publication of NL163899B publication Critical patent/NL163899B/xx
Application granted granted Critical
Publication of NL163899C publication Critical patent/NL163899C/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07632—Compression bonding, e.g. thermocompression bonding
    • H10W72/07633—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Push-Button Switches (AREA)
NL6817050.A 1967-12-15 1968-11-28 Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied. NL163899C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104167A 1967-12-15 1967-12-15

Publications (3)

Publication Number Publication Date
NL6817050A NL6817050A (enExample) 1969-06-17
NL163899B NL163899B (nl) 1980-05-16
NL163899C true NL163899C (nl) 1980-10-15

Family

ID=24774934

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6817050.A NL163899C (nl) 1967-12-15 1968-11-28 Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied.

Country Status (6)

Country Link
BE (1) BE725467A (enExample)
DE (1) DE1813164B2 (enExample)
FR (1) FR1599198A (enExample)
GB (1) GB1199849A (enExample)
IE (1) IE32531B1 (enExample)
NL (1) NL163899C (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
KR102152906B1 (ko) * 2018-11-20 2020-09-09 세메스 주식회사 본딩 장치 및 본딩 방법

Also Published As

Publication number Publication date
IE32531B1 (en) 1973-09-05
NL6817050A (enExample) 1969-06-17
FR1599198A (enExample) 1970-07-15
IE32531L (en) 1969-06-15
GB1199849A (en) 1970-07-22
DE1813164B2 (de) 1971-12-23
BE725467A (enExample) 1969-06-13
DE1813164A1 (de) 1969-07-03
NL163899B (nl) 1980-05-16

Similar Documents

Publication Publication Date Title
GB1109806A (en) Improvements in the interconnection of electrical circuit devices
GB1250469A (enExample)
GB1256518A (enExample)
GB1060397A (en) Improvements in and relating to the manufacture of semiconductor devices
NL163899B (nl) Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied.
JPS55118643A (en) Wire bonding process
JPH01115127A (ja) 半導体装置
NL7504380A (nl) Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten.
GB1529857A (en) Semiconductors
GB852826A (en) Improvements in the manufacture of hollow blades for fluid flow machines
JPS5449066A (en) Semiconductor device
GB1177517A (en) Method of Securing a Connecting Wire to a Microcircuit.
GB1057687A (en) Improvements in and relating to methods of manufacturing semiconductor devices
GB1275343A (en) Improvements relating to lead frames for use with semiconductor devices
JPS5348671A (en) Electrode structure of semiconductor element
JPS568851A (en) Lead wire connecting method of semiconductor device
GB1429358A (en) Electrical device manufacture
JPS6373544A (ja) リ−ドフレ−ム
JPS5814606Y2 (ja) 半導体装置
JPH02241672A (ja) ヒータチップおよびこれを用いたボンディング方法
NL190035C (nl) Werkwijze voor het vastlassen van halfgeleiderchips op een ondergrond van niet-edelmetaal.
KARP Bonding interconnecting thin-film circuits by means of soldering, welding, thermocompression, conductive adhesives and ultrasonic techniques
JPS60246656A (ja) 半導体装置用パツケ−ジ
JPS5842260A (ja) 半導体装置
GB903259A (en) A method of applying a contact to a semiconductor device

Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee