NL154871C - Montageband voor halfgeleiderinrichting, alsmede onder toepassing van een dergelijke montageband vervaardigde halfgeleiderinrichting. - Google Patents

Montageband voor halfgeleiderinrichting, alsmede onder toepassing van een dergelijke montageband vervaardigde halfgeleiderinrichting.

Info

Publication number
NL154871C
NL154871C NLAANVRAGE6703978,A NL6703978A NL154871C NL 154871 C NL154871 C NL 154871C NL 6703978 A NL6703978 A NL 6703978A NL 154871 C NL154871 C NL 154871C
Authority
NL
Netherlands
Prior art keywords
semiconductor device
mounting tape
device made
tape
mounting
Prior art date
Application number
NLAANVRAGE6703978,A
Other languages
English (en)
Dutch (nl)
Other versions
NL6703978A (fr
NL154871B (nl
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NL6703978A publication Critical patent/NL6703978A/xx
Publication of NL154871B publication Critical patent/NL154871B/xx
Application granted granted Critical
Publication of NL154871C publication Critical patent/NL154871C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/481—Disposition
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
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    • H01L2924/181—Encapsulation
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NLAANVRAGE6703978,A 1966-03-16 1967-03-16 Montageband voor halfgeleiderinrichting, alsmede onder toepassing van een dergelijke montageband vervaardigde halfgeleiderinrichting. NL154871C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53475266A 1966-03-16 1966-03-16

Publications (3)

Publication Number Publication Date
NL6703978A NL6703978A (fr) 1967-09-18
NL154871B NL154871B (nl) 1977-10-17
NL154871C true NL154871C (nl) 1982-09-16

Family

ID=24131381

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE6703978,A NL154871C (nl) 1966-03-16 1967-03-16 Montageband voor halfgeleiderinrichting, alsmede onder toepassing van een dergelijke montageband vervaardigde halfgeleiderinrichting.

Country Status (5)

Country Link
JP (1) JPS5110066B1 (fr)
DE (1) DE1614134B2 (fr)
FR (1) FR1513919A (fr)
GB (1) GB1173506A (fr)
NL (1) NL154871C (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
NL7018378A (fr) * 1970-12-17 1972-06-20
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
DE3942843A1 (de) * 1989-12-23 1991-06-27 Itt Ind Gmbh Deutsche Verkapselte monolithisch integrierte schaltung
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
DE19604614A1 (de) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Elektronisches Steuergerät mit einem Gehäuse

Also Published As

Publication number Publication date
DE1614134A1 (de) 1970-07-09
NL6703978A (fr) 1967-09-18
GB1173506A (en) 1969-12-10
DE1614134B2 (de) 1980-02-21
FR1513919A (fr) 1968-02-16
NL154871B (nl) 1977-10-17
JPS5110066B1 (fr) 1976-04-01

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Legal Events

Date Code Title Description
NP1G Not automatically granted patents, but text of patent specification modified with respect to the text of examined patent application
V4 Lapsed because of reaching the maximum lifetime of a patent