FR1513919A - Dispositif électronique enrobé dans une capsule en matière plastique et procédé pour le former - Google Patents

Dispositif électronique enrobé dans une capsule en matière plastique et procédé pour le former

Info

Publication number
FR1513919A
FR1513919A FR98274A FR98274A FR1513919A FR 1513919 A FR1513919 A FR 1513919A FR 98274 A FR98274 A FR 98274A FR 98274 A FR98274 A FR 98274A FR 1513919 A FR1513919 A FR 1513919A
Authority
FR
France
Prior art keywords
forming
electronic device
device embedded
plastic capsule
capsule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR98274A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of FR1513919A publication Critical patent/FR1513919A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR98274A 1966-03-16 1967-03-10 Dispositif électronique enrobé dans une capsule en matière plastique et procédé pour le former Expired FR1513919A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53475266A 1966-03-16 1966-03-16

Publications (1)

Publication Number Publication Date
FR1513919A true FR1513919A (fr) 1968-02-16

Family

ID=24131381

Family Applications (1)

Application Number Title Priority Date Filing Date
FR98274A Expired FR1513919A (fr) 1966-03-16 1967-03-10 Dispositif électronique enrobé dans une capsule en matière plastique et procédé pour le former

Country Status (5)

Country Link
JP (1) JPS5110066B1 (fr)
DE (1) DE1614134B2 (fr)
FR (1) FR1513919A (fr)
GB (1) GB1173506A (fr)
NL (1) NL154871C (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118154A1 (fr) * 1970-12-17 1972-07-28 Philips Nv
JPS4922617B1 (fr) * 1969-10-06 1974-06-10

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
DE3942843A1 (de) * 1989-12-23 1991-06-27 Itt Ind Gmbh Deutsche Verkapselte monolithisch integrierte schaltung
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
DE19604614A1 (de) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Elektronisches Steuergerät mit einem Gehäuse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922617B1 (fr) * 1969-10-06 1974-06-10
FR2118154A1 (fr) * 1970-12-17 1972-07-28 Philips Nv

Also Published As

Publication number Publication date
NL6703978A (fr) 1967-09-18
DE1614134B2 (de) 1980-02-21
JPS5110066B1 (fr) 1976-04-01
NL154871C (nl) 1982-09-16
GB1173506A (en) 1969-12-10
DE1614134A1 (de) 1970-07-09
NL154871B (nl) 1977-10-17

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