JPS5110066B1 - - Google Patents

Info

Publication number
JPS5110066B1
JPS5110066B1 JP42016339A JP1633967A JPS5110066B1 JP S5110066 B1 JPS5110066 B1 JP S5110066B1 JP 42016339 A JP42016339 A JP 42016339A JP 1633967 A JP1633967 A JP 1633967A JP S5110066 B1 JPS5110066 B1 JP S5110066B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP42016339A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5110066B1 publication Critical patent/JPS5110066B1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
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    • H01L2924/181—Encapsulation
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP42016339A 1966-03-16 1967-03-16 Pending JPS5110066B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53475266A 1966-03-16 1966-03-16

Publications (1)

Publication Number Publication Date
JPS5110066B1 true JPS5110066B1 (fr) 1976-04-01

Family

ID=24131381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP42016339A Pending JPS5110066B1 (fr) 1966-03-16 1967-03-16

Country Status (5)

Country Link
JP (1) JPS5110066B1 (fr)
DE (1) DE1614134B2 (fr)
FR (1) FR1513919A (fr)
GB (1) GB1173506A (fr)
NL (1) NL154871C (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
NL7018378A (fr) * 1970-12-17 1972-06-20
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
DE3942843A1 (de) * 1989-12-23 1991-06-27 Itt Ind Gmbh Deutsche Verkapselte monolithisch integrierte schaltung
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
DE19604614A1 (de) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Elektronisches Steuergerät mit einem Gehäuse

Also Published As

Publication number Publication date
DE1614134A1 (de) 1970-07-09
NL6703978A (fr) 1967-09-18
GB1173506A (en) 1969-12-10
DE1614134B2 (de) 1980-02-21
FR1513919A (fr) 1968-02-16
NL154871B (nl) 1977-10-17
NL154871C (nl) 1982-09-16

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