NL154871C - MOUNTING TAPE FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MADE BY USING SUCH MOUNTING TAPE. - Google Patents

MOUNTING TAPE FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MADE BY USING SUCH MOUNTING TAPE.

Info

Publication number
NL154871C
NL154871C NLAANVRAGE6703978,A NL6703978A NL154871C NL 154871 C NL154871 C NL 154871C NL 6703978 A NL6703978 A NL 6703978A NL 154871 C NL154871 C NL 154871C
Authority
NL
Netherlands
Prior art keywords
semiconductor device
mounting tape
device made
tape
mounting
Prior art date
Application number
NLAANVRAGE6703978,A
Other languages
Dutch (nl)
Other versions
NL6703978A (en
NL154871B (en
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NL6703978A publication Critical patent/NL6703978A/xx
Publication of NL154871B publication Critical patent/NL154871B/en
Application granted granted Critical
Publication of NL154871C publication Critical patent/NL154871C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
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    • H01L2924/181—Encapsulation
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NLAANVRAGE6703978,A 1966-03-16 1967-03-16 MOUNTING TAPE FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MADE BY USING SUCH MOUNTING TAPE. NL154871C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53475266A 1966-03-16 1966-03-16

Publications (3)

Publication Number Publication Date
NL6703978A NL6703978A (en) 1967-09-18
NL154871B NL154871B (en) 1977-10-17
NL154871C true NL154871C (en) 1982-09-16

Family

ID=24131381

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE6703978,A NL154871C (en) 1966-03-16 1967-03-16 MOUNTING TAPE FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MADE BY USING SUCH MOUNTING TAPE.

Country Status (5)

Country Link
JP (1) JPS5110066B1 (en)
DE (1) DE1614134B2 (en)
FR (1) FR1513919A (en)
GB (1) GB1173506A (en)
NL (1) NL154871C (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (en) * 1969-10-06 1971-03-16 Grisby Barton Inc RELAY ASSEMBLY
NL7018378A (en) * 1970-12-17 1972-06-20
DE3040676A1 (en) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Semiconductor devices made using metal lead frame strip - where leads are coated with tin prior to assembling semiconductor chips into strip
DE3942843A1 (en) * 1989-12-23 1991-06-27 Itt Ind Gmbh Deutsche Encapsulated monolithic integrated circuit - uses low resistance connections between lead frame and chip
DE4031051C2 (en) * 1989-11-14 1997-05-07 Siemens Ag Module with at least one semiconductor switching element and a control circuit
DE19604614A1 (en) * 1996-02-08 1997-08-14 Bayerische Motoren Werke Ag Encapsulated electronic control device e.g. for motor vehicles

Also Published As

Publication number Publication date
NL6703978A (en) 1967-09-18
DE1614134B2 (en) 1980-02-21
GB1173506A (en) 1969-12-10
DE1614134A1 (en) 1970-07-09
FR1513919A (en) 1968-02-16
JPS5110066B1 (en) 1976-04-01
NL154871B (en) 1977-10-17

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NP1G Not automatically granted patents, but text of patent specification modified with respect to the text of examined patent application
V4 Lapsed because of reaching the maximum lifetime of a patent