NL1033467C2 - Matrix, ondersteuning en behuizing van een inrichting voor beeldopname, overeenkomstige vervaardigingswerkwijzen. - Google Patents
Matrix, ondersteuning en behuizing van een inrichting voor beeldopname, overeenkomstige vervaardigingswerkwijzen. Download PDFInfo
- Publication number
- NL1033467C2 NL1033467C2 NL1033467A NL1033467A NL1033467C2 NL 1033467 C2 NL1033467 C2 NL 1033467C2 NL 1033467 A NL1033467 A NL 1033467A NL 1033467 A NL1033467 A NL 1033467A NL 1033467 C2 NL1033467 C2 NL 1033467C2
- Authority
- NL
- Netherlands
- Prior art keywords
- matrix
- zone
- support
- housing
- cmos
- Prior art date
Links
- 239000011159 matrix material Substances 0.000 title claims description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 21
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 230000010070 molecular adhesion Effects 0.000 claims description 9
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 230000010287 polarization Effects 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 8
- 238000002161 passivation Methods 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 238000002513 implantation Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 238000005224 laser annealing Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- -1 hydrogen ions Chemical class 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008447 perception Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/12—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices with means for image conversion or intensification
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0601860A FR2898216B1 (fr) | 2006-03-02 | 2006-03-02 | Matrice, support et boitier d'un dispositif de captation d'image, procedes de fabrication correspondants |
| FR0601860 | 2006-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL1033467A1 NL1033467A1 (nl) | 2007-09-04 |
| NL1033467C2 true NL1033467C2 (nl) | 2008-01-29 |
Family
ID=37189410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL1033467A NL1033467C2 (nl) | 2006-03-02 | 2007-02-28 | Matrix, ondersteuning en behuizing van een inrichting voor beeldopname, overeenkomstige vervaardigingswerkwijzen. |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2898216B1 (fr) |
| NL (1) | NL1033467C2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2929001B1 (fr) * | 2008-03-18 | 2010-03-05 | Thales Sa | Dispositif de detection de rayonnement ultraviolet de type ebcmos hybride comportant une membrane insensible au rayonnement solaire |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1154457A1 (fr) * | 1999-01-21 | 2001-11-14 | Hamamatsu Photonics K.K. | Tube electronique |
| US20050051859A1 (en) * | 2001-10-25 | 2005-03-10 | Amkor Technology, Inc. | Look down image sensor package |
| US20050139848A1 (en) * | 2003-12-31 | 2005-06-30 | Kuo-Chung Yee | Image sensor package and method for manufacturing the same |
-
2006
- 2006-03-02 FR FR0601860A patent/FR2898216B1/fr not_active Expired - Fee Related
-
2007
- 2007-02-28 NL NL1033467A patent/NL1033467C2/nl not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1154457A1 (fr) * | 1999-01-21 | 2001-11-14 | Hamamatsu Photonics K.K. | Tube electronique |
| US20050051859A1 (en) * | 2001-10-25 | 2005-03-10 | Amkor Technology, Inc. | Look down image sensor package |
| US20050139848A1 (en) * | 2003-12-31 | 2005-06-30 | Kuo-Chung Yee | Image sensor package and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2898216A1 (fr) | 2007-09-07 |
| NL1033467A1 (nl) | 2007-09-04 |
| FR2898216B1 (fr) | 2008-06-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AD1A | A request for search or an international type search has been filed | ||
| RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20070924 |
|
| PD2B | A search report has been drawn up | ||
| V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20150901 |