NL1033171A1 - Samenstel van een gedrukte schakelkaart. - Google Patents

Samenstel van een gedrukte schakelkaart.

Info

Publication number
NL1033171A1
NL1033171A1 NL1033171A NL1033171A NL1033171A1 NL 1033171 A1 NL1033171 A1 NL 1033171A1 NL 1033171 A NL1033171 A NL 1033171A NL 1033171 A NL1033171 A NL 1033171A NL 1033171 A1 NL1033171 A1 NL 1033171A1
Authority
NL
Netherlands
Prior art keywords
assembly
printed circuit
circuit card
card
printed
Prior art date
Application number
NL1033171A
Other languages
English (en)
Other versions
NL1033171C2 (nl
Inventor
Seung-Young Ahn
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of NL1033171A1 publication Critical patent/NL1033171A1/nl
Application granted granted Critical
Publication of NL1033171C2 publication Critical patent/NL1033171C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
NL1033171A 2006-01-16 2007-01-04 Samenstel van een gedrukte schakelkaart. NL1033171C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060004580A KR100726458B1 (ko) 2006-01-16 2006-01-16 기판조립체
KR20060004580 2006-01-16

Publications (2)

Publication Number Publication Date
NL1033171A1 true NL1033171A1 (nl) 2007-07-17
NL1033171C2 NL1033171C2 (nl) 2011-04-04

Family

ID=38268356

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1033171A NL1033171C2 (nl) 2006-01-16 2007-01-04 Samenstel van een gedrukte schakelkaart.

Country Status (6)

Country Link
US (1) US7778040B2 (nl)
KR (1) KR100726458B1 (nl)
CN (1) CN101005732A (nl)
DE (1) DE102007002202A1 (nl)
IT (1) ITTO20070020A1 (nl)
NL (1) NL1033171C2 (nl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101594729B (zh) * 2008-05-27 2012-06-20 鸿富锦精密工业（深圳）有限公司 一种可补偿过孔残端电容特性的电路板
US8241067B2 (en) * 2009-11-04 2012-08-14 Amphenol Corporation Surface mount footprint in-line capacitance
CN102142411B (zh) * 2010-02-01 2012-12-12 华为终端有限公司 一种印刷电路组装板芯片封装部件以及焊接部件
CN102316672A (zh) * 2010-07-05 2012-01-11 鸿富锦精密工业（深圳）有限公司 印刷电路板
JP2012151365A (ja) * 2011-01-20 2012-08-09 Three M Innovative Properties Co 基板及びそれを含む電子部品
DE102011080429A1 (de) 2011-08-04 2013-02-07 Endress + Hauser Gmbh + Co. Kg Galvanisch getrennter Richtkoppler
US10320099B2 (en) 2016-06-10 2019-06-11 Te Connectivity Corporation Connector with asymmetric base section
US10263352B2 (en) 2016-06-10 2019-04-16 Te Connectivity Corporation Electrical contact pad for electrically contacting a connector
US10128597B2 (en) * 2016-06-10 2018-11-13 Te Connectivity Corporation Electrical contact pad for electrically contacting a connector
KR101777716B1 (ko) * 2016-08-04 2017-09-18 자화전자(주) 회로기판 및 이를 포함하는 진동 발생장치
US9997868B1 (en) 2017-07-24 2018-06-12 Te Connectivity Corporation Electrical connector with improved impedance characteristics
CN107918581A (zh) * 2017-11-09 2018-04-17 郑州云海信息技术有限公司 一种针对高速信号连接器优化分析方法与系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631169B1 (fr) * 1988-05-04 1990-07-13 Cit Alcatel Dispositif de distribution de signaux numeriques a tres hauts debits
US5093640A (en) 1989-09-29 1992-03-03 Hewlett-Packard Company Microstrip structure having contact pad compensation
US5448208A (en) * 1993-07-15 1995-09-05 Nec Corporation Semiconductor integrated circuit having an equal propagation delay
JPH07106759A (ja) * 1993-09-30 1995-04-21 Sony Corp 薄膜多層基板
JP2882994B2 (ja) 1994-03-11 1999-04-19 株式会社ピーエフユー コンデンサを実装したプリント板
JP3599205B2 (ja) 1995-09-12 2004-12-08 Ｔｄｋ株式会社 ノイズ抑制用インダクタ素子
JPH09214076A (ja) 1996-02-05 1997-08-15 Fujitsu Ltd プリント配線基板
US6016084A (en) 1996-12-27 2000-01-18 Canon Kabushiki Kaisha Method for connecting printed circuit board with housing, and electronic instrument having connection structure according to the connecting method
US6538538B2 (en) 1999-02-25 2003-03-25 Formfactor, Inc. High frequency printed circuit board via
JP2000286512A (ja) 1999-03-29 2000-10-13 Kokusai Electric Co Ltd プリント基板
JP2001148553A (ja) 1999-11-19 2001-05-29 Fujitsu General Ltd マイクロ波回路
US6480395B1 (en) * 2000-05-25 2002-11-12 Hewlett-Packard Company Device and method for interstitial components in a printed circuit board
KR100384880B1 (ko) * 2000-12-28 2003-05-22 주식회사 하이닉스반도체 인쇄회로기판
KR20030084511A (ko) * 2002-04-27 2003-11-01 삼성전자주식회사 타이 바의 부하효과를 보상하는 수단을 구비한 반도체메모리 모듈
TW200507131A (en) * 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
TW594961B (en) * 2003-07-24 2004-06-21 Via Tech Inc Signal transmission structure
CN1250057C (zh) 2003-08-01 2006-04-05 威盛电子股份有限公司 信号传输结构
JP4133786B2 (ja) * 2003-12-16 2008-08-13 日東電工株式会社 配線回路基板
US7405634B2 (en) * 2004-01-30 2008-07-29 Dell Products L.P. Method for altering the delay properties of a transmission line using compensation tabs

Also Published As

Publication number Publication date
NL1033171C2 (nl) 2011-04-04
US7778040B2 (en) 2010-08-17
ITTO20070020A1 (it) 2007-07-17
DE102007002202A1 (de) 2007-08-02
CN101005732A (zh) 2007-07-25
US20070165389A1 (en) 2007-07-19
KR100726458B1 (ko) 2007-06-11

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MM Lapsed because of non-payment of the annual fee

Effective date: 20160201