NL1030195C2 - Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten. - Google Patents

Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten. Download PDF

Info

Publication number
NL1030195C2
NL1030195C2 NL1030195A NL1030195A NL1030195C2 NL 1030195 C2 NL1030195 C2 NL 1030195C2 NL 1030195 A NL1030195 A NL 1030195A NL 1030195 A NL1030195 A NL 1030195A NL 1030195 C2 NL1030195 C2 NL 1030195C2
Authority
NL
Netherlands
Prior art keywords
laser beam
carrier
angle
laser
cutting
Prior art date
Application number
NL1030195A
Other languages
English (en)
Dutch (nl)
Inventor
Joannes Leonardus Jurrian Zijl
Henri Joseph Van Egmond
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1030195A priority Critical patent/NL1030195C2/nl
Priority to EP06799542A priority patent/EP1938675A2/fr
Priority to KR1020087011236A priority patent/KR20080070650A/ko
Priority to CNA2006800409962A priority patent/CN101300910A/zh
Priority to PCT/NL2006/050253 priority patent/WO2007043884A2/fr
Priority to TW095137302A priority patent/TWI397357B/zh
Application granted granted Critical
Publication of NL1030195C2 publication Critical patent/NL1030195C2/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1527—Obliquely held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
NL1030195A 2005-10-14 2005-10-14 Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten. NL1030195C2 (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL1030195A NL1030195C2 (nl) 2005-10-14 2005-10-14 Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten.
EP06799542A EP1938675A2 (fr) 2005-10-14 2006-10-09 Procede et dispositif de decoupe au laser selon un angle aigu de supports de composants electroniques
KR1020087011236A KR20080070650A (ko) 2005-10-14 2006-10-09 전자부품용 캐리어를 예각으로 레이저 절단하는 방법 및장치
CNA2006800409962A CN101300910A (zh) 2005-10-14 2006-10-09 以锐角利用激光切割电子元件载体的方法和装置
PCT/NL2006/050253 WO2007043884A2 (fr) 2005-10-14 2006-10-09 Procede et dispositif de decoupe au laser selon un angle aigu de supports de composants electroniques
TW095137302A TWI397357B (zh) 2005-10-14 2006-10-11 用雷射以銳角切割電子元件之載具的方法與裝置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1030195 2005-10-14
NL1030195A NL1030195C2 (nl) 2005-10-14 2005-10-14 Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten.

Publications (1)

Publication Number Publication Date
NL1030195C2 true NL1030195C2 (nl) 2007-04-17

Family

ID=35713600

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1030195A NL1030195C2 (nl) 2005-10-14 2005-10-14 Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten.

Country Status (6)

Country Link
EP (1) EP1938675A2 (fr)
KR (1) KR20080070650A (fr)
CN (1) CN101300910A (fr)
NL (1) NL1030195C2 (fr)
TW (1) TWI397357B (fr)
WO (1) WO2007043884A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2105240B1 (fr) * 2008-03-28 2011-10-05 Siemens Aktiengesellschaft Procédé de percage d`un trou
KR101097324B1 (ko) 2009-12-29 2011-12-23 삼성모바일디스플레이주식회사 레이저 커팅 방법 및 유기 발광 소자의 제조방법
CN104427765B (zh) * 2013-08-20 2017-06-27 深圳崇达多层线路板有限公司 Ptfe覆铜板的加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0437676A1 (fr) * 1989-12-08 1991-07-24 Mitsubishi Denki Kabushiki Kaisha Machine de coupage au laser
JPH11197866A (ja) * 1998-01-16 1999-07-27 Fuji Electric Co Ltd レーザ加工装置およびワークのレーザ切断方法
US20020170891A1 (en) * 2001-03-22 2002-11-21 Adrian Boyle Laser machining system and method
US20040164060A1 (en) * 2003-02-17 2004-08-26 International Business Machines Corporation Hole drilling method and apparatus
US20050070075A1 (en) * 2003-09-26 2005-03-31 Yusuke Nagai Laser beam processing method and laser beam machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0437676A1 (fr) * 1989-12-08 1991-07-24 Mitsubishi Denki Kabushiki Kaisha Machine de coupage au laser
JPH11197866A (ja) * 1998-01-16 1999-07-27 Fuji Electric Co Ltd レーザ加工装置およびワークのレーザ切断方法
US20020170891A1 (en) * 2001-03-22 2002-11-21 Adrian Boyle Laser machining system and method
US20040164060A1 (en) * 2003-02-17 2004-08-26 International Business Machines Corporation Hole drilling method and apparatus
US20050070075A1 (en) * 2003-09-26 2005-03-31 Yusuke Nagai Laser beam processing method and laser beam machine

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *

Also Published As

Publication number Publication date
TWI397357B (zh) 2013-05-21
TW200731895A (en) 2007-08-16
EP1938675A2 (fr) 2008-07-02
WO2007043884A3 (fr) 2008-05-22
KR20080070650A (ko) 2008-07-30
WO2007043884A2 (fr) 2007-04-19
CN101300910A (zh) 2008-11-05

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