NL1026573A1 - Werkwijze voor de productie van een halfgeleider-bouwelement alsmede halfgeleider-bouwelement. - Google Patents

Werkwijze voor de productie van een halfgeleider-bouwelement alsmede halfgeleider-bouwelement.

Info

Publication number
NL1026573A1
NL1026573A1 NL1026573A NL1026573A NL1026573A1 NL 1026573 A1 NL1026573 A1 NL 1026573A1 NL 1026573 A NL1026573 A NL 1026573A NL 1026573 A NL1026573 A NL 1026573A NL 1026573 A1 NL1026573 A1 NL 1026573A1
Authority
NL
Netherlands
Prior art keywords
semiconductor element
semiconductor component
circuit board
accordance
flip chip
Prior art date
Application number
NL1026573A
Other languages
English (en)
Other versions
NL1026573C2 (nl
Inventor
Yasukazu Nakata
Masateru Yamakage
Naoki Hasegawa
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of NL1026573A1 publication Critical patent/NL1026573A1/nl
Application granted granted Critical
Publication of NL1026573C2 publication Critical patent/NL1026573C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/05573—Single external layer
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83859—Localised curing of parts of the layer connector
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    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83874—Ultraviolet [UV] curing
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NL1026573A 2003-07-08 2004-07-05 Werkwijze voor de productie van een halfgeleider-bouwelement alsmede halfgeleider-bouwelement. NL1026573C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003271844 2003-07-08
JP2003271844A JP2005033053A (ja) 2003-07-08 2003-07-08 半導体装置の製造方法及び半導体装置

Publications (2)

Publication Number Publication Date
NL1026573A1 true NL1026573A1 (nl) 2005-01-11
NL1026573C2 NL1026573C2 (nl) 2007-08-24

Family

ID=33562679

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1026573A NL1026573C2 (nl) 2003-07-08 2004-07-05 Werkwijze voor de productie van een halfgeleider-bouwelement alsmede halfgeleider-bouwelement.

Country Status (6)

Country Link
US (1) US6927099B2 (nl)
JP (1) JP2005033053A (nl)
KR (1) KR20050006037A (nl)
DE (1) DE102004029232A1 (nl)
NL (1) NL1026573C2 (nl)
SG (1) SG118287A1 (nl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064239A (ja) * 2003-08-12 2005-03-10 Lintec Corp 半導体装置の製造方法
JP4671775B2 (ja) * 2004-06-25 2011-04-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4636850B2 (ja) * 2004-10-29 2011-02-23 富士通株式会社 電子部品の実装方法
JP2007194271A (ja) * 2006-01-17 2007-08-02 Olympus Imaging Corp 撮像素子の実装構造
JP4902229B2 (ja) * 2006-03-07 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
JP5644286B2 (ja) * 2010-09-07 2014-12-24 オムロン株式会社 電子部品の表面実装方法及び電子部品が実装された基板
US9278584B2 (en) * 2011-10-31 2016-03-08 Innovative Technologies, Llc All-weather tire
KR101274674B1 (ko) * 2011-11-02 2013-06-17 에스케이하이이엔지 주식회사 자외선 또는 극초단파를 이용한 반도체 디바이스 접합 장치 및 그 방법
TWI596985B (zh) * 2015-07-22 2017-08-21 億光電子工業股份有限公司 發光裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864178A (en) * 1995-01-12 1999-01-26 Kabushiki Kaisha Toshiba Semiconductor device with improved encapsulating resin
JP2924830B2 (ja) * 1996-11-15 1999-07-26 日本電気株式会社 半導体装置及びその製造方法
JPH10340927A (ja) * 1997-06-06 1998-12-22 Matsushita Electron Corp 半導体装置の製造方法およびボンディング装置
US6225704B1 (en) * 1999-02-12 2001-05-01 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
US6589802B1 (en) * 1999-12-24 2003-07-08 Hitachi, Ltd. Packaging structure and method of packaging electronic parts
JP2001308145A (ja) * 2000-04-25 2001-11-02 Fujitsu Ltd 半導体チップの実装方法
US6635971B2 (en) * 2001-01-11 2003-10-21 Hitachi, Ltd. Electronic device and optical transmission module
DE10232636A1 (de) * 2002-07-18 2004-02-12 Delo Industrieklebstoffe Gmbh & Co. Kg Verfahren und Klebstoff zur Flip-Chip-Kontaktierung

Also Published As

Publication number Publication date
DE102004029232A1 (de) 2005-05-25
US6927099B2 (en) 2005-08-09
SG118287A1 (en) 2006-01-27
JP2005033053A (ja) 2005-02-03
NL1026573C2 (nl) 2007-08-24
US20050009241A1 (en) 2005-01-13
KR20050006037A (ko) 2005-01-15

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