NL1015799C2 - Moederboard. - Google Patents

Moederboard. Download PDF

Info

Publication number
NL1015799C2
NL1015799C2 NL1015799A NL1015799A NL1015799C2 NL 1015799 C2 NL1015799 C2 NL 1015799C2 NL 1015799 A NL1015799 A NL 1015799A NL 1015799 A NL1015799 A NL 1015799A NL 1015799 C2 NL1015799 C2 NL 1015799C2
Authority
NL
Netherlands
Prior art keywords
motherboard
board
connector
bus line
connectors
Prior art date
Application number
NL1015799A
Other languages
English (en)
Dutch (nl)
Inventor
Hiroshi Higashida
Kimiyasu Makino
Original Assignee
Kel Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kel Kk filed Critical Kel Kk
Application granted granted Critical
Publication of NL1015799C2 publication Critical patent/NL1015799C2/nl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1458Active back panels; Back panels with filtering means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/409Mechanical coupling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/044Details of backplane or midplane for mounting orthogonal PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10022Non-printed resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
NL1015799A 1999-07-28 2000-07-25 Moederboard. NL1015799C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21397199 1999-07-28
JP21397199A JP3621608B2 (ja) 1999-07-28 1999-07-28 マザーボード

Publications (1)

Publication Number Publication Date
NL1015799C2 true NL1015799C2 (nl) 2001-01-30

Family

ID=16648107

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1015799A NL1015799C2 (nl) 1999-07-28 2000-07-25 Moederboard.

Country Status (5)

Country Link
US (1) US6328572B1 (fr)
JP (1) JP3621608B2 (fr)
DE (1) DE10036934B4 (fr)
FR (1) FR2797527B1 (fr)
NL (1) NL1015799C2 (fr)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4383601B2 (ja) * 1999-09-30 2009-12-16 株式会社東芝 高速メモリ装置、高速メモリ装置のソケット実装構造、及び高速メモリ装置の実装方法
US7635390B1 (en) 2000-01-14 2009-12-22 Marctec, Llc Joint replacement component having a modular articulating surface
US6702821B2 (en) 2000-01-14 2004-03-09 The Bonutti 2003 Trust A Instrumentation for minimally invasive joint replacement and methods for using same
US6770078B2 (en) 2000-01-14 2004-08-03 Peter M. Bonutti Movable knee implant and methods therefor
US6528737B1 (en) * 2000-08-16 2003-03-04 Nortel Networks Limited Midplane configuration featuring surface contact connectors
WO2002042947A1 (fr) * 2000-11-24 2002-05-30 Italtel S.P.A. Systeme de prototypage
US6724082B2 (en) * 2001-07-23 2004-04-20 Intel Corporation Systems having modules with selectable on die terminations
US6674649B2 (en) * 2001-07-23 2004-01-06 Intel Corporation Systems having modules sharing on module terminations
US6674648B2 (en) * 2001-07-23 2004-01-06 Intel Corporation Termination cards and systems therefore
US6717823B2 (en) * 2001-07-23 2004-04-06 Intel Corporation Systems having modules with buffer chips
US6918078B2 (en) * 2001-07-23 2005-07-12 Intel Corporation Systems with modules sharing terminations
US6771515B2 (en) * 2001-07-23 2004-08-03 Intel Corporation Systems having modules with on die terminations
US6711027B2 (en) * 2001-07-23 2004-03-23 Intel Corporation Modules having paths of different impedances
US6631083B2 (en) 2001-07-23 2003-10-07 Intel Corporation Systems with modules and clocking therefore
US7708741B1 (en) 2001-08-28 2010-05-04 Marctec, Llc Method of preparing bones for knee replacement surgery
JP2003204340A (ja) * 2001-10-31 2003-07-18 Yazaki Corp 車載用多重通信装置
US6867554B2 (en) * 2001-12-03 2005-03-15 International Rectifier Corporation Ballast control card
US7539183B2 (en) * 2002-06-24 2009-05-26 Emerson Network Power - Embedded Computing, Inc. Multi-service platform system and method
US6881078B1 (en) * 2002-12-19 2005-04-19 Sun Microsystems, Inc. Interconnecting device that allows for connections in small space
US7837690B2 (en) 2003-01-15 2010-11-23 Biomet Manufacturing Corp. Method and apparatus for less invasive knee resection
US8551100B2 (en) 2003-01-15 2013-10-08 Biomet Manufacturing, Llc Instrumentation for knee resection
US7789885B2 (en) 2003-01-15 2010-09-07 Biomet Manufacturing Corp. Instrumentation for knee resection
US7887542B2 (en) 2003-01-15 2011-02-15 Biomet Manufacturing Corp. Method and apparatus for less invasive knee resection
JP4233360B2 (ja) * 2003-03-07 2009-03-04 三菱電機株式会社 高速通信用プリント配線基板
CN2626161Y (zh) * 2003-04-28 2004-07-14 华为技术有限公司 一种双面插背板
US6824394B1 (en) * 2003-07-01 2004-11-30 Phionics, Inc. Modular sensor systems with elastomeric connectors
US7488324B1 (en) 2003-12-08 2009-02-10 Biomet Manufacturing Corporation Femoral guide for implanting a femoral knee prosthesis
US7094102B2 (en) * 2004-07-01 2006-08-22 Amphenol Corporation Differential electrical connector assembly
US7108556B2 (en) * 2004-07-01 2006-09-19 Amphenol Corporation Midplane especially applicable to an orthogonal architecture electronic system
US8444436B1 (en) 2004-07-01 2013-05-21 Amphenol Corporation Midplane especially applicable to an orthogonal architecture electronic system
US7695479B1 (en) 2005-04-12 2010-04-13 Biomet Manufacturing Corp. Femoral sizer
FR2886504B1 (fr) * 2005-05-30 2007-08-03 Eurocopter France Dispositif d'interconnexion reconfigurable de faisceaux electriques
US7914304B2 (en) 2005-06-30 2011-03-29 Amphenol Corporation Electrical connector with conductors having diverging portions
US20090291593A1 (en) 2005-06-30 2009-11-26 Prescott Atkinson High frequency broadside-coupled electrical connector
US20150335438A1 (en) 2006-02-27 2015-11-26 Biomet Manufacturing, Llc. Patient-specific augments
US8603180B2 (en) 2006-02-27 2013-12-10 Biomet Manufacturing, Llc Patient-specific acetabular alignment guides
US7780672B2 (en) 2006-02-27 2010-08-24 Biomet Manufacturing Corp. Femoral adjustment device and associated method
US9339278B2 (en) 2006-02-27 2016-05-17 Biomet Manufacturing, Llc Patient-specific acetabular guides and associated instruments
US8070752B2 (en) 2006-02-27 2011-12-06 Biomet Manufacturing Corp. Patient specific alignment guide and inter-operative adjustment
US9918740B2 (en) 2006-02-27 2018-03-20 Biomet Manufacturing, Llc Backup surgical instrument system and method
US10278711B2 (en) 2006-02-27 2019-05-07 Biomet Manufacturing, Llc Patient-specific femoral guide
US8591516B2 (en) 2006-02-27 2013-11-26 Biomet Manufacturing, Llc Patient-specific orthopedic instruments
US9113971B2 (en) 2006-02-27 2015-08-25 Biomet Manufacturing, Llc Femoral acetabular impingement guide
US8407067B2 (en) 2007-04-17 2013-03-26 Biomet Manufacturing Corp. Method and apparatus for manufacturing an implant
US9289253B2 (en) 2006-02-27 2016-03-22 Biomet Manufacturing, Llc Patient-specific shoulder guide
US9907659B2 (en) 2007-04-17 2018-03-06 Biomet Manufacturing, Llc Method and apparatus for manufacturing an implant
US9345548B2 (en) 2006-02-27 2016-05-24 Biomet Manufacturing, Llc Patient-specific pre-operative planning
US9173661B2 (en) 2006-02-27 2015-11-03 Biomet Manufacturing, Llc Patient specific alignment guide with cutting surface and laser indicator
US7704253B2 (en) * 2006-03-06 2010-04-27 Howmedica Osteonics Corp. Single use resection guide
US7695520B2 (en) 2006-05-31 2010-04-13 Biomet Manufacturing Corp. Prosthesis and implementation system
US9795399B2 (en) 2006-06-09 2017-10-24 Biomet Manufacturing, Llc Patient-specific knee alignment guide and associated method
CN101217379A (zh) * 2008-01-10 2008-07-09 华为技术有限公司 一种背板和通信设备
KR20110039275A (ko) * 2008-07-25 2011-04-15 후지쯔 가부시끼가이샤 전자 장치
CN107069274B (zh) 2010-05-07 2020-08-18 安费诺有限公司 高性能线缆连接器
US9968376B2 (en) 2010-11-29 2018-05-15 Biomet Manufacturing, Llc Patient-specific orthopedic instruments
US8491313B2 (en) 2011-02-02 2013-07-23 Amphenol Corporation Mezzanine connector
US9241745B2 (en) 2011-03-07 2016-01-26 Biomet Manufacturing, Llc Patient-specific femoral version guide
TWI464563B (zh) * 2012-04-20 2014-12-11 Gemtek Technology Co Ltd 電子裝置組合結構
US9240644B2 (en) 2012-08-22 2016-01-19 Amphenol Corporation High-frequency electrical connector
US9905975B2 (en) 2014-01-22 2018-02-27 Amphenol Corporation Very high speed, high density electrical interconnection system with edge to broadside transition
CN108701922B (zh) 2015-07-07 2020-02-14 Afci亚洲私人有限公司 电连接器
CN112151987B (zh) 2016-08-23 2022-12-30 安费诺有限公司 可配置为高性能的连接器
US10722310B2 (en) 2017-03-13 2020-07-28 Zimmer Biomet CMF and Thoracic, LLC Virtual surgery planning system and method
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
CN109548280A (zh) * 2018-11-09 2019-03-29 天津航空机电有限公司 一种可单独更换的插卡式功率输出电路板卡
CN115428275A (zh) 2020-01-27 2022-12-02 富加宜(美国)有限责任公司 高速连接器
US11469554B2 (en) 2020-01-27 2022-10-11 Fci Usa Llc High speed, high density direct mate orthogonal connector
CN215816516U (zh) 2020-09-22 2022-02-11 安费诺商用电子产品(成都)有限公司 电连接器
CN213636403U (zh) 2020-09-25 2021-07-06 安费诺商用电子产品(成都)有限公司 电连接器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992686A (en) * 1975-07-24 1976-11-16 The Singer Company Backplane transmission line system
EP0481779A1 (fr) * 1990-10-19 1992-04-22 Graphico Co. Ltd. Structure de bus radiale et parallèle
US5117331A (en) * 1991-05-16 1992-05-26 Compaq Computer Corporation Bus control signal routing and termination
EP0762291A1 (fr) * 1995-08-21 1997-03-12 Hitachi, Ltd. Dispositif de disque dur comprenant un bus et procédé d'installation

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE423777B (sv) * 1980-09-29 1982-05-24 Asea Ab Elektrisk utrustning innefattande ett antal samarbetande kretskort
US4647123A (en) * 1983-02-07 1987-03-03 Gulf & Western Manufacturing Company Bus networks for digital data processing systems and modules usable therewith
US4511950A (en) * 1983-06-27 1985-04-16 Northern Telecom Limited Backpanel assemblies
US4498717A (en) * 1983-08-29 1985-02-12 Gte Communication Systems Corp. Printed wiring board interconnect arrangement
US5352123A (en) * 1992-06-08 1994-10-04 Quickturn Systems, Incorporated Switching midplane and interconnection system for interconnecting large numbers of signals
US5388099A (en) * 1992-10-22 1995-02-07 Digital Equipment Corporation Backplane wiring for hub in packet data communications system
JP3237968B2 (ja) * 1993-08-18 2001-12-10 富士通株式会社 半導体素子モジュール
CA2148126C (fr) * 1993-09-16 1998-12-29 Thomas Blane Mcmichen Fond de panier a bus a signaux
SE501791C2 (sv) * 1993-09-23 1995-05-15 Ellemtel Utvecklings Ab Anordning med ett bakplan anpassad för samverkan med ett antal kretskort
US5530623A (en) * 1993-11-19 1996-06-25 Ncr Corporation High speed memory packaging scheme
JP2882266B2 (ja) * 1993-12-28 1999-04-12 株式会社日立製作所 信号伝送装置及び回路ブロック
US5926378A (en) * 1995-09-29 1999-07-20 International Business Machines Corporation Low profile riser card assembly using paired back-to-back peripheral card connectors mounted on universal footprints supporting different bus form factors
US6003131A (en) * 1996-03-20 1999-12-14 Samsung Electronics Co., Ltd. Computer system with a variety of applications and method for operating the same
US6211703B1 (en) * 1996-06-07 2001-04-03 Hitachi, Ltd. Signal transmission system
US5896473A (en) * 1996-06-26 1999-04-20 Rockwell International Corporation Re-configurable bus back-plane system
US6097200A (en) * 1996-10-07 2000-08-01 Aetrium Incorporated Modular, semiconductor reliability test system
JP3543555B2 (ja) * 1997-08-08 2004-07-14 株式会社日立製作所 信号伝送装置
US6018867A (en) * 1997-10-02 2000-02-01 Micron Electronics, Inc. Integrated circuit cartridge extracting tool
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6111753A (en) * 1998-06-19 2000-08-29 Compaq Computer Corp. Voltage regulator module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992686A (en) * 1975-07-24 1976-11-16 The Singer Company Backplane transmission line system
EP0481779A1 (fr) * 1990-10-19 1992-04-22 Graphico Co. Ltd. Structure de bus radiale et parallèle
US5117331A (en) * 1991-05-16 1992-05-26 Compaq Computer Corporation Bus control signal routing and termination
EP0762291A1 (fr) * 1995-08-21 1997-03-12 Hitachi, Ltd. Dispositif de disque dur comprenant un bus et procédé d'installation

Also Published As

Publication number Publication date
US6328572B1 (en) 2001-12-11
DE10036934A1 (de) 2001-02-01
JP3621608B2 (ja) 2005-02-16
JP2001042981A (ja) 2001-02-16
DE10036934B4 (de) 2006-01-05
FR2797527A1 (fr) 2001-02-16
FR2797527B1 (fr) 2002-04-19

Similar Documents

Publication Publication Date Title
NL1015799C2 (nl) Moederboard.
KR100340285B1 (ko) 복수의 인쇄회로기판이 상호 직렬 접속된 메모리 모듈
US10367280B2 (en) Wire to board connectors suitable for use in bypass routing assemblies
US9325086B2 (en) Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications
US6392142B1 (en) Printed wiring board mounting structure
US8873249B2 (en) DIMM riser care with an angled DIMM socket and a straddle mount DIMM socket
US6496376B1 (en) Modular backplane
US20050186807A1 (en) Apparatus inteconnecting circuit board and mezzanine card or cards
US20090251867A1 (en) Reconfigurable, modularized fpga-based amc module
US5122691A (en) Integrated backplane interconnection architecture
US7499286B2 (en) Mounting adapter for electronic modules
US8485831B2 (en) Tall mezzanine connector
US20060158864A1 (en) Circuit board adapted to couple to different types of add-in cards
EP1340154B1 (fr) Topologie pour systeme de carte adaptatrice de connexion de bus pci de 66 mhz
US6349037B1 (en) Backplane for common building block
WO2002017692A1 (fr) Module de memoire grande capacite avec une densite superieure et une capacite de fabrication amelioree
US7719855B2 (en) Spacing device for modular system
JP4152954B2 (ja) アドイン・カードをバックプレーンに接続するための装置、システム、方法
US6327147B1 (en) Retention mechanism and electronic module mounting system
CN110858092A (zh) 一种伺服系统
JP2002298953A (ja) コネクタ
US9282671B2 (en) Tilted printed circuit board installation
US5400222A (en) L Connectors for an extensible computer bus
WO2005104324A2 (fr) Module de memoire plie entierement a tampon
US11630492B2 (en) Electronic device comprising a mother board and a riser card

Legal Events

Date Code Title Description
PD2B A search report has been drawn up
V1 Lapsed because of non-payment of the annual fee

Effective date: 20130201