MY197929A - Sputtering target and powder for producing sputtering target - Google Patents

Sputtering target and powder for producing sputtering target

Info

Publication number
MY197929A
MY197929A MYPI2021001557A MYPI2021001557A MY197929A MY 197929 A MY197929 A MY 197929A MY PI2021001557 A MYPI2021001557 A MY PI2021001557A MY PI2021001557 A MYPI2021001557 A MY PI2021001557A MY 197929 A MY197929 A MY 197929A
Authority
MY
Malaysia
Prior art keywords
sputtering target
powder
producing
melting point
main component
Prior art date
Application number
MYPI2021001557A
Other languages
English (en)
Inventor
Yasuyuki Iwabuchi
Atsushi Sato
Masayoshi Shimizu
Akira SHIMOJUKU
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY197929A publication Critical patent/MY197929A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
MYPI2021001557A 2018-09-25 2019-05-16 Sputtering target and powder for producing sputtering target MY197929A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018178381 2018-09-25
PCT/JP2019/019571 WO2020066114A1 (ja) 2018-09-25 2019-05-16 スパッタリングターゲット及びスパッタリングターゲットを製造するための粉体

Publications (1)

Publication Number Publication Date
MY197929A true MY197929A (en) 2023-07-25

Family

ID=69953061

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021001557A MY197929A (en) 2018-09-25 2019-05-16 Sputtering target and powder for producing sputtering target

Country Status (6)

Country Link
JP (1) JP7072664B2 (zh)
CN (1) CN112739846A (zh)
MY (1) MY197929A (zh)
SG (1) SG11202102759VA (zh)
TW (1) TWI727334B (zh)
WO (1) WO2020066114A1 (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003075263A1 (en) * 2002-02-28 2003-09-12 Seagate Technology Llc Chemically ordered, cobalt-platinum alloys for magnetic recording
JP2006283054A (ja) * 2005-03-31 2006-10-19 Hoya Corp スパッタリングターゲット、多層反射膜付き基板の製造方法、及び反射型マスクブランクの製造方法、並びに反射型マスクの製造方法
JP5234735B2 (ja) * 2005-06-16 2013-07-10 Ｊｘ日鉱日石金属株式会社 タンタル−ルテニウム合金スパッタリングターゲット
JP2008101246A (ja) * 2006-10-19 2008-05-01 Asahi Glass Co Ltd Ｅｕｖリソグラフィ用反射型マスクブランクを製造する際に使用されるスパッタリングターゲット
US7871563B2 (en) * 2007-07-17 2011-01-18 Williams Advanced Materials, Inc. Process for the refurbishing of a sputtering target
CN105026589B (zh) * 2013-04-30 2017-07-18 吉坤日矿日石金属株式会社 烧结体、包含该烧结体的磁记录膜形成用溅射靶
JP6005767B2 (ja) * 2014-01-17 2016-10-12 Ｊｘ金属株式会社 磁性記録媒体用スパッタリングターゲット
WO2016013334A1 (ja) * 2014-07-25 2016-01-28 Jx日鉱日石金属株式会社 磁性体薄膜形成用スパッタリングターゲット
WO2016035415A1 (ja) * 2014-09-04 2016-03-10 Ｊｘ金属株式会社 スパッタリングターゲット
MY184033A (en) * 2015-02-19 2021-03-17 Jx Nippon Mining & Metals Corp Sputtering target for forming magnetic thin film
TW201636444A (zh) * 2015-04-01 2016-10-16 光洋應用材料科技股份有限公司 釕基靶材及用於磁記錄媒體的中間膜
CN109844167B (zh) * 2016-12-28 2022-01-04 捷客斯金属株式会社 磁性材料溅射靶及其制造方法

Also Published As

Publication number Publication date
JP7072664B2 (ja) 2022-05-20
SG11202102759VA (en) 2021-04-29
CN112739846A (zh) 2021-04-30
WO2020066114A1 (ja) 2020-04-02
JPWO2020066114A1 (ja) 2021-10-21
TWI727334B (zh) 2021-05-11
TW202012666A (zh) 2020-04-01

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