MY197929A - Sputtering target and powder for producing sputtering target - Google Patents
Sputtering target and powder for producing sputtering targetInfo
- Publication number
- MY197929A MY197929A MYPI2021001557A MYPI2021001557A MY197929A MY 197929 A MY197929 A MY 197929A MY PI2021001557 A MYPI2021001557 A MY PI2021001557A MY PI2021001557 A MYPI2021001557 A MY PI2021001557A MY 197929 A MY197929 A MY 197929A
- Authority
- MY
- Malaysia
- Prior art keywords
- sputtering target
- powder
- producing
- melting point
- main component
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/12—Metallic powder containing non-metallic particles
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Abstract
Provided is a sputtering target containing Ru and B. The sputtering target contains Ru as a main component, wherein the sputtering target has a melting point higher than that of B2O3 and comprises a composite oxide containing boron.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018178381 | 2018-09-25 | ||
PCT/JP2019/019571 WO2020066114A1 (en) | 2018-09-25 | 2019-05-16 | Sputtering target and powder for producing sputtering target |
Publications (1)
Publication Number | Publication Date |
---|---|
MY197929A true MY197929A (en) | 2023-07-25 |
Family
ID=69953061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2021001557A MY197929A (en) | 2018-09-25 | 2019-05-16 | Sputtering target and powder for producing sputtering target |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7072664B2 (en) |
CN (1) | CN112739846A (en) |
MY (1) | MY197929A (en) |
SG (1) | SG11202102759VA (en) |
TW (1) | TWI727334B (en) |
WO (1) | WO2020066114A1 (en) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7186471B2 (en) * | 2002-02-28 | 2007-03-06 | Seagate Technology Llc | Chemically ordered, cobalt-three platinum alloys for magnetic recording |
JP2006283054A (en) * | 2005-03-31 | 2006-10-19 | Hoya Corp | Sputtering target, manufacturing method for substrate with multi-layered reflecting film, manufacturing method for reflection type mask blank, and manufacturing method for reflection type mask |
US9732413B2 (en) * | 2005-06-16 | 2017-08-15 | Jx Nippon Mining & Metals Corporation | Ruthenium-alloy sputtering target |
JP2008101246A (en) * | 2006-10-19 | 2008-05-01 | Asahi Glass Co Ltd | Sputtering target used for producing reflection type mask blank for euv lithography |
US7871563B2 (en) * | 2007-07-17 | 2011-01-18 | Williams Advanced Materials, Inc. | Process for the refurbishing of a sputtering target |
CN105026589B (en) * | 2013-04-30 | 2017-07-18 | 吉坤日矿日石金属株式会社 | Sintered body, the magnetic recording film formation sputtering target comprising the sintered body |
JP6005767B2 (en) * | 2014-01-17 | 2016-10-12 | Jx金属株式会社 | Sputtering target for magnetic recording media |
WO2016013334A1 (en) * | 2014-07-25 | 2016-01-28 | Jx日鉱日石金属株式会社 | Sputtering target for forming magnetic thin film |
WO2016035415A1 (en) * | 2014-09-04 | 2016-03-10 | Jx金属株式会社 | Sputtering target |
CN108026631B (en) * | 2015-02-19 | 2020-02-28 | 捷客斯金属株式会社 | Sputtering target for forming magnetic thin film |
TW201636444A (en) * | 2015-04-01 | 2016-10-16 | 光洋應用材料科技股份有限公司 | Ruthenium-based target and intermediate layer for magnetic recording media |
MY191374A (en) * | 2016-12-28 | 2022-06-21 | Jx Nippon Mining & Metals Corp | Magnetic material sputtering target and method for manufacturing same |
-
2019
- 2019-05-16 WO PCT/JP2019/019571 patent/WO2020066114A1/en active Application Filing
- 2019-05-16 SG SG11202102759VA patent/SG11202102759VA/en unknown
- 2019-05-16 CN CN201980060775.9A patent/CN112739846A/en active Pending
- 2019-05-16 JP JP2020547948A patent/JP7072664B2/en active Active
- 2019-05-16 MY MYPI2021001557A patent/MY197929A/en unknown
- 2019-06-04 TW TW108119331A patent/TWI727334B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI727334B (en) | 2021-05-11 |
WO2020066114A1 (en) | 2020-04-02 |
JP7072664B2 (en) | 2022-05-20 |
TW202012666A (en) | 2020-04-01 |
JPWO2020066114A1 (en) | 2021-10-21 |
SG11202102759VA (en) | 2021-04-29 |
CN112739846A (en) | 2021-04-30 |
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