MY197929A - Sputtering target and powder for producing sputtering target - Google Patents
Sputtering target and powder for producing sputtering targetInfo
- Publication number
- MY197929A MY197929A MYPI2021001557A MYPI2021001557A MY197929A MY 197929 A MY197929 A MY 197929A MY PI2021001557 A MYPI2021001557 A MY PI2021001557A MY PI2021001557 A MYPI2021001557 A MY PI2021001557A MY 197929 A MY197929 A MY 197929A
- Authority
- MY
- Malaysia
- Prior art keywords
- sputtering target
- powder
- producing
- melting point
- main component
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/12—Metallic powder containing non-metallic particles
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018178381 | 2018-09-25 | ||
PCT/JP2019/019571 WO2020066114A1 (ja) | 2018-09-25 | 2019-05-16 | スパッタリングターゲット及びスパッタリングターゲットを製造するための粉体 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY197929A true MY197929A (en) | 2023-07-25 |
Family
ID=69953061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2021001557A MY197929A (en) | 2018-09-25 | 2019-05-16 | Sputtering target and powder for producing sputtering target |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7072664B2 (ja) |
CN (1) | CN112739846A (ja) |
MY (1) | MY197929A (ja) |
SG (1) | SG11202102759VA (ja) |
TW (1) | TWI727334B (ja) |
WO (1) | WO2020066114A1 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003216441A1 (en) * | 2002-02-28 | 2003-09-16 | Seagate Technology Llc | Chemically ordered, cobalt-platinum alloys for magnetic recording |
JP2006283054A (ja) * | 2005-03-31 | 2006-10-19 | Hoya Corp | スパッタリングターゲット、多層反射膜付き基板の製造方法、及び反射型マスクブランクの製造方法、並びに反射型マスクの製造方法 |
JP5234735B2 (ja) * | 2005-06-16 | 2013-07-10 | Jx日鉱日石金属株式会社 | タンタル−ルテニウム合金スパッタリングターゲット |
JP2008101246A (ja) * | 2006-10-19 | 2008-05-01 | Asahi Glass Co Ltd | Euvリソグラフィ用反射型マスクブランクを製造する際に使用されるスパッタリングターゲット |
US7871563B2 (en) * | 2007-07-17 | 2011-01-18 | Williams Advanced Materials, Inc. | Process for the refurbishing of a sputtering target |
MY170253A (en) * | 2013-04-30 | 2019-07-13 | Jx Nippon Mining & Metals Corp | Sintered body, and sputtering target for magnetic recording film formation use which comprises said sintered body |
JP6005767B2 (ja) * | 2014-01-17 | 2016-10-12 | Jx金属株式会社 | 磁性記録媒体用スパッタリングターゲット |
WO2016013334A1 (ja) * | 2014-07-25 | 2016-01-28 | Jx日鉱日石金属株式会社 | 磁性体薄膜形成用スパッタリングターゲット |
SG11201606737UA (en) * | 2014-09-04 | 2016-09-29 | Jx Nippon Mining & Metals Corp | Sputtering target |
SG11201706389UA (en) * | 2015-02-19 | 2017-09-28 | Jx Nippon Mining & Metals Corp | Sputtering target for forming magnetic thin film |
TW201636444A (zh) * | 2015-04-01 | 2016-10-16 | 光洋應用材料科技股份有限公司 | 釕基靶材及用於磁記錄媒體的中間膜 |
JP6734399B2 (ja) * | 2016-12-28 | 2020-08-05 | Jx金属株式会社 | 磁性材スパッタリングターゲット及びその製造方法 |
-
2019
- 2019-05-16 SG SG11202102759VA patent/SG11202102759VA/en unknown
- 2019-05-16 JP JP2020547948A patent/JP7072664B2/ja active Active
- 2019-05-16 MY MYPI2021001557A patent/MY197929A/en unknown
- 2019-05-16 CN CN201980060775.9A patent/CN112739846A/zh active Pending
- 2019-05-16 WO PCT/JP2019/019571 patent/WO2020066114A1/ja active Application Filing
- 2019-06-04 TW TW108119331A patent/TWI727334B/zh active
Also Published As
Publication number | Publication date |
---|---|
SG11202102759VA (en) | 2021-04-29 |
WO2020066114A1 (ja) | 2020-04-02 |
JP7072664B2 (ja) | 2022-05-20 |
TW202012666A (zh) | 2020-04-01 |
CN112739846A (zh) | 2021-04-30 |
JPWO2020066114A1 (ja) | 2021-10-21 |
TWI727334B (zh) | 2021-05-11 |
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