MY196755A - Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device - Google Patents

Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Info

Publication number
MY196755A
MY196755A MYPI2017704627A MYPI2017704627A MY196755A MY 196755 A MY196755 A MY 196755A MY PI2017704627 A MYPI2017704627 A MY PI2017704627A MY PI2017704627 A MYPI2017704627 A MY PI2017704627A MY 196755 A MY196755 A MY 196755A
Authority
MY
Malaysia
Prior art keywords
copper foil
surface treatment
treatment layer
surface treated
manufacturing
Prior art date
Application number
MYPI2017704627A
Other languages
English (en)
Inventor
Arai Hideta
Fukuchi Ryo
Miki Atsushi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY196755A publication Critical patent/MY196755A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MYPI2017704627A 2016-12-05 2017-11-30 Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device MY196755A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016236250 2016-12-05
JP2017205410A JP7409760B2 (ja) 2016-12-05 2017-10-24 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Publications (1)

Publication Number Publication Date
MY196755A true MY196755A (en) 2023-05-03

Family

ID=62565175

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017704627A MY196755A (en) 2016-12-05 2017-11-30 Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Country Status (5)

Country Link
JP (2) JP7409760B2 (zh)
KR (1) KR20180064311A (zh)
MY (1) MY196755A (zh)
PH (1) PH12017000346A1 (zh)
TW (1) TWI705738B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7435444B2 (ja) * 2018-07-18 2024-02-21 株式会社レゾナック 銅張積層板、プリント配線板、半導体パッケージ及び銅張積層板の製造方法
JP7230932B2 (ja) * 2019-01-30 2023-03-01 Ａｇｃ株式会社 積層体及びその製造方法、複合積層体の製造方法、並びにポリマーフィルムの製造方法
JP7300976B2 (ja) * 2019-12-13 2023-06-30 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP2021095596A (ja) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR20230038643A (ko) * 2020-07-16 2023-03-21 미쓰이금속광업주식회사 동장 적층판 및 프린트 배선판
US20230276579A1 (en) * 2020-07-16 2023-08-31 Mitsui Mining & Smelting Co., Ltd. Manufacturing methods for copper-clad laminate and printed wiring board

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511408B (en) * 2000-09-18 2002-11-21 Nippon Denkai Kk Method of producing copper foil for fine wiring
CN1217564C (zh) * 2001-05-14 2005-08-31 日本电解株式会社 经糙化处理的铜箔及其制造方法
JP4161304B2 (ja) 2003-02-04 2008-10-08 古河サーキットフォイル株式会社 高周波回路用金属箔
JP2004244656A (ja) * 2003-02-12 2004-09-02 Furukawa Techno Research Kk 高周波用途対応可能銅箔とその製造方法
JP4704025B2 (ja) 2004-12-21 2011-06-15 Ｊｘ日鉱日石金属株式会社 高周波回路用粗化処理圧延銅箔及びその製造方法
JP5885054B2 (ja) 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
KR101328235B1 (ko) * 2010-05-07 2013-11-14 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 인쇄 회로용 동박
JP5204908B1 (ja) 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
CN107041064A (zh) * 2012-03-29 2017-08-11 Jx日矿日石金属株式会社 表面处理铜箔
JP5362922B1 (ja) 2012-10-12 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
CN104685109B (zh) 2012-09-28 2017-12-05 Jx日矿日石金属株式会社 附载体的铜箔及用有附载体的铜箔的覆铜积层板
JP5758033B2 (ja) 2013-08-20 2015-08-05 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015200026A (ja) 2014-03-31 2015-11-12 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、積層体、積層板、電子機器及びプリント配線板の製造方法
JP6591766B2 (ja) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、積層体、電子機器及びプリント配線板の製造方法
JP2015105440A (ja) 2014-11-21 2015-06-08 Jx日鉱日石金属株式会社 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器

Also Published As

Publication number Publication date
JP2023037628A (ja) 2023-03-15
TWI705738B (zh) 2020-09-21
JP7409760B2 (ja) 2024-01-09
PH12017000346A1 (en) 2018-07-30
KR20180064311A (ko) 2018-06-14
JP2018090903A (ja) 2018-06-14
TW201822597A (zh) 2018-06-16

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