MY192435A - Polishing composition, method for producing substrate, and method for polishing same - Google Patents
Polishing composition, method for producing substrate, and method for polishing sameInfo
- Publication number
- MY192435A MY192435A MYPI2017701047A MYPI2017701047A MY192435A MY 192435 A MY192435 A MY 192435A MY PI2017701047 A MYPI2017701047 A MY PI2017701047A MY PI2017701047 A MYPI2017701047 A MY PI2017701047A MY 192435 A MY192435 A MY 192435A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- abrasive
- percentile
- polishing composition
- particles
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016071364A JP6679386B2 (ja) | 2016-03-31 | 2016-03-31 | 研磨用組成物、基板の製造方法および研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY192435A true MY192435A (en) | 2022-08-19 |
Family
ID=60005054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017701047A MY192435A (en) | 2016-03-31 | 2017-03-27 | Polishing composition, method for producing substrate, and method for polishing same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6679386B2 (ja) |
MY (1) | MY192435A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102533088B1 (ko) * | 2017-12-18 | 2023-05-17 | 주식회사 케이씨텍 | 다결정실리콘을 함유하는 웨이퍼의 연마 슬러리 조성물 |
JP7055695B2 (ja) * | 2018-04-27 | 2022-04-18 | 花王株式会社 | 研磨用シリカ砥粒 |
JP7262197B2 (ja) * | 2018-09-28 | 2023-04-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびその利用 |
JP7471118B2 (ja) | 2019-03-29 | 2024-04-19 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP7391589B2 (ja) * | 2019-09-30 | 2023-12-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP7396953B2 (ja) | 2020-03-31 | 2023-12-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物、基板の製造方法および研磨方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518135B1 (en) * | 2012-08-27 | 2013-08-27 | Cabot Microelectronics Corporation | Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks |
JP6156207B2 (ja) * | 2013-04-02 | 2017-07-05 | 信越化学工業株式会社 | 合成石英ガラス基板の製造方法 |
JP6412714B2 (ja) * | 2014-04-16 | 2018-10-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
-
2016
- 2016-03-31 JP JP2016071364A patent/JP6679386B2/ja active Active
-
2017
- 2017-03-27 MY MYPI2017701047A patent/MY192435A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2017179217A (ja) | 2017-10-05 |
JP6679386B2 (ja) | 2020-04-15 |
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