MY192435A - Polishing composition, method for producing substrate, and method for polishing same - Google Patents

Polishing composition, method for producing substrate, and method for polishing same

Info

Publication number
MY192435A
MY192435A MYPI2017701047A MYPI2017701047A MY192435A MY 192435 A MY192435 A MY 192435A MY PI2017701047 A MYPI2017701047 A MY PI2017701047A MY PI2017701047 A MYPI2017701047 A MY PI2017701047A MY 192435 A MY192435 A MY 192435A
Authority
MY
Malaysia
Prior art keywords
polishing
abrasive
percentile
polishing composition
particles
Prior art date
Application number
MYPI2017701047A
Other languages
English (en)
Inventor
Matsunami Yasushi
Otsu Taira
Yokomichi Noritaka
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY192435A publication Critical patent/MY192435A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
MYPI2017701047A 2016-03-31 2017-03-27 Polishing composition, method for producing substrate, and method for polishing same MY192435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016071364A JP6679386B2 (ja) 2016-03-31 2016-03-31 研磨用組成物、基板の製造方法および研磨方法

Publications (1)

Publication Number Publication Date
MY192435A true MY192435A (en) 2022-08-19

Family

ID=60005054

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701047A MY192435A (en) 2016-03-31 2017-03-27 Polishing composition, method for producing substrate, and method for polishing same

Country Status (2)

Country Link
JP (1) JP6679386B2 (ja)
MY (1) MY192435A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102533088B1 (ko) * 2017-12-18 2023-05-17 주식회사 케이씨텍 다결정실리콘을 함유하는 웨이퍼의 연마 슬러리 조성물
JP7055695B2 (ja) * 2018-04-27 2022-04-18 花王株式会社 研磨用シリカ砥粒
JP7262197B2 (ja) * 2018-09-28 2023-04-21 株式会社フジミインコーポレーテッド 研磨用組成物およびその利用
JP7471118B2 (ja) 2019-03-29 2024-04-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP7391589B2 (ja) * 2019-09-30 2023-12-05 株式会社フジミインコーポレーテッド 研磨用組成物
JP7396953B2 (ja) 2020-03-31 2023-12-12 株式会社フジミインコーポレーテッド 研磨用組成物、基板の製造方法および研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518135B1 (en) * 2012-08-27 2013-08-27 Cabot Microelectronics Corporation Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks
JP6156207B2 (ja) * 2013-04-02 2017-07-05 信越化学工業株式会社 合成石英ガラス基板の製造方法
JP6412714B2 (ja) * 2014-04-16 2018-10-24 株式会社フジミインコーポレーテッド 研磨用組成物

Also Published As

Publication number Publication date
JP2017179217A (ja) 2017-10-05
JP6679386B2 (ja) 2020-04-15

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