MY175402A - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- MY175402A MY175402A MYPI2015000977A MYPI2015000977A MY175402A MY 175402 A MY175402 A MY 175402A MY PI2015000977 A MYPI2015000977 A MY PI2015000977A MY PI2015000977 A MYPI2015000977 A MY PI2015000977A MY 175402 A MY175402 A MY 175402A
- Authority
- MY
- Malaysia
- Prior art keywords
- silica abrasives
- polishing composition
- dmin1
- average
- aspect ratio
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A polishing composition includes first silica abrasives having an average aspect ratio, As1, and second silica abrasives having an average aspect ratio, As2, larger than the average aspect ratio of the first silica abrasives. The first silica abrasives have an average minor axis length, Dmin1, of 30 nm or more and 60 nm or less, and the relation between the average minor axis length, Dmin1, of the first silica abrasives and the average minor axis length, Dmin2, of the second silica abrasives satisfies 1 <(Dmin2/Dmin1) < 3. The most illustrative drawing: Figure 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014085047A JP6412714B2 (en) | 2014-04-16 | 2014-04-16 | Polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
MY175402A true MY175402A (en) | 2020-06-24 |
Family
ID=54596758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015000977A MY175402A (en) | 2014-04-16 | 2015-04-14 | Polishing composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6412714B2 (en) |
MY (1) | MY175402A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6487308B2 (en) * | 2014-10-20 | 2019-03-20 | 大阪ガスケミカル株式会社 | Polyester poly (meth) acrylate having fluorene skeleton, curable composition and cured product thereof, and production method thereof |
JP6584935B2 (en) * | 2015-11-30 | 2019-10-02 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
JP6679386B2 (en) * | 2016-03-31 | 2020-04-15 | 株式会社フジミインコーポレーテッド | Polishing composition, substrate manufacturing method and polishing method |
JP6637816B2 (en) * | 2016-03-31 | 2020-01-29 | 株式会社フジミインコーポレーテッド | Polishing composition, substrate polishing method and substrate manufacturing method |
JP6775453B2 (en) * | 2017-03-23 | 2020-10-28 | 山口精研工業株式会社 | Abrasive composition for magnetic disk substrates |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005108407A (en) * | 2003-09-12 | 2005-04-21 | Univ Waseda | Magnetic recording medium and substrate for magnetic recording medium |
JP6305674B2 (en) * | 2012-02-17 | 2018-04-04 | 株式会社フジミインコーポレーテッド | Polishing composition and method for producing semiconductor substrate |
-
2014
- 2014-04-16 JP JP2014085047A patent/JP6412714B2/en active Active
-
2015
- 2015-04-14 MY MYPI2015000977A patent/MY175402A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2015203108A (en) | 2015-11-16 |
JP6412714B2 (en) | 2018-10-24 |
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