MY176699A - Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device - Google Patents
Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor deviceInfo
- Publication number
- MY176699A MY176699A MYPI2019004818A MYPI2019004818A MY176699A MY 176699 A MY176699 A MY 176699A MY PI2019004818 A MYPI2019004818 A MY PI2019004818A MY PI2019004818 A MYPI2019004818 A MY PI2019004818A MY 176699 A MY176699 A MY 176699A
- Authority
- MY
- Malaysia
- Prior art keywords
- pressure
- sensitive adhesive
- semiconductor
- adhesive tape
- sealing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 238000007789 sealing Methods 0.000 abstract 6
- 239000010410 layer Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017036945 | 2017-02-28 | ||
| PCT/JP2018/006282 WO2018159418A1 (ja) | 2017-02-28 | 2018-02-21 | 半導体基板加工用粘着テープおよび半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY176699A true MY176699A (en) | 2020-08-19 |
Family
ID=63370318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019004818A MY176699A (en) | 2017-02-28 | 2018-02-21 | Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6443590B1 (ja) |
| CN (1) | CN110352472B (ja) |
| MY (1) | MY176699A (ja) |
| PH (1) | PH12019501778A1 (ja) |
| SG (1) | SG11201907801PA (ja) |
| TW (1) | TWI717587B (ja) |
| WO (1) | WO2018159418A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11435257B2 (en) * | 2018-07-27 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for monitoring vacuum valve closing condition in vacuum processing system |
| JP6639712B1 (ja) * | 2019-02-15 | 2020-02-05 | 桜宮化学株式会社 | 熱硬化性離型塗料および熱硬化性離型塗料キット |
| JP2020164787A (ja) * | 2019-03-27 | 2020-10-08 | 住友ベークライト株式会社 | 粘着テープ |
| JP6733803B1 (ja) * | 2019-05-10 | 2020-08-05 | 住友ベークライト株式会社 | 基板貼付用粘着テープおよび粘着テープ用基材 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4816835B2 (ja) * | 1999-07-19 | 2011-11-16 | 日立化成工業株式会社 | 非導電性樹脂ペースト組成物及びこれを用いた半導体装置 |
| JP4319892B2 (ja) * | 2003-11-07 | 2009-08-26 | 株式会社巴川製紙所 | 半導体装置製造用接着シート及び半導体装置の製造方法 |
| TWI478997B (zh) * | 2009-07-16 | 2015-04-01 | Sekisui Chemical Co Ltd | Adhesive tape, laminated body and image display device |
| JP5992692B2 (ja) * | 2012-02-20 | 2016-09-14 | 株式会社イーテック | 粘着剤組成物およびこれを用いた粘着シート |
| JP2017188539A (ja) * | 2016-04-04 | 2017-10-12 | 住友ベークライト株式会社 | 半導体素子、半導体素子の製造方法および半導体装置 |
-
2018
- 2018-02-21 JP JP2018527813A patent/JP6443590B1/ja active Active
- 2018-02-21 SG SG11201907801PA patent/SG11201907801PA/en unknown
- 2018-02-21 MY MYPI2019004818A patent/MY176699A/en unknown
- 2018-02-21 CN CN201880014576.XA patent/CN110352472B/zh active Active
- 2018-02-21 WO PCT/JP2018/006282 patent/WO2018159418A1/ja active Application Filing
- 2018-02-26 TW TW107106272A patent/TWI717587B/zh active
-
2019
- 2019-07-30 PH PH12019501778A patent/PH12019501778A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN110352472B (zh) | 2020-09-29 |
| WO2018159418A1 (ja) | 2018-09-07 |
| TWI717587B (zh) | 2021-02-01 |
| JPWO2018159418A1 (ja) | 2019-03-14 |
| PH12019501778B1 (en) | 2020-06-29 |
| TW201842114A (zh) | 2018-12-01 |
| CN110352472A (zh) | 2019-10-18 |
| JP6443590B1 (ja) | 2018-12-26 |
| SG11201907801PA (en) | 2019-09-27 |
| PH12019501778A1 (en) | 2020-06-29 |
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