MY176094A - Method for detecting hole in laser-welded portion and laser welding device - Google Patents

Method for detecting hole in laser-welded portion and laser welding device

Info

Publication number
MY176094A
MY176094A MYPI2018702411A MYPI2018702411A MY176094A MY 176094 A MY176094 A MY 176094A MY PI2018702411 A MYPI2018702411 A MY PI2018702411A MY PI2018702411 A MYPI2018702411 A MY PI2018702411A MY 176094 A MY176094 A MY 176094A
Authority
MY
Malaysia
Prior art keywords
laser
welded portion
welding
laser beam
control unit
Prior art date
Application number
MYPI2018702411A
Other languages
English (en)
Inventor
Hideo Saito
Kazuhiko Kagiya
Shintaro Nonaka
Original Assignee
Nissan Motor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor filed Critical Nissan Motor
Publication of MY176094A publication Critical patent/MY176094A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0037—Measuring of dimensions of welds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/894—Pinholes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N2021/4735—Solid samples, e.g. paper, glass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/629—Specific applications or type of materials welds, bonds, sealing compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Textile Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
MYPI2018702411A 2016-01-14 2016-09-27 Method for detecting hole in laser-welded portion and laser welding device MY176094A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016005469 2016-01-14

Publications (1)

Publication Number Publication Date
MY176094A true MY176094A (en) 2020-07-24

Family

ID=59311201

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018702411A MY176094A (en) 2016-01-14 2016-09-27 Method for detecting hole in laser-welded portion and laser welding device

Country Status (8)

Country Link
US (1) US20180361515A1 (fr)
EP (1) EP3404404A4 (fr)
JP (1) JPWO2017122391A1 (fr)
KR (1) KR101941417B1 (fr)
CN (1) CN108463716A (fr)
MX (1) MX2018008541A (fr)
MY (1) MY176094A (fr)
WO (1) WO2017122391A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102689254B1 (ko) 2020-10-28 2024-07-29 삼성에스디아이 주식회사 이차전지용 레이저 용접 방법 및 레이저 용접 장치
CN118023683B (zh) * 2024-04-12 2024-06-28 成都环龙智能机器人有限公司 一种基于视觉检测的焊接质量实时控制方法及系统

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3123146B2 (ja) * 1991-09-11 2001-01-09 トヨタ自動車株式会社 溶接ビードの品質検査装置
JP2885040B2 (ja) * 1993-12-27 1999-04-19 日産自動車株式会社 レーザ溶接の溶接品質管理方法
JP3227650B2 (ja) 1998-07-31 2001-11-12 住友重機械工業株式会社 レーザ溶接機及びレーザ溶接状態監視方法
JP3169354B2 (ja) * 1998-12-10 2001-05-21 川崎重工業株式会社 レーザ溶接加工モニタリング装置
JP3560135B2 (ja) * 1999-03-23 2004-09-02 日産自動車株式会社 Ｙａｇレーザ溶接部の品質モニタリング方法
EP1193490A1 (fr) * 2000-10-02 2002-04-03 AEA Technology QSA GmbH Procédé et dispositif de contrôle d'un cordon de soudure
JP3603843B2 (ja) * 2001-02-23 2004-12-22 日産自動車株式会社 レーザー溶接部の品質モニタリング方法およびその装置
JP2003131643A (ja) * 2001-10-29 2003-05-09 Sharp Corp 画像表示装置
JP3997181B2 (ja) * 2003-06-12 2007-10-24 住友重機械工業株式会社 レーザ溶着判定装置及びレーザ溶着判定方法
JP4349075B2 (ja) * 2003-10-28 2009-10-21 パナソニック電工株式会社 レーザ加工方法及び加工状態判断方法
JP5223537B2 (ja) * 2008-08-20 2013-06-26 日産自動車株式会社 レーザ溶接品質検査方法及び装置
JP5704454B2 (ja) * 2011-04-28 2015-04-22 スズキ株式会社 画像処理装置及び画像処理方法
JP5947740B2 (ja) * 2013-03-29 2016-07-06 トヨタ自動車株式会社 溶接部の検査装置とその検査方法
JP5947741B2 (ja) * 2013-03-29 2016-07-06 トヨタ自動車株式会社 溶接部の検査装置とその検査方法
JP5929948B2 (ja) * 2014-02-28 2016-06-08 トヨタ自動車株式会社 溶接部の検査方法
JP6003934B2 (ja) * 2014-03-20 2016-10-05 トヨタ自動車株式会社 レーザー溶接検査装置及びレーザー溶接検査方法

Also Published As

Publication number Publication date
EP3404404A1 (fr) 2018-11-21
CN108463716A (zh) 2018-08-28
US20180361515A1 (en) 2018-12-20
WO2017122391A1 (fr) 2017-07-20
KR101941417B1 (ko) 2019-01-22
EP3404404A4 (fr) 2019-01-09
MX2018008541A (es) 2018-08-15
KR20180094124A (ko) 2018-08-22
JPWO2017122391A1 (ja) 2018-10-25

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