MY168538A - Polycrystalline silicon rod manufacturing method - Google Patents

Polycrystalline silicon rod manufacturing method

Info

Publication number
MY168538A
MY168538A MYPI2014702225A MYPI2014702225A MY168538A MY 168538 A MY168538 A MY 168538A MY PI2014702225 A MYPI2014702225 A MY PI2014702225A MY PI2014702225 A MYPI2014702225 A MY PI2014702225A MY 168538 A MY168538 A MY 168538A
Authority
MY
Malaysia
Prior art keywords
frequency
polycrystalline silicon
supplying
power source
current
Prior art date
Application number
MYPI2014702225A
Other languages
English (en)
Inventor
Shigeyoshi Netsu
Yasushi Kurosawa
Naruhiro Hoshino
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of MY168538A publication Critical patent/MY168538A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
MYPI2014702225A 2012-02-23 2013-02-19 Polycrystalline silicon rod manufacturing method MY168538A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012037150A JP5792657B2 (ja) 2012-02-23 2012-02-23 多結晶シリコン棒の製造方法

Publications (1)

Publication Number Publication Date
MY168538A true MY168538A (en) 2018-11-12

Family

ID=49005403

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702225A MY168538A (en) 2012-02-23 2013-02-19 Polycrystalline silicon rod manufacturing method

Country Status (7)

Country Link
US (1) US20150017349A1 (enExample)
EP (1) EP2818450B1 (enExample)
JP (1) JP5792657B2 (enExample)
KR (1) KR20140125354A (enExample)
CN (2) CN106976884B (enExample)
MY (1) MY168538A (enExample)
WO (1) WO2013125207A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6181620B2 (ja) 2014-09-04 2017-08-16 信越化学工業株式会社 多結晶シリコン製造用反応炉、多結晶シリコン製造装置、多結晶シリコンの製造方法、及び、多結晶シリコン棒または多結晶シリコン塊
CN106115712B (zh) * 2016-06-28 2019-04-05 重庆大全泰来电气有限公司 一种多晶硅还原炉电源系统
JP2018123033A (ja) * 2017-02-02 2018-08-09 信越化学工業株式会社 多結晶シリコン棒の製造方法および多結晶シリコン棒
JP6969917B2 (ja) 2017-07-12 2021-11-24 信越化学工業株式会社 多結晶シリコン棒および多結晶シリコン棒の製造方法
CN110182813B (zh) * 2019-06-12 2021-01-12 厦门佰事兴新材料科技有限公司 还原炉电极的维护方法
JP7191780B2 (ja) 2019-06-17 2022-12-19 信越化学工業株式会社 多結晶シリコンロッドの製造方法
US20220274838A1 (en) * 2019-07-12 2022-09-01 Tokuyama Corporation Production method for polycrystalline silicon
CN110683547B (zh) * 2019-11-18 2023-12-26 新疆东方希望新能源有限公司 一种72对棒还原炉高压击穿系统及其方法
CN114545865B (zh) * 2020-11-25 2024-01-30 新特能源股份有限公司 一种多晶硅生长控制方法
CN113922634A (zh) * 2021-11-30 2022-01-11 重庆大全泰来电气有限公司 一种多对棒多晶硅还原炉电源系统
CN114212794B (zh) * 2021-12-30 2023-03-28 新疆大全新能源股份有限公司 制备电子级方硅芯的原生多晶硅棒的生产方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727305A1 (de) * 1977-06-16 1979-01-04 Siemens Ag Verfahren zum abscheiden von feinkristallinem silicium aus der gasphase an der oberflaeche eines erhitzten traegerkoerpers
DE2831816A1 (de) 1978-07-19 1980-01-31 Siemens Ag Verfahren zum abscheiden von silicium in feinkristalliner form
JPS6374909A (ja) 1986-09-19 1988-04-05 Shin Etsu Handotai Co Ltd 大直径多結晶シリコン棒の製造方法
JPH01305810A (ja) * 1988-06-02 1989-12-11 Osaka Titanium Co Ltd 多結晶シリコンの通電加熱方法
US6221155B1 (en) * 1997-12-15 2001-04-24 Advanced Silicon Materials, Llc Chemical vapor deposition system for polycrystalline silicon rod production
JP3621311B2 (ja) * 1999-11-15 2005-02-16 住友チタニウム株式会社 多結晶シリコン製造プロセスにおけるシリコン直径及び温度の推定方法並びにこれを用いた操業管理方法
US7521341B2 (en) * 2005-11-09 2009-04-21 Industrial Technology Research Institute Method of direct deposition of polycrystalline silicon
KR100768147B1 (ko) * 2006-05-11 2007-10-18 한국화학연구원 혼합된 코어수단을 이용한 다결정 실리콘 봉의 제조방법과그 제조장치

Also Published As

Publication number Publication date
US20150017349A1 (en) 2015-01-15
JP5792657B2 (ja) 2015-10-14
KR20140125354A (ko) 2014-10-28
WO2013125207A1 (ja) 2013-08-29
CN106976884B (zh) 2019-09-27
EP2818450B1 (en) 2023-11-08
JP2013170117A (ja) 2013-09-02
CN106976884A (zh) 2017-07-25
CN104066679A (zh) 2014-09-24
EP2818450A4 (en) 2015-12-02
EP2818450A1 (en) 2014-12-31

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