MY164438A - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- MY164438A MY164438A MYPI20041159A MYPI20041159A MY164438A MY 164438 A MY164438 A MY 164438A MY PI20041159 A MYPI20041159 A MY PI20041159A MY PI20041159 A MYPI20041159 A MY PI20041159A MY 164438 A MY164438 A MY 164438A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing composition
- polishing
- phosphorus
- ammonia
- hydrogen peroxide
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 150000003863 ammonium salts Chemical class 0.000 abstract 1
- 238000006386 neutralization reaction Methods 0.000 abstract 1
- 150000003839 salts Chemical group 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003097252A JP4202172B2 (ja) | 2003-03-31 | 2003-03-31 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY164438A true MY164438A (en) | 2017-12-15 |
Family
ID=32212185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20041159A MY164438A (en) | 2003-03-31 | 2004-03-30 | Polishing composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4202172B2 (zh) |
CN (1) | CN100389161C (zh) |
GB (1) | GB2401109B8 (zh) |
MY (1) | MY164438A (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4202201B2 (ja) * | 2003-07-03 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2006077127A (ja) * | 2004-09-09 | 2006-03-23 | Fujimi Inc | 研磨用組成物及びそれを用いた研磨方法 |
JP4523935B2 (ja) * | 2006-12-27 | 2010-08-11 | 昭和電工株式会社 | 炭化珪素単結晶基板の研磨用水系研磨スラリー及び研磨法。 |
SG10201605686XA (en) | 2008-02-01 | 2016-08-30 | Fujimi Inc | Polishing Composition And Polishing Method Using The Same |
TWI538971B (zh) * | 2010-09-08 | 2016-06-21 | 巴斯夫歐洲公司 | 用於電子、機械及光學裝置之化學機械研磨基材之水性研磨組成物及方法 |
JP6015931B2 (ja) * | 2011-12-15 | 2016-10-26 | Jsr株式会社 | 化学機械研磨用水系分散体および化学機械研磨方法 |
CN102796458B (zh) * | 2012-07-17 | 2014-04-23 | 清华大学 | 化学机械抛光水性组合物及钛基片化学机械抛光工艺方法 |
US20150166862A1 (en) * | 2012-07-17 | 2015-06-18 | Fujimi Incorporated | Composition for polishing alloy material and method for producing alloy material using same |
CN103897604B (zh) * | 2012-12-28 | 2015-12-02 | 上海新安纳电子科技有限公司 | 一种计算机硬盘的化学机械抛光液 |
KR102611598B1 (ko) * | 2017-04-27 | 2023-12-08 | 주식회사 동진쎄미켐 | 화학-기계적 연마용 슬러리 조성물 |
WO2018199453A1 (ko) * | 2017-04-27 | 2018-11-01 | 주식회사 동진쎄미켐 | 화학-기계적 연마용 슬러리 조성물 |
KR102422952B1 (ko) * | 2017-06-12 | 2022-07-19 | 삼성전자주식회사 | 금속막 연마용 슬러리 조성물 및 이를 이용하는 반도체 장치의 제조 방법 |
JP7058097B2 (ja) * | 2017-09-29 | 2022-04-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物および磁気ディスク基板の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG54606A1 (en) * | 1996-12-05 | 1998-11-16 | Fujimi Inc | Polishing composition |
US6051870A (en) * | 1997-12-17 | 2000-04-18 | Advanced Micro Devices | Process for fabricating semiconductor device including improved phosphorous-doped silicon dioxide dielectric film |
US6258140B1 (en) * | 1999-09-27 | 2001-07-10 | Fujimi America Inc. | Polishing composition |
JP3877924B2 (ja) * | 2000-01-24 | 2007-02-07 | 昭和電工株式会社 | 磁気ディスク基板研磨用組成物 |
TW471057B (en) * | 2000-06-09 | 2002-01-01 | Macronix Int Co Ltd | Method for reducing dishing effect during chemical mechanical polishing |
JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
MY134679A (en) * | 2002-12-26 | 2007-12-31 | Kao Corp | Polishing composition |
JP3997152B2 (ja) * | 2002-12-26 | 2007-10-24 | 花王株式会社 | 研磨液組成物 |
-
2003
- 2003-03-31 JP JP2003097252A patent/JP4202172B2/ja not_active Expired - Lifetime
-
2004
- 2004-03-29 GB GB0407024A patent/GB2401109B8/en not_active Expired - Fee Related
- 2004-03-30 CN CNB2004100342151A patent/CN100389161C/zh not_active Expired - Fee Related
- 2004-03-30 MY MYPI20041159A patent/MY164438A/en unknown
Also Published As
Publication number | Publication date |
---|---|
GB2401109A (en) | 2004-11-03 |
JP2004300348A (ja) | 2004-10-28 |
GB2401109A8 (en) | 2007-11-14 |
CN1536046A (zh) | 2004-10-13 |
GB2401109B (en) | 2007-10-10 |
GB2401109B8 (en) | 2007-11-14 |
GB0407024D0 (en) | 2004-04-28 |
CN100389161C (zh) | 2008-05-21 |
JP4202172B2 (ja) | 2008-12-24 |
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