MY160946A - Polishing composition containing polyether amine - Google Patents

Polishing composition containing polyether amine

Info

Publication number
MY160946A
MY160946A MYPI2011005441A MYPI2011005441A MY160946A MY 160946 A MY160946 A MY 160946A MY PI2011005441 A MYPI2011005441 A MY PI2011005441A MY PI2011005441 A MYPI2011005441 A MY PI2011005441A MY 160946 A MY160946 A MY 160946A
Authority
MY
Malaysia
Prior art keywords
polyether amine
composition containing
polishing composition
containing polyether
polishing
Prior art date
Application number
MYPI2011005441A
Other languages
English (en)
Inventor
Dysard Jeffrey
Feeney Paul
Anjur Sriram
Johns Timothy
Yun-Biao Xin
Li Wang
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY160946A publication Critical patent/MY160946A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI2011005441A 2006-04-27 2007-04-18 Polishing composition containing polyether amine MY160946A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/412,369 US7585340B2 (en) 2006-04-27 2006-04-27 Polishing composition containing polyether amine

Publications (1)

Publication Number Publication Date
MY160946A true MY160946A (en) 2017-03-31

Family

ID=38646979

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2011005441A MY160946A (en) 2006-04-27 2007-04-18 Polishing composition containing polyether amine
MYPI20084283A MY146591A (en) 2006-04-27 2007-04-18 Polishing composition containing polyether amine

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI20084283A MY146591A (en) 2006-04-27 2007-04-18 Polishing composition containing polyether amine

Country Status (10)

Country Link
US (2) US7585340B2 (https=)
EP (1) EP2029689B1 (https=)
JP (1) JP5175270B2 (https=)
KR (1) KR101371850B1 (https=)
CN (1) CN101432384B (https=)
IL (1) IL194461A (https=)
MY (2) MY160946A (https=)
SG (1) SG171622A1 (https=)
TW (1) TWI351430B (https=)
WO (1) WO2007127121A1 (https=)

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US8697576B2 (en) * 2009-09-16 2014-04-15 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
US8815110B2 (en) * 2009-09-16 2014-08-26 Cabot Microelectronics Corporation Composition and method for polishing bulk silicon
US8883034B2 (en) * 2009-09-16 2014-11-11 Brian Reiss Composition and method for polishing bulk silicon
US8431490B2 (en) * 2010-03-31 2013-04-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
WO2012147312A1 (ja) * 2011-04-25 2012-11-01 バンドー化学株式会社 研磨フィルム
US8999193B2 (en) * 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
SG11201506102TA (en) * 2013-02-28 2015-09-29 Fujimi Inc Polishing slurry for cobalt removal
US9303188B2 (en) 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US9238754B2 (en) 2014-03-11 2016-01-19 Cabot Microelectronics Corporation Composition for tungsten CMP
US9303189B2 (en) 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
JP6306383B2 (ja) * 2014-03-17 2018-04-04 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物および基板研磨方法
US9309442B2 (en) 2014-03-21 2016-04-12 Cabot Microelectronics Corporation Composition for tungsten buffing
US9303190B2 (en) 2014-03-24 2016-04-05 Cabot Microelectronics Corporation Mixed abrasive tungsten CMP composition
US9127187B1 (en) 2014-03-24 2015-09-08 Cabot Microelectronics Corporation Mixed abrasive tungsten CMP composition
CN104650740B (zh) * 2014-12-10 2017-07-14 深圳市力合材料有限公司 一种可实现快速稳定抛光的抛光液
JP2018506176A (ja) * 2014-12-16 2018-03-01 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ ゲルマニウムを含む基板の高効率研磨のための化学機械研磨（ｃｍｐ）組成物
JP2016154208A (ja) * 2015-02-12 2016-08-25 旭硝子株式会社 研磨剤、研磨方法および半導体集積回路装置の製造方法
CN119194461A (zh) * 2016-08-24 2024-12-27 Ppg工业俄亥俄公司 用于处理金属基材的碱性组合物
US20180244955A1 (en) 2017-02-28 2018-08-30 Versum Materials Us, Llc Chemical Mechanical Planarization of Films Comprising Elemental Silicon
US10106705B1 (en) * 2017-03-29 2018-10-23 Fujifilm Planar Solutions, LLC Polishing compositions and methods of use thereof
KR20180137167A (ko) * 2017-06-16 2018-12-27 삼성전자주식회사 화학적 기계적 연마용 슬러리 조성물 및 이를 이용하는 반도체 장치의 제조 방법
US10119048B1 (en) 2017-07-31 2018-11-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-abrasive CMP slurry compositions with tunable selectivity
US20200095502A1 (en) * 2018-09-26 2020-03-26 Versum Materials Us, Llc High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dishing In Shallow Trench Isolation(STI) Chemical Mechanical Planarization Polishing(CMP)
US12227673B2 (en) * 2018-12-04 2025-02-18 Cmc Materials Llc Composition and method for silicon nitride CMP
CN113004799A (zh) * 2019-12-19 2021-06-22 安集微电子科技（上海）股份有限公司 一种化学机械抛光液
EP4653506A1 (en) * 2020-12-21 2025-11-26 FUJIFILM Electronic Materials U.S.A, Inc. Chemical mechanical polishing compositions and methods of use thereof

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Also Published As

Publication number Publication date
TW200811276A (en) 2008-03-01
JP5175270B2 (ja) 2013-04-03
US20090289033A1 (en) 2009-11-26
US8741009B2 (en) 2014-06-03
US20070251155A1 (en) 2007-11-01
CN101432384A (zh) 2009-05-13
EP2029689B1 (en) 2019-05-15
IL194461A0 (en) 2009-08-03
TWI351430B (en) 2011-11-01
EP2029689A1 (en) 2009-03-04
KR20090009264A (ko) 2009-01-22
IL194461A (en) 2014-07-31
US7585340B2 (en) 2009-09-08
CN101432384B (zh) 2013-05-08
MY146591A (en) 2012-08-30
KR101371850B1 (ko) 2014-03-07
JP2009535816A (ja) 2009-10-01
SG171622A1 (en) 2011-06-29
EP2029689A4 (en) 2010-11-17
WO2007127121A1 (en) 2007-11-08

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