MY160373A - Bonding structure and method - Google Patents

Bonding structure and method

Info

Publication number
MY160373A
MY160373A MYPI2010003445A MYPI2010003445A MY160373A MY 160373 A MY160373 A MY 160373A MY PI2010003445 A MYPI2010003445 A MY PI2010003445A MY PI2010003445 A MYPI2010003445 A MY PI2010003445A MY 160373 A MY160373 A MY 160373A
Authority
MY
Malaysia
Prior art keywords
bonding structure
nanoparticle preform
bonding
preform
nanoparticle
Prior art date
Application number
MYPI2010003445A
Other languages
English (en)
Inventor
Krishnan Shutesh
Sung Won Yung
Original Assignee
Semiconductor Components Ind Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Ind Llc filed Critical Semiconductor Components Ind Llc
Priority to MYPI2010003445A priority Critical patent/MY160373A/en
Priority to US12/901,684 priority patent/US20120018864A1/en
Priority to TW100121478A priority patent/TWI550807B/zh
Priority to CN201110187482.2A priority patent/CN102347252B/zh
Priority to JP2011159078A priority patent/JP5882618B2/ja
Priority to US14/339,524 priority patent/US9780059B2/en
Priority to JP2015160138A priority patent/JP6101758B2/ja
Publication of MY160373A publication Critical patent/MY160373A/en
Priority to US15/663,802 priority patent/US9997485B2/en

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    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
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    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
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    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
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    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
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    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
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    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
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    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07632—Compression bonding, e.g. thermocompression bonding
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07632—Compression bonding, e.g. thermocompression bonding
    • H10W72/07633—Ultrasonic bonding, e.g. thermosonic bonding
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    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07635—Applying EM radiation, e.g. induction heating or using a laser
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    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
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    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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    • H10W72/853—On the same surface
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    • H10W72/851—Dispositions of multiple connectors or interconnections
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    • H10W72/874—On different surfaces
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    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Die Bonding (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
MYPI2010003445A 2010-07-21 2010-07-21 Bonding structure and method MY160373A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
MYPI2010003445A MY160373A (en) 2010-07-21 2010-07-21 Bonding structure and method
US12/901,684 US20120018864A1 (en) 2010-07-21 2010-10-11 Bonding structure and method
TW100121478A TWI550807B (zh) 2010-07-21 2011-06-20 接合結構及方法
CN201110187482.2A CN102347252B (zh) 2010-07-21 2011-07-06 键合结构和方法
JP2011159078A JP5882618B2 (ja) 2010-07-21 2011-07-20 ボンディング構造および方法
US14/339,524 US9780059B2 (en) 2010-07-21 2014-07-24 Bonding structure and method
JP2015160138A JP6101758B2 (ja) 2010-07-21 2015-08-14 ボンディング構造および方法
US15/663,802 US9997485B2 (en) 2010-07-21 2017-07-30 Bonding structure and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2010003445A MY160373A (en) 2010-07-21 2010-07-21 Bonding structure and method

Publications (1)

Publication Number Publication Date
MY160373A true MY160373A (en) 2017-03-15

Family

ID=45496354

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003445A MY160373A (en) 2010-07-21 2010-07-21 Bonding structure and method

Country Status (5)

Country Link
US (2) US20120018864A1 (https=)
JP (2) JP5882618B2 (https=)
CN (1) CN102347252B (https=)
MY (1) MY160373A (https=)
TW (1) TWI550807B (https=)

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WO2013187843A1 (en) * 2012-06-15 2013-12-19 Agency For Science, Technology And Research Embossing method and embossing arrangement
WO2014091517A1 (ja) * 2012-12-10 2014-06-19 株式会社ニッシン 接合方法
JP6245933B2 (ja) * 2013-10-17 2017-12-13 Ｄｏｗａエレクトロニクス株式会社 接合用銀シートおよびその製造方法並びに電子部品接合方法
JP6415381B2 (ja) 2015-04-30 2018-10-31 三菱電機株式会社 半導体装置の製造方法
US9576922B2 (en) * 2015-05-04 2017-02-21 Globalfoundries Inc. Silver alloying post-chip join
US9881895B2 (en) * 2015-08-18 2018-01-30 Lockheed Martin Corporation Wire bonding methods and systems incorporating metal nanoparticles
US20170309549A1 (en) * 2016-04-21 2017-10-26 Texas Instruments Incorporated Sintered Metal Flip Chip Joints
JP6763708B2 (ja) * 2016-06-30 2020-09-30 大陽日酸株式会社 接合材、接合材の製造方法、及び接合体
US10347507B2 (en) 2017-09-29 2019-07-09 Lg Innotek Co., Ltd. Printed circuit board
KR102531762B1 (ko) 2017-09-29 2023-05-12 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
DE102018128748A1 (de) * 2018-11-15 2020-05-20 Infineon Technologies Ag Verfahren zur herstellung einer halbleitervorrichtung mit einerpastenschicht und halbleitervorrichtung
US10914018B2 (en) * 2019-03-12 2021-02-09 Infineon Technologies Ag Porous Cu on Cu surface for semiconductor packages

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