MY147251A - Probe needle protection method for high current probe testing of power devices - Google Patents

Probe needle protection method for high current probe testing of power devices

Info

Publication number
MY147251A
MY147251A MYPI20084769A MYPI20084769A MY147251A MY 147251 A MY147251 A MY 147251A MY PI20084769 A MYPI20084769 A MY PI20084769A MY PI20084769 A MYPI20084769 A MY PI20084769A MY 147251 A MY147251 A MY 147251A
Authority
MY
Malaysia
Prior art keywords
current
probe
probes
high current
power devices
Prior art date
Application number
MYPI20084769A
Other languages
English (en)
Inventor
Rogers Gary
Clauter Steve
Schwartz Rodney
Ukai Taichi
Lambright Joe
Lohr Dave
Original Assignee
Integrated Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Technology Corp filed Critical Integrated Technology Corp
Publication of MY147251A publication Critical patent/MY147251A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
MYPI20084769A 2006-05-23 2007-05-23 Probe needle protection method for high current probe testing of power devices MY147251A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74798106P 2006-05-23 2006-05-23

Publications (1)

Publication Number Publication Date
MY147251A true MY147251A (en) 2012-11-14

Family

ID=38724104

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20084769A MY147251A (en) 2006-05-23 2007-05-23 Probe needle protection method for high current probe testing of power devices

Country Status (3)

Country Link
JP (1) JP2009538428A (fr)
MY (1) MY147251A (fr)
WO (1) WO2007137284A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012031362A1 (fr) * 2010-09-07 2012-03-15 Corporation De L ' Ecole Polytechnique De Montreal Procédés, appareil et système pour supporter des microsystèmes à grande échelle dans lesquels sont distribués et inclus, une alimentation électrique, une régulation thermique, des capteurs multi-distribués et la propagation des signaux électriques
JP5291157B2 (ja) 2011-08-01 2013-09-18 東京エレクトロン株式会社 パワーデバイス用のプローブカード
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
US10698020B2 (en) 2014-03-26 2020-06-30 Teradyne, Inc. Current regulation for accurate and low-cost voltage measurements at the wafer level
US11041900B2 (en) 2014-03-26 2021-06-22 Teradyne, Inc. Equi-resistant probe distribution for high-accuracy voltage measurements at the wafer level
JP6339834B2 (ja) * 2014-03-27 2018-06-06 東京エレクトロン株式会社 基板検査装置
JP6351442B2 (ja) * 2014-08-28 2018-07-04 ルネサスエレクトロニクス株式会社 半導体試験装置
US10330703B2 (en) * 2017-04-04 2019-06-25 Formfactor Beaverton, Inc. Probe systems and methods including electric contact detection
CN111562481B (zh) * 2020-05-25 2022-08-02 中国电子科技集团公司第十三研究所 基于加电探针的化合物半导体芯片在片测试电路
CN116243095B (zh) * 2023-05-10 2023-07-21 深圳弘远电气有限公司 基于自动化程控的测试电路、测试装置及其控制方法
CN117214649A (zh) * 2023-11-07 2023-12-12 珠海格力电子元器件有限公司 功率器件测试装置和方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142526A (ja) * 1983-12-29 1985-07-27 Toshiba Corp 半導体素子の電気特性測定方法
JPH0469715A (ja) * 1990-07-10 1992-03-04 Mitsubishi Electric Corp 直流電源装置
US5365180A (en) * 1993-04-16 1994-11-15 National Semiconductor Corporation Method for measuring contact resistance
JP2775222B2 (ja) * 1993-09-14 1998-07-16 ソニー・テクトロニクス株式会社 電力制御回路
US5642035A (en) * 1994-06-16 1997-06-24 Bio-Rad Laboratories Transfection high-voltage controller
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
JPH104624A (ja) * 1996-06-13 1998-01-06 Nec Gumma Ltd 過電圧保護回路及びこれを備える電子回路
JP2001053120A (ja) * 1999-08-09 2001-02-23 Sharp Corp 過電流検出機能付半導体集積回路およびその製造方法
JP2002095157A (ja) * 2000-07-10 2002-03-29 Matsushita Electric Ind Co Ltd 過充電防止回路
JP2003038679A (ja) * 2001-08-02 2003-02-12 Alinco Inc 電動式ウォーカ
JP2004085247A (ja) * 2002-08-23 2004-03-18 Mitsubishi Electric Corp プローブカード
DE10308333A1 (de) * 2003-02-26 2004-09-16 Infineon Technologies Ag Burn-In-System, Kontaktiereinrichtung für Burn-In-System und Verfahren zum Durchführen eines Burn-Ins
AT500263B1 (de) * 2004-03-15 2007-04-15 T I P S Messtechnik Gmbh Verfahren und schaltung zum schutz von prüfkontakten bei der hochstrom-messung von halbleiter-bauelementen
US7307433B2 (en) * 2004-04-21 2007-12-11 Formfactor, Inc. Intelligent probe card architecture
JP2006038599A (ja) * 2004-07-26 2006-02-09 Nec Electronics Corp 接触抵抗測定方法，接触抵抗測定装置，及び半導体ウェハー
US7029932B1 (en) * 2005-02-07 2006-04-18 Texas Instruments Incorporated Circuit and method for measuring contact resistance

Also Published As

Publication number Publication date
JP2009538428A (ja) 2009-11-05
WO2007137284A3 (fr) 2008-03-27
WO2007137284A2 (fr) 2007-11-29

Similar Documents

Publication Publication Date Title
MY147251A (en) Probe needle protection method for high current probe testing of power devices
EP3624092A3 (fr) Dispositif d'affichage et procédé d'essai correspondant
TW200706880A (en) Microstructure probe card, and microstructure inspecting device, method, and computer program
WO2004059331A3 (fr) Dispositif et procede destines a limiter la surcourse dans un ensemble de cartes sondes
WO2011150409A3 (fr) Solution pour test dut parallèle à vitesse maximale
PH12020552245A1 (en) Probe card for high frequency applications
KR920004847A (ko) 전기 회로측정용 탐침의 접촉검지장치 및 이 접촉검지장치를 이용한 전기회로 측정장치
SG10201809420TA (en) Current regulation for accurate and low-cost voltage measurements at the wafer level
WO2009045629A3 (fr) Appareil, système et méthode associée, de suivi de la corrosion de surfaces
TW200634313A (en) Probe head arrays
SG10201809421RA (en) Equi-resistant probe distribution for high-accuracy voltage measurements at the wafer level
WO2010018197A3 (fr) Ensemble permettant la mesure de grandeurs de rendement et/ou de consommation électrique dans un réseau basse tension
JP2001210685A5 (fr)
WO2011089462A8 (fr) Dispositif de détection de puce endommagée pour un circuit intégré à semi-conducteurs
WO2008139579A1 (fr) Appareil de vérification de composants électroniques, système de vérification de composants électroniques, et procédé de vérification de composants électroniques
WO2011109487A8 (fr) Procédé et appareil pour tester un dispositif de mémoire
US20150025830A1 (en) Methods and systems to measure a signal on an integrated circuit die
TW200703472A (en) Semiconductor test device
ATE525262T1 (de) Überwachungsvorrichtung zur überwachung eines anschlusses einer anschlusskomponente
TW200632335A (en) TFT tester and test method
ATE287543T1 (de) Testeinrichtung zum testen eines moduls für einen zum kontaktlosen kommunizieren vorgesehenen datenträger
TW200506399A (en) Event based test method for debugging timing related failures in integrated circuits
TW200709316A (en) Substrate and testing method thereof
CN103969544B (zh) 一种集成电路高压引脚连通性测试方法
EP2722875A3 (fr) Appareil et procédé de test électrique pour puce retournée