SG10201809420TA - Current regulation for accurate and low-cost voltage measurements at the wafer level - Google Patents

Current regulation for accurate and low-cost voltage measurements at the wafer level

Info

Publication number
SG10201809420TA
SG10201809420TA SG10201809420TA SG10201809420TA SG10201809420TA SG 10201809420T A SG10201809420T A SG 10201809420TA SG 10201809420T A SG10201809420T A SG 10201809420TA SG 10201809420T A SG10201809420T A SG 10201809420TA SG 10201809420T A SG10201809420T A SG 10201809420TA
Authority
SG
Singapore
Prior art keywords
current
accurate
voltage
resistance
pad
Prior art date
Application number
SG10201809420TA
Inventor
Jack Weimer
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of SG10201809420TA publication Critical patent/SG10201809420TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/20—Measuring earth resistance; Measuring contact resistance, e.g. of earth connections, e.g. plates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2621—Circuits therefor for testing field effect transistors, i.e. FET's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

CURRENT REGULATION FOR ACCURATE AND LOW-COST VOLTAGE MEASUREMENTS AT THE WAFER LEVEL A test system and test techniques for accurate high current parametric testing of semiconductor devices. In operation, the test system supplies a current to the semiconductor device and measures a voltage on the device. The testing system may use the measured voltage to compute an ON resistance for the high-current semiconductor device. In one technique, multiple force needles contact a pad in positions that provide equi-resistant paths to one or more sense needles contacting the same pad. In another technique, current flow through the force needles is regulated such that voltage at the pad of the device under test is representative of the ON resistance of the device and independent of contact resistance of the force needle. Another technique entails generating an alarm indication when the contact resistance of a force needle exceeds a threshold. Fig. 1
SG10201809420TA 2014-03-26 2015-03-18 Current regulation for accurate and low-cost voltage measurements at the wafer level SG10201809420TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/225,951 US10698020B2 (en) 2014-03-26 2014-03-26 Current regulation for accurate and low-cost voltage measurements at the wafer level

Publications (1)

Publication Number Publication Date
SG10201809420TA true SG10201809420TA (en) 2018-11-29

Family

ID=54189968

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201607060QA SG11201607060QA (en) 2014-03-26 2015-03-18 Current regulation for accurate and low-cost voltage measurements at the wafer level
SG10201809420TA SG10201809420TA (en) 2014-03-26 2015-03-18 Current regulation for accurate and low-cost voltage measurements at the wafer level

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201607060QA SG11201607060QA (en) 2014-03-26 2015-03-18 Current regulation for accurate and low-cost voltage measurements at the wafer level

Country Status (6)

Country Link
US (1) US10698020B2 (en)
JP (1) JP6518682B2 (en)
KR (1) KR102277218B1 (en)
CN (1) CN106104783B (en)
SG (2) SG11201607060QA (en)
WO (1) WO2015148204A1 (en)

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US11041900B2 (en) * 2014-03-26 2021-06-22 Teradyne, Inc. Equi-resistant probe distribution for high-accuracy voltage measurements at the wafer level
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CN112611950A (en) * 2020-11-26 2021-04-06 中国计量大学 Quantum chip detection tool and detection system
CN113884716B (en) * 2021-10-26 2024-05-10 江西龙芯微科技有限公司 Integrated circuit wafer testing device and method

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Also Published As

Publication number Publication date
US10698020B2 (en) 2020-06-30
JP6518682B2 (en) 2019-05-22
CN106104783A (en) 2016-11-09
CN106104783B (en) 2020-12-15
WO2015148204A1 (en) 2015-10-01
KR102277218B1 (en) 2021-07-15
SG11201607060QA (en) 2016-10-28
KR20160138486A (en) 2016-12-05
JP2017510988A (en) 2017-04-13
US20150276799A1 (en) 2015-10-01

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