MY143652A - Polishing composition for glass substrate - Google Patents
Polishing composition for glass substrateInfo
- Publication number
- MY143652A MY143652A MYPI20055822A MYPI20055822A MY143652A MY 143652 A MY143652 A MY 143652A MY PI20055822 A MYPI20055822 A MY PI20055822A MY PI20055822 A MYPI20055822 A MY PI20055822A MY 143652 A MY143652 A MY 143652A
- Authority
- MY
- Malaysia
- Prior art keywords
- substrate
- glass
- polishing composition
- glass substrate
- polishing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 10
- 238000005498 polishing Methods 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 title abstract 5
- 239000011521 glass Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000002241 glass-ceramic Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 239000011164 primary particle Substances 0.000 abstract 1
- 150000003460 sulfonic acids Chemical group 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004359842A JP4667848B2 (ja) | 2004-12-13 | 2004-12-13 | ガラス基板用研磨液組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY143652A true MY143652A (en) | 2011-06-30 |
Family
ID=35735789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20055822A MY143652A (en) | 2004-12-13 | 2005-12-12 | Polishing composition for glass substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4667848B2 (ja) |
CN (2) | CN1789366A (ja) |
GB (1) | GB2421955B (ja) |
MY (1) | MY143652A (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102863943B (zh) | 2005-08-30 | 2015-03-25 | 花王株式会社 | 硬盘用基板用研磨液组合物、基板的研磨方法和制造方法 |
JP5283247B2 (ja) * | 2005-12-22 | 2013-09-04 | 花王株式会社 | ガラス基板用研磨液組成物 |
GB2433516B (en) * | 2005-12-22 | 2010-11-03 | Kao Corp | Polishing composition for glass substrate |
JP5008350B2 (ja) * | 2006-07-05 | 2012-08-22 | 花王株式会社 | ガラス基板用の研磨液組成物 |
JP5606663B2 (ja) * | 2006-12-26 | 2014-10-15 | 花王株式会社 | 研磨用シリカ粒子分散液 |
JP5437571B2 (ja) * | 2006-12-26 | 2014-03-12 | 花王株式会社 | 研磨液キット |
KR101564922B1 (ko) * | 2008-05-09 | 2015-11-03 | 삼성디스플레이 주식회사 | 소다라임유리 기판의 처리 방법을 이용한 표시기판의 제조 방법 |
WO2009154164A1 (ja) | 2008-06-18 | 2009-12-23 | 株式会社 フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
JP5251861B2 (ja) * | 2009-12-28 | 2013-07-31 | 信越化学工業株式会社 | 合成石英ガラス基板の製造方法 |
WO2011132665A1 (ja) | 2010-04-20 | 2011-10-27 | 花王株式会社 | ハードディスク用アルミノシリケートガラス基板の製造方法 |
JP2013080530A (ja) * | 2011-09-30 | 2013-05-02 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
CN103958124A (zh) * | 2011-12-02 | 2014-07-30 | 旭硝子株式会社 | 玻璃板的研磨装置 |
US10068602B2 (en) * | 2013-06-29 | 2018-09-04 | Hoya Corporation | Method for manufacturing glass substrate, method for manufacturing magnetic disk, and polishing liquid composition for glass substrate |
JP6393231B2 (ja) | 2015-05-08 | 2018-09-19 | 信越化学工業株式会社 | 合成石英ガラス基板用研磨剤及び合成石英ガラス基板の研磨方法 |
JP6560155B2 (ja) | 2016-04-20 | 2019-08-14 | 信越化学工業株式会社 | 合成石英ガラス基板用研磨剤及び合成石英ガラス基板の研磨方法 |
JP6694653B2 (ja) | 2017-04-10 | 2020-05-20 | 信越化学工業株式会社 | 合成石英ガラス基板用研磨剤及びその製造方法並びに合成石英ガラス基板の研磨方法 |
JP6985116B2 (ja) | 2017-11-17 | 2021-12-22 | 信越化学工業株式会社 | 合成石英ガラス基板用の研磨剤及び合成石英ガラス基板の研磨方法 |
CN108148507B (zh) * | 2017-12-18 | 2020-12-04 | 清华大学 | 一种用于熔石英的抛光组合物 |
JP2021183655A (ja) | 2020-05-21 | 2021-12-02 | 信越化学工業株式会社 | 合成石英ガラス基板用の研磨剤及びその研磨剤の製造方法、及び合成石英ガラス基板の研磨方法 |
CN113618497A (zh) * | 2021-07-09 | 2021-11-09 | 维达力实业(赤壁)有限公司 | 用于抛光微晶陶瓷的抛光液以及微晶陶瓷抛光方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0322721B1 (en) * | 1987-12-29 | 1993-10-06 | E.I. Du Pont De Nemours And Company | Fine polishing composition for wafers |
SG78405A1 (en) * | 1998-11-17 | 2001-02-20 | Fujimi Inc | Polishing composition and rinsing composition |
US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
JP4095833B2 (ja) * | 2002-05-30 | 2008-06-04 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
US20060096179A1 (en) * | 2004-11-05 | 2006-05-11 | Cabot Microelectronics Corporation | CMP composition containing surface-modified abrasive particles |
-
2004
- 2004-12-13 JP JP2004359842A patent/JP4667848B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-08 GB GB0525057A patent/GB2421955B/en not_active Expired - Fee Related
- 2005-12-09 CN CNA2005101294959A patent/CN1789366A/zh active Pending
- 2005-12-09 CN CN201010226178.XA patent/CN101892032A/zh active Pending
- 2005-12-12 MY MYPI20055822A patent/MY143652A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1789366A (zh) | 2006-06-21 |
CN101892032A (zh) | 2010-11-24 |
JP4667848B2 (ja) | 2011-04-13 |
JP2006167817A (ja) | 2006-06-29 |
GB2421955A (en) | 2006-07-12 |
GB0525057D0 (en) | 2006-01-18 |
GB2421955B (en) | 2009-10-14 |
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