MY142253A - Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method - Google Patents

Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method

Info

Publication number
MY142253A
MY142253A MYPI98001562A MYPI9801562A MY142253A MY 142253 A MY142253 A MY 142253A MY PI98001562 A MYPI98001562 A MY PI98001562A MY PI9801562 A MYPI9801562 A MY PI9801562A MY 142253 A MY142253 A MY 142253A
Authority
MY
Malaysia
Prior art keywords
soldering
reflow
breflow
equipment
heat exchange
Prior art date
Application number
MYPI98001562A
Other languages
English (en)
Inventor
Hiroaki Aiura
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of MY142253A publication Critical patent/MY142253A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/081Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI98001562A 1997-04-10 1998-04-09 Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method MY142253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9091226A JPH10284832A (ja) 1997-04-10 1997-04-10 リフロー半田付け装置

Publications (1)

Publication Number Publication Date
MY142253A true MY142253A (en) 2010-11-15

Family

ID=14020518

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98001562A MY142253A (en) 1997-04-10 1998-04-09 Reflow soldering method, and reflow soldering equipment for soldering by breflow soldering method

Country Status (5)

Country Link
JP (1) JPH10284832A (ko)
KR (1) KR100270764B1 (ko)
CN (1) CN1091567C (ko)
GB (1) GB2324058B (ko)
MY (1) MY142253A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101174315B1 (ko) * 2008-09-18 2012-08-16 알프스 덴키 가부시키가이샤 전기 부품, 및 상기 전기 부품의 실장 구조, 그리고 상기 전기 부품의 실장 방법
DE102013217952B3 (de) * 2013-09-09 2014-11-06 Ersa Gmbh Vorrichtung zur Zuführung eines Heißgasstroms
WO2016006625A1 (ja) * 2014-07-11 2016-01-14 株式会社ニチレイフーズ 食品加熱装置
EP3009220B1 (de) * 2014-10-17 2018-12-19 Rehm Thermal Systems GmbH Rolle-zu-Rolle-Fertigungsanlage und -verfahren für verkettete kontinuierliche und diskontinuierliche Verarbeitungsprozesse
WO2016182641A1 (en) 2015-05-13 2016-11-17 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
US9647353B2 (en) 2015-05-13 2017-05-09 Commscope Technologies Llc Method and apparatus for forming interface between coaxial cable and connector
CN105562870A (zh) * 2015-12-23 2016-05-11 南通富士通微电子股份有限公司 使用甲酸的无助焊剂回流方法及甲酸回流装置
CN112620853B (zh) * 2020-12-17 2022-07-01 江西超联半导体科技有限公司 一种发光二极管生产用多功能回流焊装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4060379A (en) * 1975-02-06 1977-11-29 Hague International Energy conserving process furnace system and components thereof
US4029465A (en) * 1975-02-06 1977-06-14 Hague International Corporation Energy conserving process furnace system and components thereof
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH01275362A (ja) * 1988-04-27 1989-11-06 Florm Co Ltd 基板の搬送装置
JPH03207573A (ja) * 1990-01-08 1991-09-10 Matsushita Electric Ind Co Ltd 接合体の製造方法及びその装置
JPH0422573A (ja) * 1990-05-18 1992-01-27 Tamura Seisakusho Co Ltd 熱風リフロー装置
JPH0569119A (ja) * 1991-01-17 1993-03-23 Nippon Haiburitsudo Kk 熱風を利用したリフロー炉
JPH07115166B2 (ja) * 1991-03-26 1995-12-13 日立テクノエンジニアリング株式会社 リフローはんだ付け方法およびその装置
JPH07231160A (ja) * 1994-02-18 1995-08-29 Hitachi Techno Eng Co Ltd リフローはんだ付け装置
JPH08250852A (ja) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター

Also Published As

Publication number Publication date
CN1091567C (zh) 2002-09-25
GB2324058B (en) 2002-04-10
JPH10284832A (ja) 1998-10-23
GB9805394D0 (en) 1998-05-06
GB2324058A (en) 1998-10-14
CN1197366A (zh) 1998-10-28
KR100270764B1 (ko) 2001-01-15
KR19980081217A (ko) 1998-11-25
JP2812675B1 (ko) 1998-10-22

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