MY133099A - Solder ball loading mechanism - Google Patents

Solder ball loading mechanism

Info

Publication number
MY133099A
MY133099A MYPI98002503A MYPI9802503A MY133099A MY 133099 A MY133099 A MY 133099A MY PI98002503 A MYPI98002503 A MY PI98002503A MY PI9802503 A MYPI9802503 A MY PI9802503A MY 133099 A MY133099 A MY 133099A
Authority
MY
Malaysia
Prior art keywords
ball
templates
detector
container
plate
Prior art date
Application number
MYPI98002503A
Other languages
English (en)
Inventor
Tan Chin Hiang
See Toh Weng Sang
Original Assignee
Advanced Systems Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Ltd filed Critical Advanced Systems Automation Ltd
Publication of MY133099A publication Critical patent/MY133099A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
MYPI98002503A 1997-04-11 1998-06-04 Solder ball loading mechanism MY133099A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG1997001173A SG66361A1 (en) 1997-04-11 1997-04-11 Solder ball loading mechanism
PCT/SG1998/000025 WO1998047330A1 (en) 1997-04-11 1998-04-09 Solder ball loading mechanism

Publications (1)

Publication Number Publication Date
MY133099A true MY133099A (en) 2007-10-31

Family

ID=20429621

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98002503A MY133099A (en) 1997-04-11 1998-06-04 Solder ball loading mechanism

Country Status (4)

Country Link
MY (1) MY133099A (zh)
SG (1) SG66361A1 (zh)
TW (1) TW405194B (zh)
WO (1) WO1998047330A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641030B1 (en) * 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6769596B1 (en) * 2002-11-15 2004-08-03 Qlogic Corporation Method and system for reworking ball grid arrays

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5540377A (en) * 1994-07-15 1996-07-30 Ito; Carl T. Solder ball placement machine
US5551216A (en) * 1994-09-14 1996-09-03 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
US5620129A (en) * 1995-02-17 1997-04-15 Rogren; Philip E. Device and method for forming and attaching an array of conductive balls

Also Published As

Publication number Publication date
SG66361A1 (en) 1999-07-20
TW405194B (en) 2000-09-11
WO1998047330A1 (en) 1998-10-22

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