MY132660A - Voltage measuring method, electrical test method and apparatus, semiconductor device manufacturing method and device substrate manufacturing method - Google Patents
Voltage measuring method, electrical test method and apparatus, semiconductor device manufacturing method and device substrate manufacturing methodInfo
- Publication number
- MY132660A MY132660A MYPI20021666A MYPI20021666A MY132660A MY 132660 A MY132660 A MY 132660A MY PI20021666 A MYPI20021666 A MY PI20021666A MY PI20021666 A MYPI20021666 A MY PI20021666A MY 132660 A MY132660 A MY 132660A
- Authority
- MY
- Malaysia
- Prior art keywords
- manufacturing
- possessed
- alternating current
- testing
- test method
- Prior art date
Links
- 238000010998 test method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000012360 testing method Methods 0.000 abstract 6
- 238000012544 monitoring process Methods 0.000 abstract 2
- 230000005674 electromagnetic induction Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
- Thin Film Transistor (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A SIMPLIFIED TEST METHOD IS ESTABLISHED NOT TO USE A PROBE ON THE INTERCONNECTION, AND A TEST APPARATUS IS PROVIDED WHICH USES THE TEST METHOD.THE PRIMARY COIL (206) POSSESSED BY A TESTING SUBSTRATE AND THE SECONDARY COIL (207) POSSESSED BY AN OLED PANEL ARE SUPERPOSED TOGETHER THROUGH A CONSTANT SPACING. AN ALTERNATING CURRENT SIGNAL IS INPUTTED TO THE PRIMARY COIL (206) TO GENERATE AN ELECTROMOTIVE FORCE ON THE SECONDARY COIL (207) DUE TO ELECTROMAGNETIC INDUCTION. BY USING THE ELECTROMOTIVE FORCE, THE PIXEL POSSESSED BY THE OLED PANEL IS OPERATED. A PIXEL ELECTRODE (208) AND A TESTING ELECTRODE (104) ARE SUPERPOSED TOGETHER THROUGH A CONSTANT SPACING. BY MONITORING AN ALTERNATING CURRENT VOLTAGE GENERATED ON THE TESTING ELECTRODE, A FAULTY POINT IS DETECTED: FURTHERMORE, AN OPERATING STATE OF EACH PIXEL MAY BE CONFIRMED BY MONITORING AN ALTERNATING CURRENT VOLTAGE GENERATED ON THE TESTING ELECTRODE (104) WHILE CHANGING THE POSITION OF THE TESTING ELECTRODE (104).(FIG 1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001145060 | 2001-05-15 | ||
JP2001223647 | 2001-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY132660A true MY132660A (en) | 2007-10-31 |
Family
ID=26615116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20021666A MY132660A (en) | 2001-05-15 | 2002-05-08 | Voltage measuring method, electrical test method and apparatus, semiconductor device manufacturing method and device substrate manufacturing method |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR100873181B1 (en) |
CN (1) | CN1274014C (en) |
MY (1) | MY132660A (en) |
SG (2) | SG105545A1 (en) |
TW (1) | TW573128B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101270180B1 (en) | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device |
JP4394980B2 (en) * | 2004-01-30 | 2010-01-06 | 日本電産リード株式会社 | Substrate inspection apparatus and substrate inspection method |
US7466157B2 (en) * | 2004-02-05 | 2008-12-16 | Formfactor, Inc. | Contactless interfacing of test signals with a device under test |
TWI391685B (en) | 2009-10-16 | 2013-04-01 | Ind Tech Res Inst | Station for detecting winding products and method for detecting inter-turn short-circuit |
TWI481300B (en) * | 2009-12-31 | 2015-04-11 | Univ Tsinghua | Organic electroluminescent devices and their test methods |
KR20140057243A (en) | 2011-07-15 | 2014-05-12 | 오르보테크 엘티디. | Electrical inspection of electronic devices using electron-beam induced plasma probes |
US9379029B2 (en) * | 2012-07-18 | 2016-06-28 | Toyota Jidosha Kabushiki Kaisha | Inspection apparatus, inspection system, inspection method of semiconductor devices, and manufacturing method of inspected semiconductor devices |
KR102043179B1 (en) | 2013-02-18 | 2019-11-12 | 삼성디스플레이 주식회사 | Detecting method of defect of barrier film and detecting apparatus of defect of barrier film for flat panel display device |
TWI730591B (en) * | 2020-01-15 | 2021-06-11 | 興城科技股份有限公司 | Inspection equipment for glass substrate and method thereof |
KR102410310B1 (en) * | 2021-05-03 | 2022-06-22 | (주) 엔지온 | Measuring unit of electrical characteristic of semiconductor an apparatus for measuring electrical characteristic of semiconductor and a method for using the same |
US12000866B2 (en) | 2022-04-20 | 2024-06-04 | Envigth Co., Ltd. | Detection unit, semiconductor film layer inspection apparatus including the same, and semiconductor film layer inspection method using the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2803943B2 (en) * | 1992-10-21 | 1998-09-24 | アルプス電気株式会社 | Non-contact power supply |
US5428300A (en) * | 1993-04-26 | 1995-06-27 | Telenix Co., Ltd. | Method and apparatus for testing TFT-LCD |
JPH06349913A (en) * | 1993-06-14 | 1994-12-22 | Fujitsu Ltd | Non-contact monitoring method for burn-in test |
JP3269225B2 (en) * | 1993-11-17 | 2002-03-25 | 横河電機株式会社 | Print coil tester |
JP2909807B2 (en) * | 1995-11-22 | 1999-06-23 | セイコーインスツルメンツ株式会社 | Superconducting quantum interference device magnetometer and non-destructive inspection device |
JP3328553B2 (en) * | 1997-07-25 | 2002-09-24 | 松下電器産業株式会社 | Circuit board inspection equipment |
JP4075138B2 (en) * | 1998-06-05 | 2008-04-16 | 凸版印刷株式会社 | Non-contact IC card inspection device and inspection method |
JP2000258482A (en) * | 1999-03-08 | 2000-09-22 | Toshiba Corp | Frequency inspection device |
JP2001133487A (en) * | 1999-11-01 | 2001-05-18 | Mitsubishi Heavy Ind Ltd | Potential sensor |
JP2001194405A (en) * | 2000-01-07 | 2001-07-19 | Oht Kk | Probe for inspecting substrate and inspection/method for substrate |
KR100324138B1 (en) * | 2000-02-07 | 2002-02-20 | 은탁 | Inspection apparatus and method adapted to a scanning technique employing a capacitance gap sensor probe |
-
2002
- 2002-05-01 TW TW91109075A patent/TW573128B/en not_active IP Right Cessation
- 2002-05-02 SG SG200202591A patent/SG105545A1/en unknown
- 2002-05-02 SG SG200507157-6A patent/SG132529A1/en unknown
- 2002-05-08 MY MYPI20021666A patent/MY132660A/en unknown
- 2002-05-15 CN CNB021193592A patent/CN1274014C/en not_active Expired - Fee Related
- 2002-05-15 KR KR1020020026675A patent/KR100873181B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SG105545A1 (en) | 2004-08-27 |
CN1387246A (en) | 2002-12-25 |
SG132529A1 (en) | 2007-06-28 |
KR100873181B1 (en) | 2008-12-10 |
TW573128B (en) | 2004-01-21 |
CN1274014C (en) | 2006-09-06 |
KR20020087376A (en) | 2002-11-22 |
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