MY114143A - Polishing member and wafer polishing apparatus - Google Patents

Polishing member and wafer polishing apparatus

Info

Publication number
MY114143A
MY114143A MYPI94003349A MYPI19943349A MY114143A MY 114143 A MY114143 A MY 114143A MY PI94003349 A MYPI94003349 A MY PI94003349A MY PI19943349 A MYPI19943349 A MY PI19943349A MY 114143 A MY114143 A MY 114143A
Authority
MY
Malaysia
Prior art keywords
polishing
wafer
pressure
polishing member
constructedby
Prior art date
Application number
MYPI94003349A
Other languages
English (en)
Inventor
Suzuki Fumio
Tanaka Kouichi
Hashimoto Hiromasa
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY114143A publication Critical patent/MY114143A/en

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laminated Bodies (AREA)
MYPI94003349A 1993-12-14 1994-12-14 Polishing member and wafer polishing apparatus MY114143A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34294093A JP2900777B2 (ja) 1993-12-14 1993-12-14 研磨部材およびウエーハ研磨装置

Publications (1)

Publication Number Publication Date
MY114143A true MY114143A (en) 2002-08-30

Family

ID=18357699

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94003349A MY114143A (en) 1993-12-14 1994-12-14 Polishing member and wafer polishing apparatus

Country Status (2)

Country Link
JP (1) JP2900777B2 (ja)
MY (1) MY114143A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329644B2 (ja) * 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
EP0779655A3 (en) * 1995-12-14 1997-07-16 International Business Machines Corporation A method of chemically-mechanically polishing an electronic component
JPH09166526A (ja) * 1995-12-14 1997-06-24 Nec Corp 透過形電子顕微鏡用試料の作製方法
EP1108500B1 (en) 1998-08-28 2007-10-17 Toray Industries, Inc. Polishing pad
JP4778130B2 (ja) * 1999-06-17 2011-09-21 スピードファム株式会社 エッジポリッシング装置及びエッジポリッシング方法
JP4986099B2 (ja) * 2003-06-09 2012-07-25 花王株式会社 基板の製造方法
JP2005001018A (ja) * 2003-06-09 2005-01-06 Kao Corp 基板の製造方法
JP3754436B2 (ja) 2004-02-23 2006-03-15 東洋ゴム工業株式会社 研磨パッドおよびそれを使用する半導体デバイスの製造方法
CN116670328A (zh) * 2021-10-28 2023-08-29 东海炭素株式会社 一种多晶SiC成型体及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612734A (en) * 1979-07-10 1981-02-07 Nec Corp Wafer polishing method
JPS6234689Y2 (ja) * 1981-06-25 1987-09-03
JPS62156365A (ja) * 1985-12-27 1987-07-11 Kanebo Ltd スエード様シート材からなる研磨布の製造方法
JPS63196369A (ja) * 1987-02-07 1988-08-15 Showa Denko Kk アルミニウム磁気デイスク研磨用組成物

Also Published As

Publication number Publication date
JPH07164307A (ja) 1995-06-27
JP2900777B2 (ja) 1999-06-02

Similar Documents

Publication Publication Date Title
EP0800808A4 (en) SUCTIONABLE ARTICLE
MY104104A (en) Method and apparatus for preparing textured apertured film.
AU553752B2 (en) Adhesive film dressing with fabric backing
ES2008294A6 (es) Cintas adhesivas formadas por un revestimiento adhesivo sobre tela y plastico,y metodo para producirla.
MY114143A (en) Polishing member and wafer polishing apparatus
CA2051679A1 (en) Conformable abrasive article
GB884331A (en) Disposable diaper
TW344695B (en) Method for polishing semiconductor substrate
MY121995A (en) Apparatus for mirror-polishing thin plate.
MY126920A (en) Absorbent article having fibrous layer on surface
JPS6461224A (en) Laminated foam product
TW372901B (en) Chemical and mechanical polishing apparatus
MY129950A (en) Workpiece holding mechanism
MY100170A (en) Absorbent articles.
US4779300A (en) Contact lens cleaning device
GB2006667A (en) A process of manufacturing a surface layer for a cushion body
ES8706873A1 (es) Un metodo para interrumpir intermitentemente el flujo de una primera corriente de fluido dentro de un canal abierto, y un aparato correspondiente
GB2344758A (en) Embellishing articles
DE59706834D1 (de) Gerät zum chemisch-mechanischen Polieren von Wafern
JPS5590263A (en) Device for flatly and accurately polishing crystal substrate without causing irregularity
GB1396573A (en) Apparatus and method for embossing a pattern upon a sheet of imitation leather
GB1530737A (en) Support for the back or seat of a person
GB1518269A (en) Foam plastics element
ATE200443T1 (de) Streifenförmiges schleifmittel
JPS5481388A (en) Foamed decorative sheet and its production