MY114143A - Polishing member and wafer polishing apparatus - Google Patents
Polishing member and wafer polishing apparatusInfo
- Publication number
- MY114143A MY114143A MYPI94003349A MYPI19943349A MY114143A MY 114143 A MY114143 A MY 114143A MY PI94003349 A MYPI94003349 A MY PI94003349A MY PI19943349 A MYPI19943349 A MY PI19943349A MY 114143 A MY114143 A MY 114143A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- wafer
- pressure
- polishing member
- constructedby
- Prior art date
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34294093A JP2900777B2 (ja) | 1993-12-14 | 1993-12-14 | 研磨部材およびウエーハ研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY114143A true MY114143A (en) | 2002-08-30 |
Family
ID=18357699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI94003349A MY114143A (en) | 1993-12-14 | 1994-12-14 | Polishing member and wafer polishing apparatus |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2900777B2 (ja) |
MY (1) | MY114143A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3329644B2 (ja) * | 1995-07-21 | 2002-09-30 | 株式会社東芝 | 研磨パッド、研磨装置及び研磨方法 |
EP0779655A3 (en) * | 1995-12-14 | 1997-07-16 | International Business Machines Corporation | A method of chemically-mechanically polishing an electronic component |
JPH09166526A (ja) * | 1995-12-14 | 1997-06-24 | Nec Corp | 透過形電子顕微鏡用試料の作製方法 |
EP1108500B1 (en) | 1998-08-28 | 2007-10-17 | Toray Industries, Inc. | Polishing pad |
JP4778130B2 (ja) * | 1999-06-17 | 2011-09-21 | スピードファム株式会社 | エッジポリッシング装置及びエッジポリッシング方法 |
JP4986099B2 (ja) * | 2003-06-09 | 2012-07-25 | 花王株式会社 | 基板の製造方法 |
JP2005001018A (ja) * | 2003-06-09 | 2005-01-06 | Kao Corp | 基板の製造方法 |
JP3754436B2 (ja) | 2004-02-23 | 2006-03-15 | 東洋ゴム工業株式会社 | 研磨パッドおよびそれを使用する半導体デバイスの製造方法 |
CN116670328A (zh) * | 2021-10-28 | 2023-08-29 | 东海炭素株式会社 | 一种多晶SiC成型体及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612734A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Wafer polishing method |
JPS6234689Y2 (ja) * | 1981-06-25 | 1987-09-03 | ||
JPS62156365A (ja) * | 1985-12-27 | 1987-07-11 | Kanebo Ltd | スエード様シート材からなる研磨布の製造方法 |
JPS63196369A (ja) * | 1987-02-07 | 1988-08-15 | Showa Denko Kk | アルミニウム磁気デイスク研磨用組成物 |
-
1993
- 1993-12-14 JP JP34294093A patent/JP2900777B2/ja not_active Expired - Lifetime
-
1994
- 1994-12-14 MY MYPI94003349A patent/MY114143A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPH07164307A (ja) | 1995-06-27 |
JP2900777B2 (ja) | 1999-06-02 |
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