MY114143A - Polishing member and wafer polishing apparatus - Google Patents
Polishing member and wafer polishing apparatusInfo
- Publication number
- MY114143A MY114143A MYPI94003349A MYPI19943349A MY114143A MY 114143 A MY114143 A MY 114143A MY PI94003349 A MYPI94003349 A MY PI94003349A MY PI19943349 A MYPI19943349 A MY PI19943349A MY 114143 A MY114143 A MY 114143A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- wafer
- pressure
- polishing member
- constructedby
- Prior art date
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A POLISHING APPARATUS IS PROVIDED WHICH CAN EFFECT SURFACE-BASED POLISHING OF A WAFER WITHOUT CAUSING THEWAFER TO PRODUCE AN UNDULATION OR PERIPHERAL PROTRUSION. A SHEETLIKE POLISHING MEMBER 5 CONSTRUCTEDBY SUPERPOSING A FOAM SHEET 2 CONTAINING MINUTE CLOSED CELLS IN A WEB OF CHLOROPRENE RUBBER AND A VELOUR TYPE NON-WOVEN FABRIC (POLISHING CLOTH 3) IS ATTACHED FAST TO THE SURFACE OF A POLISHING TABLE 1. THE POLISHING MEMBER IS CAPABLE OF POLISHING A GIVEN WAFER WHILE MAINTAINING THE UNIFORMITY OF THICKNESS OF THE WAFER OR AN OXIDE FILM FORMED ON THE SURFACE OF THE WAFER BECAUSE, DURING THE APPLICATION OF PRESSURE BY A PRESSING MEMBER L4, THE POLISHING PRESSURE IS UNIFORMLY DISTRIBUTED THROUGHOUT THE ENTIRE REAR SURFACE OF THE WAFER AND THE POLISHING MEMBER IS BENT IN CONFORMITY WITH THE GLOBAL RISES AND FALLS IN THE WAFER SURFACE.(FIG.2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34294093A JP2900777B2 (en) | 1993-12-14 | 1993-12-14 | Polishing member and wafer polishing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
MY114143A true MY114143A (en) | 2002-08-30 |
Family
ID=18357699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI94003349A MY114143A (en) | 1993-12-14 | 1994-12-14 | Polishing member and wafer polishing apparatus |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2900777B2 (en) |
MY (1) | MY114143A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3329644B2 (en) * | 1995-07-21 | 2002-09-30 | 株式会社東芝 | Polishing pad, polishing apparatus and polishing method |
JPH09166526A (en) * | 1995-12-14 | 1997-06-24 | Nec Corp | Preparation od sample for transmission type electron microscope |
EP0779655A3 (en) * | 1995-12-14 | 1997-07-16 | International Business Machines Corporation | A method of chemically-mechanically polishing an electronic component |
WO2000012262A1 (en) * | 1998-08-28 | 2000-03-09 | Toray Industries, Inc. | Polishing pad |
JP4778130B2 (en) * | 1999-06-17 | 2011-09-21 | スピードファム株式会社 | Edge polishing apparatus and edge polishing method |
JP2005001018A (en) * | 2003-06-09 | 2005-01-06 | Kao Corp | Method of manufacturing substrate |
JP4986099B2 (en) * | 2003-06-09 | 2012-07-25 | 花王株式会社 | Substrate manufacturing method |
JP3754436B2 (en) | 2004-02-23 | 2006-03-15 | 東洋ゴム工業株式会社 | Polishing pad and semiconductor device manufacturing method using the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612734A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Wafer polishing method |
JPS6234689Y2 (en) * | 1981-06-25 | 1987-09-03 | ||
JPS62156365A (en) * | 1985-12-27 | 1987-07-11 | Kanebo Ltd | Production of suede-like sheet material |
JPS63196369A (en) * | 1987-02-07 | 1988-08-15 | Showa Denko Kk | Composition for polishing aluminum magnetic disc |
-
1993
- 1993-12-14 JP JP34294093A patent/JP2900777B2/en not_active Expired - Lifetime
-
1994
- 1994-12-14 MY MYPI94003349A patent/MY114143A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPH07164307A (en) | 1995-06-27 |
JP2900777B2 (en) | 1999-06-02 |
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