MY114143A - Polishing member and wafer polishing apparatus - Google Patents

Polishing member and wafer polishing apparatus

Info

Publication number
MY114143A
MY114143A MYPI94003349A MYPI19943349A MY114143A MY 114143 A MY114143 A MY 114143A MY PI94003349 A MYPI94003349 A MY PI94003349A MY PI19943349 A MYPI19943349 A MY PI19943349A MY 114143 A MY114143 A MY 114143A
Authority
MY
Malaysia
Prior art keywords
polishing
wafer
pressure
polishing member
constructedby
Prior art date
Application number
MYPI94003349A
Inventor
Suzuki Fumio
Tanaka Kouichi
Hashimoto Hiromasa
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY114143A publication Critical patent/MY114143A/en

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A POLISHING APPARATUS IS PROVIDED WHICH CAN EFFECT SURFACE-BASED POLISHING OF A WAFER WITHOUT CAUSING THEWAFER TO PRODUCE AN UNDULATION OR PERIPHERAL PROTRUSION. A SHEETLIKE POLISHING MEMBER 5 CONSTRUCTEDBY SUPERPOSING A FOAM SHEET 2 CONTAINING MINUTE CLOSED CELLS IN A WEB OF CHLOROPRENE RUBBER AND A VELOUR TYPE NON-WOVEN FABRIC (POLISHING CLOTH 3) IS ATTACHED FAST TO THE SURFACE OF A POLISHING TABLE 1. THE POLISHING MEMBER IS CAPABLE OF POLISHING A GIVEN WAFER WHILE MAINTAINING THE UNIFORMITY OF THICKNESS OF THE WAFER OR AN OXIDE FILM FORMED ON THE SURFACE OF THE WAFER BECAUSE, DURING THE APPLICATION OF PRESSURE BY A PRESSING MEMBER L4, THE POLISHING PRESSURE IS UNIFORMLY DISTRIBUTED THROUGHOUT THE ENTIRE REAR SURFACE OF THE WAFER AND THE POLISHING MEMBER IS BENT IN CONFORMITY WITH THE GLOBAL RISES AND FALLS IN THE WAFER SURFACE.(FIG.2)
MYPI94003349A 1993-12-14 1994-12-14 Polishing member and wafer polishing apparatus MY114143A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34294093A JP2900777B2 (en) 1993-12-14 1993-12-14 Polishing member and wafer polishing apparatus

Publications (1)

Publication Number Publication Date
MY114143A true MY114143A (en) 2002-08-30

Family

ID=18357699

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94003349A MY114143A (en) 1993-12-14 1994-12-14 Polishing member and wafer polishing apparatus

Country Status (2)

Country Link
JP (1) JP2900777B2 (en)
MY (1) MY114143A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329644B2 (en) * 1995-07-21 2002-09-30 株式会社東芝 Polishing pad, polishing apparatus and polishing method
JPH09166526A (en) * 1995-12-14 1997-06-24 Nec Corp Preparation od sample for transmission type electron microscope
EP0779655A3 (en) * 1995-12-14 1997-07-16 International Business Machines Corporation A method of chemically-mechanically polishing an electronic component
US6705934B1 (en) 1998-08-28 2004-03-16 Toray Industries, Inc. Polishing pad
JP4778130B2 (en) * 1999-06-17 2011-09-21 スピードファム株式会社 Edge polishing apparatus and edge polishing method
JP4986099B2 (en) * 2003-06-09 2012-07-25 花王株式会社 Substrate manufacturing method
JP2005001018A (en) * 2003-06-09 2005-01-06 Kao Corp Method of manufacturing substrate
JP3754436B2 (en) 2004-02-23 2006-03-15 東洋ゴム工業株式会社 Polishing pad and semiconductor device manufacturing method using the same
WO2023074219A1 (en) * 2021-10-28 2023-05-04 東海カーボン株式会社 Polycrystalline sic molded body and method for manufacturing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612734A (en) * 1979-07-10 1981-02-07 Nec Corp Wafer polishing method
JPS6234689Y2 (en) * 1981-06-25 1987-09-03
JPS62156365A (en) * 1985-12-27 1987-07-11 Kanebo Ltd Production of suede-like sheet material
JPS63196369A (en) * 1987-02-07 1988-08-15 Showa Denko Kk Composition for polishing aluminum magnetic disc

Also Published As

Publication number Publication date
JPH07164307A (en) 1995-06-27
JP2900777B2 (en) 1999-06-02

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