MY108362A - Silver-rich conductor composition for high thermal cycled and agen adhesions. - Google Patents

Silver-rich conductor composition for high thermal cycled and agen adhesions.

Info

Publication number
MY108362A
MY108362A MYPI92001681A MYPI19921681A MY108362A MY 108362 A MY108362 A MY 108362A MY PI92001681 A MYPI92001681 A MY PI92001681A MY PI19921681 A MYPI19921681 A MY PI19921681A MY 108362 A MY108362 A MY 108362A
Authority
MY
Malaysia
Prior art keywords
agen
adhesions
silver
high thermal
conductor composition
Prior art date
Application number
MYPI92001681A
Other languages
English (en)
Inventor
Henry La Branche Marc
E Taylor Barry
Hara Hiroyuki
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of MY108362A publication Critical patent/MY108362A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5183—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H10W70/098—
    • H10W70/666—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
MYPI92001681A 1991-10-10 1992-09-21 Silver-rich conductor composition for high thermal cycled and agen adhesions. MY108362A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/774,788 US5250229A (en) 1991-10-10 1991-10-10 Silver-rich conductor compositions for high thermal cycled and aged adhesion

Publications (1)

Publication Number Publication Date
MY108362A true MY108362A (en) 1996-09-30

Family

ID=25102309

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92001681A MY108362A (en) 1991-10-10 1992-09-21 Silver-rich conductor composition for high thermal cycled and agen adhesions.

Country Status (9)

Country Link
US (1) US5250229A (enFirst)
EP (1) EP0607255B1 (enFirst)
JP (1) JP2793912B2 (enFirst)
KR (2) KR970008549B1 (enFirst)
CN (1) CN1071535A (enFirst)
DE (1) DE69216634T2 (enFirst)
MY (1) MY108362A (enFirst)
TW (1) TW215908B (enFirst)
WO (1) WO1993007736A1 (enFirst)

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US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
AU6438398A (en) 1997-02-24 1998-09-09 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP3397125B2 (ja) * 1998-03-12 2003-04-14 株式会社村田製作所 電子部品
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP3494115B2 (ja) * 2000-03-30 2004-02-03 株式会社村田製作所 導電性ペーストおよびこれを用いた積層セラミック電子部品
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
KR20040077655A (ko) 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US6878184B1 (en) 2002-08-09 2005-04-12 Kovio, Inc. Nanoparticle synthesis and the formation of inks therefrom
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
US7078276B1 (en) 2003-01-08 2006-07-18 Kovio, Inc. Nanoparticles and method for making the same
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
KR100875625B1 (ko) * 2005-11-14 2008-12-24 티디케이가부시기가이샤 복합 배선 기판 및 그 제조 방법
US7560052B2 (en) * 2007-03-30 2009-07-14 Lexmark International, Inc. Silver ink compositions containing a cationic styrene/acrylate copolymer additive for inkjet printing
US8511535B1 (en) * 2010-04-19 2013-08-20 Aegis Technology Inc. Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere
KR101343891B1 (ko) 2010-08-17 2013-12-20 (주)바이오니아 써멀 사이클러용 저 비열성 복합 소재
US9441117B2 (en) 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
JP7032042B2 (ja) * 2015-12-22 2022-03-08 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー 厚膜ペーストを用いて改善された直接接合銅（ｄｉｒｅｃｔ－ｂｏｎｄｅｄ ｃｏｐｐｅｒ）基板
CN108191449B (zh) * 2018-01-03 2021-04-27 上海富乐华半导体科技有限公司 一种铜-氧化铝陶瓷基板及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US553421A (en) * 1896-01-21 Corn-harvester
GB1346851A (en) * 1971-05-21 1974-02-13 Matsushita Electric Industrial Co Ltd Varistors
US3896054A (en) * 1972-03-02 1975-07-22 Du Pont High adhesion metallizations
US3838071A (en) * 1972-06-30 1974-09-24 Du Pont High adhesion silver-based metallizations
US4001146A (en) * 1975-02-26 1977-01-04 E. I. Du Pont De Nemours And Company Novel silver compositions
US4094061A (en) * 1975-11-12 1978-06-13 Westinghouse Electric Corp. Method of producing homogeneous sintered ZnO non-linear resistors
US4090009A (en) * 1977-03-11 1978-05-16 E. I. Du Pont De Nemours And Company Novel silver compositions
US4187201A (en) * 1978-03-15 1980-02-05 Electro Materials Corporation Of America Thick film conductors
US4318830A (en) * 1979-01-15 1982-03-09 E. I. Du Pont De Nemours And Company Thick film conductors having improved aged adhesion
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
US4414143A (en) * 1981-05-06 1983-11-08 E. I. Du Pont De Nemours & Co. Conductor compositions
US4381945A (en) * 1981-08-03 1983-05-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions
DE3470975D1 (en) * 1983-12-22 1988-06-09 Bbc Brown Boveri & Cie Zinc oxide varistor
US4714570A (en) * 1984-07-17 1987-12-22 Matsushita Electric Industrial Co., Ltd. Conductor paste and method of manufacturing a multilayered ceramic body using the paste
JPH06104873B2 (ja) * 1986-07-08 1994-12-21 富士電機株式会社 銀―金属酸化物系接点用材料及びその製造方法

Also Published As

Publication number Publication date
KR940703066A (ko) 1994-09-17
EP0607255B1 (en) 1997-01-08
JPH07500450A (ja) 1995-01-12
DE69216634T2 (de) 1997-04-24
CN1071535A (zh) 1993-04-28
DE69216634D1 (de) 1997-02-20
EP0607255A1 (en) 1994-07-27
KR970008549B1 (ko) 1997-05-27
TW215908B (enFirst) 1993-11-11
JP2793912B2 (ja) 1998-09-03
WO1993007736A1 (en) 1993-04-15
US5250229A (en) 1993-10-05

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