MY102308A - Hybrid printed circuit structures - Google Patents
Hybrid printed circuit structuresInfo
- Publication number
- MY102308A MY102308A MYPI87000928A MYPI19870928A MY102308A MY 102308 A MY102308 A MY 102308A MY PI87000928 A MYPI87000928 A MY PI87000928A MY PI19870928 A MYPI19870928 A MY PI19870928A MY 102308 A MY102308 A MY 102308A
- Authority
- MY
- Malaysia
- Prior art keywords
- printed circuit
- circuit structures
- hybrid printed
- wiring substrate
- hybrid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H10W70/681—
-
- H10W72/931—
-
- H10W90/734—
-
- H10W90/756—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105213U JPH0735389Y2 (ja) | 1986-07-09 | 1986-07-09 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY102308A true MY102308A (en) | 1992-05-28 |
Family
ID=14401389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI87000928A MY102308A (en) | 1986-07-09 | 1987-07-01 | Hybrid printed circuit structures |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH0735389Y2 (index.php) |
| KR (1) | KR920005952Y1 (index.php) |
| MY (1) | MY102308A (index.php) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222914A (ja) * | 2001-01-26 | 2002-08-09 | Sony Corp | 半導体装置及びその製造方法 |
| JP4489137B1 (ja) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | 回路モジュール及び電子機器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5272468A (en) * | 1975-12-15 | 1977-06-16 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
| JPS629728Y2 (index.php) * | 1981-05-07 | 1987-03-06 | ||
| JPS58150862U (ja) * | 1982-04-01 | 1983-10-08 | パイオニア株式会社 | チツプ部品取付装置 |
| JPS60114844U (ja) * | 1984-01-10 | 1985-08-03 | 三菱電機株式会社 | サ−マルヘツド |
| JPS6181140U (index.php) * | 1984-11-01 | 1986-05-29 |
-
1986
- 1986-07-09 JP JP1986105213U patent/JPH0735389Y2/ja not_active Expired - Lifetime
-
1987
- 1987-05-13 KR KR2019870007249U patent/KR920005952Y1/ko not_active Expired
- 1987-07-01 MY MYPI87000928A patent/MY102308A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735389Y2 (ja) | 1995-08-09 |
| JPS6310550U (index.php) | 1988-01-23 |
| KR920005952Y1 (ko) | 1992-08-27 |
| KR880003791U (ko) | 1988-04-14 |
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