MXPA04004065A - Polvo curable por rayos ultravioleta adecuado para utilizarse como fotoproteccion. - Google Patents

Polvo curable por rayos ultravioleta adecuado para utilizarse como fotoproteccion.

Info

Publication number
MXPA04004065A
MXPA04004065A MXPA04004065A MXPA04004065A MXPA04004065A MX PA04004065 A MXPA04004065 A MX PA04004065A MX PA04004065 A MXPA04004065 A MX PA04004065A MX PA04004065 A MXPA04004065 A MX PA04004065A MX PA04004065 A MXPA04004065 A MX PA04004065A
Authority
MX
Mexico
Prior art keywords
photoresist
curable powder
powder suitable
photoresist composition
degree
Prior art date
Application number
MXPA04004065A
Other languages
English (en)
Inventor
Steven Robert Shchmid
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of MXPA04004065A publication Critical patent/MXPA04004065A/es

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Abstract

La invencion se refiere a una composicion de fotoproteccion en polvo, curable por radiacion, que comprende los componentes: A. un polimero, B. un compuesto reactivo que tiene un compuesto con grupos insaturados y C. un fotoiniciador de radicales libres, en donde la composicion de fotoproteccion en polvo es soluble en un revelador y en donde la composicion de foto proteccion en polvo tiene una Tg entre 40? y 120?C.
MXPA04004065A 2001-10-31 2002-10-30 Polvo curable por rayos ultravioleta adecuado para utilizarse como fotoproteccion. MXPA04004065A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33080601P 2001-10-31 2001-10-31
US35579402P 2002-02-12 2002-02-12
PCT/NL2002/000691 WO2003038527A1 (en) 2001-10-31 2002-10-30 Uv curable powder suitable for use as photoresist

Publications (1)

Publication Number Publication Date
MXPA04004065A true MXPA04004065A (es) 2004-09-06

Family

ID=26987456

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA04004065A MXPA04004065A (es) 2001-10-31 2002-10-30 Polvo curable por rayos ultravioleta adecuado para utilizarse como fotoproteccion.

Country Status (8)

Country Link
US (1) US20030170568A1 (es)
EP (1) EP1440348A1 (es)
JP (1) JP2005507510A (es)
KR (1) KR20050042008A (es)
CN (1) CN100351702C (es)
MX (1) MXPA04004065A (es)
TW (1) TW200302954A (es)
WO (1) WO2003038527A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175321A (ja) * 2003-12-12 2005-06-30 Hitachi Ltd エッチングレジスト前駆体組成物及びそれを用いた配線基板の製造方法、並びに配線基板
US7985524B2 (en) 2004-01-28 2011-07-26 Xerox Corporation Emulsion aggregation process for forming curable powder coating compositions, curable powder coating compositions and method for using the same
EP1581034A1 (en) * 2004-03-25 2005-09-28 DSM IP Assets B.V. Method of forming solder mask
WO2005094147A1 (en) * 2004-03-25 2005-10-06 Dsm Ip Assets B.V. A process of forming a solder mask
EP1783548B1 (en) * 2005-11-08 2017-03-08 Rohm and Haas Electronic Materials LLC Method of forming a patterned layer on a substrate
JP5075450B2 (ja) * 2007-03-30 2012-11-21 富士フイルム株式会社 平版印刷版原版
JP5871326B2 (ja) * 2009-12-02 2016-03-01 ブルー キューブ アイピー エルエルシー コーティング組成物
EP2448380A1 (en) * 2010-10-26 2012-05-02 ATOTECH Deutschland GmbH Composite build-up material for embedding of circuitry
JP5921920B2 (ja) * 2012-03-15 2016-05-24 第一工業製薬株式会社 レーザー加工用レジスト樹脂組成物
DE102012104830A1 (de) 2012-06-04 2013-12-05 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
CN102819056A (zh) * 2012-07-30 2012-12-12 京东方科技集团股份有限公司 一种彩色滤光片及其制作方法、液晶面板和液晶显示装置
CN104559474A (zh) * 2015-01-30 2015-04-29 河源诚展科技有限公司 一种五金蚀刻用保护油墨
JP6602384B2 (ja) * 2015-08-31 2019-11-06 富士フイルム株式会社 インクジェット記録用インク組成物及びその製造方法、並びにインクジェット記録方法
CN107239002B (zh) * 2017-07-07 2019-12-06 深圳市华星光电技术有限公司 Uv固化粉末光阻组合物及其制作方法、彩膜基板的制作方法
EP3547028A1 (fr) * 2018-03-28 2019-10-02 Mimotec S.A. Methode de preparation de resine photosensible seche et resine photosensible obtenue par la methode
JP7257909B2 (ja) * 2019-07-25 2023-04-14 株式会社トクヤマ 窒化アルミニウム粉末の製造方法
WO2021108775A1 (en) * 2019-11-27 2021-06-03 Hsio Technologies, Llc Pcb fabrication with dielectric powder or suspension

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514165A (en) * 1982-07-22 1985-04-30 Bussey Harry Jun Apparatus for making billowed filling elements for packaging
US4614165A (en) * 1985-11-25 1986-09-30 Xerox Corporation Extended life development system
US5015555A (en) * 1986-05-28 1991-05-14 E. I. Du Pont De Nemours And Company Photopolymerizable composition containing heterocyclic triazole
JPS63246890A (ja) * 1987-04-02 1988-10-13 関西ペイント株式会社 プリント回路の形成方法
US5521053A (en) * 1988-07-30 1996-05-28 Nippon Petrochemicals Co., Ltd. Photocurable resin composition for the preparation of a printed wiring board
US5368884A (en) * 1991-11-06 1994-11-29 Nippon Paint Co., Ltd. Method of forming solder mask
US5922473A (en) * 1996-12-26 1999-07-13 Morton International, Inc. Dual thermal and ultraviolet curable powder coatings
US6194525B1 (en) * 1998-05-11 2001-02-27 Ferro Corporation Powder coating composition comprising unsaturated polyesters and uses thereof

Also Published As

Publication number Publication date
CN100351702C (zh) 2007-11-28
US20030170568A1 (en) 2003-09-11
TW200302954A (en) 2003-08-16
EP1440348A1 (en) 2004-07-28
JP2005507510A (ja) 2005-03-17
WO2003038527A1 (en) 2003-05-08
KR20050042008A (ko) 2005-05-04
CN1608231A (zh) 2005-04-20

Similar Documents

Publication Publication Date Title
MXPA04004065A (es) Polvo curable por rayos ultravioleta adecuado para utilizarse como fotoproteccion.
DE3379158D1 (en) Photopolymerisable compositions
AU2001232483A1 (en) Photocurable resin composition and optical parts
ATE356533T1 (de) Uv-härtbare silberzusammensetzung und zugehöriges verfahren
GB2331101A (en) Radiation-curable,cyanoacrylate-containing compositions
ATE333667T1 (de) Photoinitiatorsystem mit acylphosphinoxidinitiatoren
AU2001274078A1 (en) Prepolymeric (meth)acrylates with polycyclic or aromatic segments
WO2003089991A3 (en) Photocurable compositions containing reactive particles
AU2001236948A1 (en) No voc radiation curable resin compositions
SG105450A1 (en) Allylated amide compounds and die attach adhesives prepared therefrom
DE878472T1 (de) Reaktive, durch Strahlung oder Wärme kationisch härtbare Epoxidmonomere und diese enthaltende Zusammensetzungen
PL362552A1 (en) Aqueous dispersion and the use thereof in the production of coating agents, adhesives and sealing agents that can cured by heat or by actinic radiation
CA2354586A1 (en) Acylphosphine oxide photocure coated abrasive
AU2002225369A1 (en) Photobase generators, curable compositions prepared by using the same and process of curing
EP0394797A3 (de) Dentalmaterial (II)
JPS52129790A (en) Ultraviolet/curing composition
BR0313329A (pt) Composição de revestimento curável com radiação ultravioleta
BR0111504A (pt) Composições dilatáveis em água
AU2003221053A1 (en) Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
MXPA03010536A (es) Composicion de resina insaturada curable.
DE60135030D1 (es)
EP0394798A3 (de) Dentalmaterial (I)
AU4874896A (en) Modified acryl copolymer
CA2391355A1 (en) Photoinitiator system with titanocene initiators
DE69820284D1 (de) Release-coating zusammensetzungen enthaltend ein acrylat-funktionelles siliconharz und einen vinylether

Legal Events

Date Code Title Description
FA Abandonment or withdrawal