MX2022008700A - Placa fria para sistemas electronicos de potencia. - Google Patents
Placa fria para sistemas electronicos de potencia.Info
- Publication number
- MX2022008700A MX2022008700A MX2022008700A MX2022008700A MX2022008700A MX 2022008700 A MX2022008700 A MX 2022008700A MX 2022008700 A MX2022008700 A MX 2022008700A MX 2022008700 A MX2022008700 A MX 2022008700A MX 2022008700 A MX2022008700 A MX 2022008700A
- Authority
- MX
- Mexico
- Prior art keywords
- cold plate
- power electronic
- electronic systems
- pcb
- magnetics
- Prior art date
Links
- 230000005291 magnetic effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
- B60L53/20—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by converters located in the vehicle
- B60L53/22—Constructional details or arrangements of charging converters specially adapted for charging electric vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2210/00—Converter types
- B60L2210/10—DC to DC converters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Dc-Dc Converters (AREA)
Abstract
Se describe una unidad de gestión de energía (EMU). La EMU incluye: una placa fría emparedada entre una primera placa de circuitos impresos (PCB) y una segunda PCB, comprendiendo la placa fría uno o más componentes magnéticos; donde la placa fría se configura para enfriar ambas de la primera PCB y la segunda PCB.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202163222802P | 2021-07-16 | 2021-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022008700A true MX2022008700A (es) | 2023-01-17 |
Family
ID=82403356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022008700A MX2022008700A (es) | 2021-07-16 | 2022-07-13 | Placa fria para sistemas electronicos de potencia. |
Country Status (7)
Country | Link |
---|---|
US (2) | US11659684B2 (es) |
EP (1) | EP4120811A3 (es) |
JP (1) | JP2023014065A (es) |
KR (1) | KR20230013004A (es) |
CN (1) | CN115701204A (es) |
CA (1) | CA3167766A1 (es) |
MX (1) | MX2022008700A (es) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7361844B2 (en) * | 2002-11-25 | 2008-04-22 | Vlt, Inc. | Power converter package and thermal management |
JP5504899B2 (ja) * | 2010-01-12 | 2014-05-28 | 株式会社デンソー | 電磁継電器 |
JP2011198866A (ja) * | 2010-03-18 | 2011-10-06 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
JP5563383B2 (ja) * | 2010-06-21 | 2014-07-30 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
WO2012120594A1 (ja) * | 2011-03-04 | 2012-09-13 | 日立オートモティブシステムズ株式会社 | 半導体モジュール、および半導体モジュールの製造方法 |
JP5504219B2 (ja) * | 2011-07-27 | 2014-05-28 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
CN103023279B (zh) * | 2011-09-27 | 2015-05-13 | 株式会社京浜 | 半导体控制装置 |
US9066453B2 (en) * | 2012-03-06 | 2015-06-23 | Mission Motor Company | Power electronic system and method of assembly |
US9362040B2 (en) * | 2014-05-15 | 2016-06-07 | Lear Corporation | Coldplate with integrated electrical components for cooling thereof |
US10135355B2 (en) * | 2015-08-31 | 2018-11-20 | Faraday&Future Inc. | Inverter DC bus bar assembly |
CN106655807B (zh) * | 2015-10-29 | 2019-02-26 | 台达电子企业管理(上海)有限公司 | 电源转换装置 |
US10278305B2 (en) * | 2017-03-24 | 2019-04-30 | Deere & Company | Electronic assembly with phase-change cooling of a semiconductor device |
US11458856B2 (en) * | 2019-03-08 | 2022-10-04 | Auto Motive Power, Inc. | Combined BMS, charger, and DC-DC in electric vehicles |
US10912231B1 (en) * | 2020-01-15 | 2021-02-02 | Ford Global Technologies, Llc | Automotive integrated power module and capacitor |
-
2022
- 2022-07-10 EP EP22183992.1A patent/EP4120811A3/en not_active Withdrawn
- 2022-07-13 MX MX2022008700A patent/MX2022008700A/es unknown
- 2022-07-14 CA CA3167766A patent/CA3167766A1/en active Pending
- 2022-07-14 CN CN202210830600.5A patent/CN115701204A/zh active Pending
- 2022-07-14 US US17/864,865 patent/US11659684B2/en active Active
- 2022-07-15 JP JP2022113765A patent/JP2023014065A/ja active Pending
- 2022-07-15 KR KR1020220087660A patent/KR20230013004A/ko not_active Application Discontinuation
-
2023
- 2023-05-05 US US18/143,973 patent/US20230309261A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20230013004A (ko) | 2023-01-26 |
US20230309261A1 (en) | 2023-09-28 |
EP4120811A2 (en) | 2023-01-18 |
CN115701204A (zh) | 2023-02-07 |
US20230019538A1 (en) | 2023-01-19 |
EP4120811A3 (en) | 2023-04-12 |
CA3167766A1 (en) | 2023-01-16 |
JP2023014065A (ja) | 2023-01-26 |
US11659684B2 (en) | 2023-05-23 |
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