MX2019014278A - Métodos y composiciones para deposición electroquímica de capas ricas en metal en soluciones acuosas. - Google Patents

Métodos y composiciones para deposición electroquímica de capas ricas en metal en soluciones acuosas.

Info

Publication number
MX2019014278A
MX2019014278A MX2019014278A MX2019014278A MX2019014278A MX 2019014278 A MX2019014278 A MX 2019014278A MX 2019014278 A MX2019014278 A MX 2019014278A MX 2019014278 A MX2019014278 A MX 2019014278A MX 2019014278 A MX2019014278 A MX 2019014278A
Authority
MX
Mexico
Prior art keywords
compositions
methods
aqueous solutions
electrochemical deposition
rich layers
Prior art date
Application number
MX2019014278A
Other languages
English (en)
Inventor
Hunaid B Nulwala
John D Watkins
Original Assignee
Lumishield Tech Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumishield Tech Incorporated filed Critical Lumishield Tech Incorporated
Publication of MX2019014278A publication Critical patent/MX2019014278A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/42—Electroplating: Baths therefor from solutions of light metals
    • C25D3/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C25D9/10—Electrolytic coating other than with metals with inorganic materials by cathodic processes on iron or steel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C25D9/12—Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cell Electrode Carriers And Collectors (AREA)

Abstract

Se proporcionan métodos y composiciones para electrodepositar capas de metales reactivos mezclados al combinar complejos de metal reactives con agentes de extracción de electrones. Se puede utilizar modificación de la relación de un complejo de metal reactivo con el otro y variación de la densidad de corriente para variar la morfología de la capa de metal sobre el sustrato.
MX2019014278A 2017-06-01 2018-06-01 Métodos y composiciones para deposición electroquímica de capas ricas en metal en soluciones acuosas. MX2019014278A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762513654P 2017-06-01 2017-06-01
PCT/US2018/035577 WO2018222977A1 (en) 2017-06-01 2018-06-01 Methods and compositions for electrochemical deposition of metal rich layers in aqueous solutions

Publications (1)

Publication Number Publication Date
MX2019014278A true MX2019014278A (es) 2021-02-09

Family

ID=62705731

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019014278A MX2019014278A (es) 2017-06-01 2018-06-01 Métodos y composiciones para deposición electroquímica de capas ricas en metal en soluciones acuosas.

Country Status (11)

Country Link
US (1) US11111591B2 (es)
EP (1) EP3631052A1 (es)
JP (1) JP7179358B2 (es)
KR (1) KR20200021950A (es)
CN (1) CN111108236A (es)
AU (1) AU2018278343B2 (es)
BR (1) BR112019025401A2 (es)
CA (2) CA3065510A1 (es)
IL (1) IL271010A (es)
MX (1) MX2019014278A (es)
WO (1) WO2018222977A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220127744A1 (en) * 2019-02-01 2022-04-28 Lumishield Technologies Incorporated Methods and Compositions for Improved Adherence of Organic Coatings to Materials
US11661665B2 (en) * 2020-04-30 2023-05-30 The Boeing Company Aluminum and aluminum alloy electroplated coatings

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4601958A (en) 1984-09-26 1986-07-22 Allied Corporation Plated parts and their production
CN1788112B (zh) * 2003-05-12 2012-01-11 阿科玛股份有限公司 高纯度的电解磺酸溶液
EP1518945A1 (de) * 2003-09-27 2005-03-30 Aluminal Oberflächtentechnik GmbH & Co. KG Elektrolyt für die galvanische Abscheidung von Aluminium-Magnesium-Legierungen
JP4402991B2 (ja) * 2004-03-18 2010-01-20 日本パーカライジング株式会社 金属表面処理用組成物、金属表面処理用処理液、金属表面処理方法および金属材料
JP4276689B2 (ja) * 2006-12-20 2009-06-10 日本ペイント株式会社 カチオン電着塗装方法、及びカチオン電着塗装された金属基材
JP5166912B2 (ja) * 2008-02-27 2013-03-21 日本パーカライジング株式会社 金属材料およびその製造方法
US8747599B2 (en) * 2008-05-29 2014-06-10 Chidella Krishna Sastry Process for making self-patterning substrates and the product thereof
US20120018053A1 (en) * 2008-12-05 2012-01-26 Yuken Industry Co., Ltd. Composition for chemical conversion treatment, and process for producing a member having an anticorrosive film formed from the composition
US20120055612A1 (en) 2010-09-02 2012-03-08 International Business Machines Corporation Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures
EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP5943370B2 (ja) 2011-07-19 2016-07-05 国立大学法人京都大学 光沢アルミニウム材料の製造方法
US20170306517A1 (en) 2014-10-10 2017-10-26 Solvay Specialty Polymers Italy S.P.A. Compositions for electrodeposition of metals, electrodeposition process and product obtained
CA3009779C (en) 2016-02-16 2021-03-23 Lumishield Technologies Incorporated Electrochemical deposition of elements in aqueous media
JP6709328B2 (ja) * 2017-03-28 2020-06-10 富士フイルム株式会社 Ｉｉｉ−ｖ族半導体ナノ粒子の製造方法、ｉｉｉ−ｖ族半導体量子ドットの製造方法、及びフロー式反応システム

Also Published As

Publication number Publication date
AU2018278343B2 (en) 2024-05-30
CA3221841A1 (en) 2018-12-06
BR112019025401A2 (pt) 2020-06-23
US20180347058A1 (en) 2018-12-06
WO2018222977A1 (en) 2018-12-06
JP2020522615A (ja) 2020-07-30
AU2018278343A1 (en) 2019-12-19
CA3065510A1 (en) 2018-12-06
US11111591B2 (en) 2021-09-07
EP3631052A1 (en) 2020-04-08
IL271010A (en) 2020-01-30
CN111108236A (zh) 2020-05-05
JP7179358B2 (ja) 2022-11-29
KR20200021950A (ko) 2020-03-02

Similar Documents

Publication Publication Date Title
MX2015013213A (es) "composiciones de pretratamiento y metodos para revestir un electrodo de bateria".
MX2019014278A (es) Métodos y composiciones para deposición electroquímica de capas ricas en metal en soluciones acuosas.
WO2012121067A8 (ja) ナノギャップ長を有する電極構造の作製方法並びにそれにより得られるナノギャップ長を有する電極構造及びナノデバイス
MY170543A (en) Method for manufacturing hot-dip zn alloy-plated steel sheet
TW200710287A (en) Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
MY174148A (en) Method for producing positive electrode active material layer for lithium ion battery, and positive electrode active material layer for lithium ion battery
IN2012DE00445A (es)
MX2018000136A (es) Pelicula de revestimiento de multiples capas y articulo revestido.
WO2015156894A3 (en) Carbon nanotube-coated substrates and methods of making the same
MX2015013956A (es) Celda electrolitica para la extraccion electrolitica de metales.
JP2014221941A5 (es)
GB2526951A9 (en) Improving metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
CN104152944A (zh) 酸性蚀刻液电解多组分添加剂
CA2899333C (en) Coated iron electrode and method of making same
IN2015DN02619A (es)
SG11201804805YA (en) Gypsum panel and method for producing gypsum panel
WO2019060503A3 (en) Manufacturing enhanced graphite metallic bipolar plate materials
EP2886678A8 (en) Method for the deposition of films of mixed oxides on composite material substrates
MX2018003118A (es) Punzon y su metodo de manufactura.
EP4269488A3 (en) Cerium citrate, method of making and corrosion inhibitor comprising cerium citrate
MY162728A (en) Plating pretreatment solution and method for producing aluminum substrate for hard disk devices using same
WO2020096374A3 (ko) 브롬 이온을 포함한 구리 전해도금용 전해질 용액 및 이를 이용한 구리 전해도금 방법
WO2019060715A3 (en) Dense electrode for solid state battery
赵斌 et al. Deposition of Cu seed layer film by supercritical fluid deposition for advanced interconnects
CN204722374U (zh) 拉链存放u型槽