MX2019002116A - Modulo semiconductor de potencia, circuito amortiguador y aparato de alimentaion mediante calentamiento por induccion. - Google Patents

Modulo semiconductor de potencia, circuito amortiguador y aparato de alimentaion mediante calentamiento por induccion.

Info

Publication number
MX2019002116A
MX2019002116A MX2019002116A MX2019002116A MX2019002116A MX 2019002116 A MX2019002116 A MX 2019002116A MX 2019002116 A MX2019002116 A MX 2019002116A MX 2019002116 A MX2019002116 A MX 2019002116A MX 2019002116 A MX2019002116 A MX 2019002116A
Authority
MX
Mexico
Prior art keywords
power semiconductor
semiconductor module
casing
induction heating
supply apparatus
Prior art date
Application number
MX2019002116A
Other languages
English (en)
Inventor
Kanai Takahiko
Yoshida Haruki
Sugimoto Masato
Original Assignee
Neturen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016161885A external-priority patent/JP6397861B2/ja
Priority claimed from JP2016190345A external-priority patent/JP6360865B2/ja
Application filed by Neturen Co Ltd filed Critical Neturen Co Ltd
Publication of MX2019002116A publication Critical patent/MX2019002116A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/34—Snubber circuits
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/34—Snubber circuits
    • H02M1/348—Passive dissipative snubbers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/04—Sources of current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Inverter Devices (AREA)

Abstract

Se proporcionan un módulo semiconductor de potencia, un circuito amortiguador para el módulo semiconductor de potencia y un aparato de alimentación mediante calentamiento por inducción que tiene el módulo semiconductor de potencia. El módulo semiconductor de potencia incluye un dispositivo semiconductor de potencia configurado para realizar una operación de conmutación, una carcasa dentro de la cual se proporciona el dispositivo semiconductor de potencia, una placa de circuito de control dispuesta encima de la superficie superior de la carcasa, una terminal de control para el dispositivo semiconductor de potencia se proporciona en la superficie superior de la carcasa y está conectada a la placa de circuito de control, y una placa de protección dispuesta entre la placa de circuito de control y la superficie superior de la carcasa para cubrir la superficie superior de la carcasa y para cubrir al menos una superficie lateral de la carcasa.
MX2019002116A 2016-08-22 2017-08-16 Modulo semiconductor de potencia, circuito amortiguador y aparato de alimentaion mediante calentamiento por induccion. MX2019002116A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016161885A JP6397861B2 (ja) 2016-08-22 2016-08-22 パワー半導体モジュール及び誘導加熱用電源装置
JP2016190345A JP6360865B2 (ja) 2016-09-28 2016-09-28 スナバ回路及びパワー半導体モジュール並びに誘導加熱用電源装置
PCT/JP2017/029470 WO2018037984A1 (en) 2016-08-22 2017-08-16 Power semiconductor module, snubber circuit, and induction heating power supply apparatus

Publications (1)

Publication Number Publication Date
MX2019002116A true MX2019002116A (es) 2019-07-08

Family

ID=59772674

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019002116A MX2019002116A (es) 2016-08-22 2017-08-16 Modulo semiconductor de potencia, circuito amortiguador y aparato de alimentaion mediante calentamiento por induccion.

Country Status (7)

Country Link
US (1) US20190206810A1 (es)
EP (1) EP3501245A1 (es)
KR (1) KR20190040194A (es)
CN (2) CN112600390A (es)
MX (1) MX2019002116A (es)
TW (1) TWI658686B (es)
WO (1) WO2018037984A1 (es)

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FR3076175B1 (fr) * 2017-12-22 2020-01-10 Valeo Siemens Eautomotive France Sas Equipement electrique a paroi deportee
DE112018007125T5 (de) * 2018-02-20 2020-11-05 Mitsubishi Electric Corporation Leistungshalbleitermodul und leistungswandler mit demselben
KR102554431B1 (ko) 2018-09-05 2023-07-13 삼성전자주식회사 반도체 장치 및 반도체 장치 제조 방법
JP7147598B2 (ja) * 2019-01-29 2022-10-05 株式会社デンソー 電源装置
JP7215194B2 (ja) * 2019-01-30 2023-01-31 富士電機株式会社 スナバ装置および電力変換装置
JP6648850B1 (ja) * 2019-03-13 2020-02-14 富士電機株式会社 スナバモジュール、スナバ装置および電力変換装置
US20220271647A1 (en) * 2019-11-06 2022-08-25 Mitsubishi Electric Corporation Direct current power supply device and air conditioner
KR20220109416A (ko) * 2019-12-02 2022-08-04 고에키자이단호진 후쿠오카켄 산교·가가쿠기쥬츠신코자이단 증착 장치, 승화 정제 장치, 유기 전자 디바이스의 생산 방법 및 승화 정제 방법
US11751353B2 (en) * 2020-07-24 2023-09-05 Texas Instruments Incorporated Power conversion module and method of forming the same
EP3961703A1 (de) * 2020-08-25 2022-03-02 Siemens Aktiengesellschaft Halbleitermodul und halbleiteranordnung

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JP3366192B2 (ja) * 1995-09-08 2003-01-14 株式会社日立製作所 配線基板及びそれを用いた電力変換装置
JP4218193B2 (ja) * 2000-08-24 2009-02-04 三菱電機株式会社 パワーモジュール
JP4130525B2 (ja) * 2000-09-18 2008-08-06 株式会社東芝 コンデンサの実装構造
JP3801952B2 (ja) * 2002-06-14 2006-07-26 三菱電機株式会社 パワーモジュール
JP2004135444A (ja) 2002-10-11 2004-04-30 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置のスタック構造
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Also Published As

Publication number Publication date
KR20190040194A (ko) 2019-04-17
CN109644575A (zh) 2019-04-16
US20190206810A1 (en) 2019-07-04
EP3501245A1 (en) 2019-06-26
TWI658686B (zh) 2019-05-01
CN112600390A (zh) 2021-04-02
WO2018037984A1 (en) 2018-03-01
TW201824727A (zh) 2018-07-01

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